1 # SPDX-License-Identifier: GPL-2.0-only
3 # Generic thermal drivers configuration
9 Thermal drivers offer a generic mechanism for
10 thermal management. Usually it's made up of one or more thermal
11 zones and cooling devices.
12 Each thermal zone contains its own temperature, trip points,
14 All platforms with ACPI or Open Firmware thermal support can use
16 If you want this support, you should say Y here.
20 config THERMAL_NETLINK
21 bool "Thermal netlink management"
24 The thermal framework has a netlink interface to do thermal
25 zones discovery, temperature readings and events such as
26 trip point crossed, cooling device update or governor
27 change. It is recommended to enable the feature.
29 config THERMAL_STATISTICS
30 bool "Thermal state transition statistics"
32 Export thermal state transition statistics information through sysfs.
36 config THERMAL_DEBUGFS
37 bool "Thermal subsystem debug support"
40 Say Y to allow the thermal subsystem to collect diagnostic
41 information that can be accessed via debugfs.
43 config THERMAL_CORE_TESTING
44 tristate "Thermal core testing facility"
47 Say Y to add a debugfs-based thermal core testing facility.
48 It allows test thermal zones to be created and populated
49 with trip points in order to exercise the thermal core
50 functionality in a controlled way.
52 config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
53 int "Emergency poweroff delay in milli-seconds"
56 Thermal subsystem will issue a graceful shutdown when
57 critical temperatures are reached using orderly_poweroff(). In
58 case of failure of an orderly_poweroff(), the thermal emergency
59 poweroff kicks in after a delay has elapsed and shuts down the system.
60 This config is number of milliseconds to delay before emergency
61 poweroff kicks in. Similarly to the critical trip point,
62 the delay should be carefully profiled so as to give adequate
63 time for orderly_poweroff() to finish on regular execution.
64 If set to 0 emergency poweroff will not be supported.
70 prompt "Expose thermal sensors as hwmon device"
71 depends on HWMON=y || HWMON=THERMAL
74 In case a sensor is registered with the thermal
75 framework, this option will also register it
76 as a hwmon. The sensor will then have the common
77 hwmon sysfs interface.
79 Say 'Y' here if you want all thermal sensors to
80 have hwmon sysfs interface too.
84 prompt "APIs to parse thermal data out of device tree"
88 This options provides helpers to add the support to
89 read and parse thermal data definitions out of the
92 Say 'Y' here if you need to build thermal infrastructure
96 prompt "Default Thermal governor"
97 default THERMAL_DEFAULT_GOV_STEP_WISE
99 This option sets which thermal governor shall be loaded at
100 startup. If in doubt, select 'step_wise'.
102 config THERMAL_DEFAULT_GOV_STEP_WISE
104 select THERMAL_GOV_STEP_WISE
106 Use the step_wise governor as default. This throttles the
107 devices one step at a time.
109 config THERMAL_DEFAULT_GOV_FAIR_SHARE
111 select THERMAL_GOV_FAIR_SHARE
113 Use the fair_share governor as default. This throttles the
114 devices based on their 'contribution' to a zone. The
115 contribution should be provided through platform data.
117 config THERMAL_DEFAULT_GOV_USER_SPACE
119 select THERMAL_GOV_USER_SPACE
121 The Userspace governor allows to get trip point crossed
122 notification from the kernel via uevents. It is recommended
123 to use the netlink interface instead which gives richer
124 information about the thermal framework events.
126 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
127 bool "power_allocator"
128 depends on THERMAL_GOV_POWER_ALLOCATOR
130 Select this if you want to control temperature based on
131 system and device power allocation. This governor can only
132 operate on cooling devices that implement the power API.
134 config THERMAL_DEFAULT_GOV_BANG_BANG
136 depends on THERMAL_GOV_BANG_BANG
138 Use the bang_bang governor as default. This throttles the
139 devices one step at the time, taking into account the trip
144 config THERMAL_GOV_FAIR_SHARE
145 bool "Fair-share thermal governor"
147 Enable this to manage platform thermals using fair-share governor.
149 config THERMAL_GOV_STEP_WISE
150 bool "Step_wise thermal governor"
152 Enable this to manage platform thermals using a simple linear
155 config THERMAL_GOV_BANG_BANG
156 bool "Bang Bang thermal governor"
159 Enable this to manage platform thermals using bang bang governor.
161 Say 'Y' here if you want to use two point temperature regulation
162 used for fans without throttling. Some fan drivers depend on this
163 governor to be enabled (e.g. acerhdf).
165 config THERMAL_GOV_USER_SPACE
166 bool "User_space thermal governor"
168 Enable this to let the user space manage the platform thermals.
170 config THERMAL_GOV_POWER_ALLOCATOR
171 bool "Power allocator thermal governor"
172 depends on ENERGY_MODEL
174 Enable this to manage platform thermals by dynamically
175 allocating and limiting power to devices.
