Expose ti-soc-thermal thermal sensors as HWMON devices.
# sensors
cpu_thermal-virtual-0
Adapter: Virtual device
temp1: +54.2 C (crit = +105.0 C)
dspeve_thermal-virtual-0
Adapter: Virtual device
temp1: +51.4 C (crit = +105.0 C)
gpu_thermal-virtual-0
Adapter: Virtual device
temp1: +54.2 C (crit = +105.0 C)
iva_thermal-virtual-0
Adapter: Virtual device
temp1: +54.6 C (crit = +105.0 C)
core_thermal-virtual-0
Adapter: Virtual device
temp1: +52.6 C (crit = +105.0 C)
Similar to imx_sc_thermal
d2bc4dd91da6095a769fdc9bc519d3be7ad5f97a.
No need to take care of thermal_remove_hwmon_sysfs() since
devm_thermal_add_hwmon_sysfs() (a wrapper around devres) is
used. See
c7fc403e40b0ea18976a59e968c23439a80809e8.
Signed-off-by: Romain Naour <romain.naour@smile.fr>
Link: https://lore.kernel.org/r/20220218104725.2718904-1-romain.naour@smile.fr
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
#include "ti-thermal.h"
#include "ti-bandgap.h"
+#include "../thermal_hwmon.h"
/* common data structures */
struct ti_thermal_data {
ti_bandgap_set_sensor_data(bgp, id, data);
ti_bandgap_write_update_interval(bgp, data->sensor_id, interval);
+ if (devm_thermal_add_hwmon_sysfs(data->ti_thermal))
+ dev_warn(bgp->dev, "failed to add hwmon sysfs attributes\n");
+
return 0;
}