Pull thermal updates from Daniel Lezcano:
- Remove duplicate error message for the amlogic driver (Tang Bin)
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of a
couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well as
the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of cleanups
and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
* tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Lock the thermal zone while looping over instances
thermal/core/power_allocator: Update once cooling devices when temp is low
thermal/core/power_allocator: Maintain the device statistics from going stale
thermal/core: Create a helper __thermal_cdev_update() without a lock
dt-bindings: thermal: tsens: Document ipq8064 bindings
thermal/drivers/tsens: Add support for ipq8064-tsens
thermal/drivers/tsens: Drop unused define for msm8960
thermal/drivers/tsens: Replace custom 8960 apis with generic apis
thermal/drivers/tsens: Fix bug in sensor enable for msm8960
thermal/drivers/tsens: Use init_common for msm8960
thermal/drivers/tsens: Add VER_0 tsens version
thermal/drivers/tsens: Convert msm8960 to reg_field
thermal/drivers/tsens: Don't hardcode sensor slope
Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
thermal/core: Remove thermal_notify_framework
iwlwifi: mvm: tt: Replace thermal_notify_framework
dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
...
projects / linux-2.6-microblaze.git / commitdiff