178 bool "Generic cpu cooling support"
179 depends on THERMAL_OF
181 Enable the CPU cooling features. If the system has no active
182 cooling device available, this option allows to use the CPU
187 config CPU_FREQ_THERMAL
188 bool "CPU frequency cooling device"
192 This implements the generic cpu cooling mechanism through frequency
193 reduction. An ACPI version of this already exists
194 (drivers/acpi/processor_thermal.c).
195 This will be useful for platforms using the generic thermal interface
196 and not the ACPI interface.
198 config CPU_IDLE_THERMAL
199 bool "CPU idle cooling device"
200 depends on IDLE_INJECT
202 This implements the CPU cooling mechanism through
203 idle injection. This will throttle the CPU by injecting
207 config DEVFREQ_THERMAL
208 bool "Generic device cooling support"
209 depends on PM_DEVFREQ
212 This implements the generic devfreq cooling mechanism through
213 frequency reduction for devices using devfreq.
215 This will throttle the device by limiting the maximum allowed DVFS
216 frequency corresponding to the cooling level.
218 In order to use the power extensions of the cooling device,
219 devfreq should use the simple_ondemand governor.
221 If you want this support, you should say Y here.
223 config THERMAL_EMULATION
224 bool "Thermal emulation mode support"
226 Enable this option to make a emul_temp sysfs node in thermal zone
227 directory to support temperature emulation. With emulation sysfs node,
228 user can manually input temperature and test the different trip
229 threshold behaviour for simulation purpose.
231 WARNING: Be careful while enabling this option on production systems,
232 because userland can easily disable the thermal policy by simply
233 flooding this sysfs node with low temperature values.
236 tristate "Generic Thermal MMIO driver"
240 This option enables the generic thermal MMIO driver that will use
241 memory-mapped reads to get the temperature. Any HW/System that
242 allows temperature reading by a single memory-mapped reading, be it
243 register or shared memory, is a potential candidate to work with this
247 tristate "Hisilicon thermal driver"
248 depends on ARCH_HISI || COMPILE_TEST
253 Enable this to plug hisilicon's thermal sensor driver into the Linux
254 thermal framework. cpufreq is used as the cooling device to throttle
255 CPUs when the passive trip is crossed.
258 tristate "Temperature sensor driver for Freescale i.MX SoCs"
259 depends on ARCH_MXC || COMPILE_TEST
260 depends on NVMEM || !NVMEM
261 depends on MFD_SYSCON
264 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
265 It supports one critical trip point and one passive trip point. The
266 cpufreq is used as the cooling device to throttle CPUs when the
267 passive trip is crossed.
269 config IMX_SC_THERMAL
270 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
274 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
275 system controller inside, Linux kernel has to communicate with system
276 controller via MU (message unit) IPC to get temperature from thermal
277 sensor. It supports one critical trip point and one
278 passive trip point for each thermal sensor.
280 config IMX8MM_THERMAL
281 tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
282 depends on ARCH_MXC || COMPILE_TEST
285 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
286 It supports one critical trip point and one passive trip point. The
287 cpufreq is used as the cooling device to throttle CPUs when the passive
291 tristate "Texas Instruments K3 thermal support"
292 depends on ARCH_K3 || COMPILE_TEST
294 If you say yes here you get thermal support for the Texas Instruments
295 K3 SoC family. The current chip supported is:
298 This includes temperature reading functionality.
300 config MAX77620_THERMAL
301 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
302 depends on MFD_MAX77620
305 Support for die junction temperature warning alarm for Maxim
306 Semiconductor PMIC MAX77620 device. Device generates two alarm
307 interrupts when PMIC die temperature cross the threshold of
308 120 degC and 140 degC.
311 tristate "QorIQ Thermal Monitoring Unit"
312 depends on THERMAL_OF && HAS_IOMEM
313 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
316 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
317 It supports one critical trip point and one passive trip point. The
318 cpufreq is used as the cooling device to throttle CPUs when the
319 passive trip is crossed.
322 tristate "SPEAr thermal sensor driver"
323 depends on PLAT_SPEAR || COMPILE_TEST
327 Enable this to plug the SPEAr thermal sensor driver into the Linux
331 tristate "Allwinner sun8i thermal driver"
332 depends on ARCH_SUNXI || COMPILE_TEST
336 depends on RESET_CONTROLLER
338 Support for the sun8i thermal sensor driver into the Linux thermal
341 To compile this driver as a module, choose M here: the
342 module will be called sun8i-thermal.
344 config ROCKCHIP_THERMAL
345 tristate "Rockchip thermal driver"
346 depends on ARCH_ROCKCHIP || COMPILE_TEST
347 depends on RESET_CONTROLLER
350 Rockchip thermal driver provides support for Temperature sensor
351 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
352 trip point. Cpufreq is used as the cooling device and will throttle
353 CPUs when the Temperature crosses the passive trip point.
355 config KIRKWOOD_THERMAL
356 tristate "Temperature sensor on Marvell Kirkwood SoCs"
357 depends on MACH_KIRKWOOD || COMPILE_TEST
361 Support for the Kirkwood thermal sensor driver into the Linux thermal
362 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
365 tristate "Temperature sensor on Marvell Dove SoCs"
366 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
370 Support for the Dove thermal sensor driver in the Linux thermal
373 config DB8500_THERMAL
374 tristate "DB8500 thermal management"
375 depends on MFD_DB8500_PRCMU && OF
378 Adds DB8500 thermal management implementation according to the thermal
379 management framework. A thermal zone with several trip points will be
380 created. Cooling devices can be bound to the trip points to cool this
381 thermal zone if trip points reached.
383 config ARMADA_THERMAL
384 tristate "Marvell EBU Armada SoCs thermal management"
385 depends on ARCH_MVEBU || COMPILE_TEST
389 Enable this option if you want to have support for thermal management
390 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
392 config DA9062_THERMAL
393 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
394 depends on MFD_DA9062 || COMPILE_TEST
397 Enable this for the Dialog Semiconductor thermal sensor driver.
398 This will report PMIC junction over-temperature for one thermal trip
400 Compatible with the DA9062 and DA9061 PMICs.
402 menu "Mediatek thermal drivers"
403 depends on ARCH_MEDIATEK || COMPILE_TEST
404 source "drivers/thermal/mediatek/Kconfig"
407 config AMLOGIC_THERMAL
408 tristate "Amlogic Thermal Support"
410 depends on OF && ARCH_MESON
412 If you say yes here you get support for Amlogic Thermal
415 This driver can also be built as a module. If so, the module will
416 be called amlogic_thermal.
418 menu "Intel thermal drivers"
419 depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
420 source "drivers/thermal/intel/Kconfig"
423 menu "Broadcom thermal drivers"
424 depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
426 source "drivers/thermal/broadcom/Kconfig"
429 menu "Texas Instruments thermal drivers"
430 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
432 source "drivers/thermal/ti-soc-thermal/Kconfig"
435 menu "Samsung thermal drivers"
436 depends on ARCH_EXYNOS || COMPILE_TEST
437 source "drivers/thermal/samsung/Kconfig"
440 menu "STMicroelectronics thermal drivers"
441 depends on (ARCH_STI || ARCH_STM32) && THERMAL_OF
442 source "drivers/thermal/st/Kconfig"
445 source "drivers/thermal/renesas/Kconfig"
447 source "drivers/thermal/tegra/Kconfig"
449 config GENERIC_ADC_THERMAL
450 tristate "Generic ADC based thermal sensor"
453 This enabled a thermal sysfs driver for the temperature sensor
454 which is connected to the General Purpose ADC. The ADC channel
455 is read via IIO framework and the channel information is provided
456 to this driver. This driver reports the temperature by reading ADC
457 channel and converts it to temperature based on lookup table.
459 menu "Qualcomm thermal drivers"
460 depends on (ARCH_QCOM && OF) || COMPILE_TEST
461 source "drivers/thermal/qcom/Kconfig"
464 config UNIPHIER_THERMAL
465 tristate "Socionext UniPhier thermal driver"
466 depends on ARCH_UNIPHIER || COMPILE_TEST
467 depends on THERMAL_OF && MFD_SYSCON
469 Enable this to plug in UniPhier on-chip PVT thermal driver into the
470 thermal framework. The driver supports CPU thermal zone temperature
471 reporting and a couple of trip points.
474 tristate "Temperature sensor on Spreadtrum SoCs"
475 depends on ARCH_SPRD || COMPILE_TEST
477 Support for the Spreadtrum thermal sensor driver in the Linux thermal
480 config KHADAS_MCU_FAN_THERMAL
481 tristate "Khadas MCU controller FAN cooling support"
483 depends on MFD_KHADAS_MCU
487 If you say yes here you get support for the FAN controlled
488 by the Microcontroller found on the Khadas VIM boards.
490 config LOONGSON2_THERMAL
491 tristate "Loongson-2 SoC series thermal driver"
492 depends on LOONGARCH || COMPILE_TEST
495 Support for Thermal driver found on Loongson-2 SoC series platforms.
496 The thermal driver realizes get_temp and set_trips function, which
497 are used to obtain the temperature of the current node and set the
498 temperature range to trigger the interrupt. When the input temperature
499 is higher than the high temperature threshold or lower than the low
500 temperature threshold, the interrupt will occur.