1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|simple-graph-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Abilis Systems
29 description: Abracon Corporation
31 description: Acme Systems srl
33 description: Actions Semiconductor Co., Ltd.
35 description: Active-Semi International Inc
37 description: Avionic Design GmbH
39 description: Adafruit Industries, LLC
41 description: Adapteva, Inc.
43 description: Adaptrum, Inc.
45 description: AD Holdings Plc.
47 description: Analog Devices, Inc.
49 description: Advantech Corporation
50 "^aeroflexgaisler,.*":
51 description: Aeroflex Gaisler AB
53 description: Annapurna Labs
55 description: Allegro DVT
59 description: Allwinner Technology Co., Ltd.
61 description: AlphaScale Integrated Circuits Systems, Inc.
63 description: Altera Corp.
65 description: Amarula Solutions
67 description: Amazon.com, Inc.
69 description: Applied Micro Circuits Corporation (APM, formally AMCC)
71 description: Advanced Micro Devices (AMD), Inc.
73 description: Shenzhen Amediatech Technology Co., Ltd
75 description: Amlogic, Inc.
77 description: Ampire Co., Ltd.
81 description: AMS-Taos Inc.
83 description: Analogix Semiconductor, Inc.
85 description: Andes Technology Corporation
87 description: Anvo-Systems Dresden GmbH
89 description: Applied Micro Circuits Corporation (APM)
91 description: Aptina Imaging
93 description: Arasan Chip Systems
95 description: ArcherMind Technology (Nanjing) Co., Ltd.
97 description: Arctic Sand
99 description: arcx Inc. / Archronix Inc.
101 description: Aries Embedded GmbH
103 description: ARM Ltd.
105 description: ARMadeus Systems SARL
107 description: Arrow Electronics
109 description: Artesyn Embedded Technologies Inc.
111 description: Asahi Kasei Corp.
113 description: ASPEED Technology Inc.
115 description: AsusTek Computer Inc.
117 description: Atlas Scientific LLC
119 description: Atmel Corporation
121 description: AU Optronics Corporation
123 description: Auvidea GmbH
125 description: Avago Technologies
127 description: avia semiconductor
129 description: Shanghai AVIC Optoelectronics Co., Ltd.
131 description: Avnet, Inc.
133 description: Axentia Technologies AB
135 description: Axis Communications AB
137 description: Azoteq (Pty) Ltd
139 description: Shenzhen AZW Technology Co., Ltd.
141 description: BIPAI KEJI LIMITED
143 description: Beckhoff Automation GmbH & Co. KG
145 description: Bitmain Technologies
147 description: BOE Technology Group Co., Ltd.
149 description: Bosch Sensortec GmbH
151 description: Boundary Devices Inc.
153 description: Broadcom Corporation
155 description: Buffalo, Inc.
157 description: B&R Industrial Automation GmbH
159 description: Bticino International
163 description: Capella Microsystems, Inc
165 description: Cascoda, Ltd.
167 description: Catalyst Semiconductor, Inc.
169 description: Cavium, Inc.
171 description: Cadence Design Systems Inc.
173 description: CDTech(H.K.) Electronics Limited
175 description: Ceva, Inc.
177 description: Chipidea, Inc
181 description: ChipSPARK
183 description: Common Hardware Reference Platform
185 description: Chunghwa Picture Tubes Ltd.
187 description: Chuwi Innovation Ltd.
189 description: Computadora Industrial Abierta Argentina
191 description: Cirrus Logic, Inc.
193 description: Cloud Engines, Inc.
195 description: Chips&Media, Inc.
197 description: Conexant Systems, Inc.
199 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
201 description: CompuLab Ltd.
203 description: Chengdu Corpro Technology Co., Ltd.
205 description: Cortina Systems, Inc.
207 description: Cosmic Circuits
209 description: Crane Connectivity Solutions
211 description: Creative Technology Ltd
213 description: Crystalfontz America, Inc.
215 description: Hangzhou C-SKY Microsystems Co., Ltd
217 description: Shenzen Chuangsiqi Technology Co.,Ltd.
219 description: Cubietech, Ltd.
221 description: Cypress Semiconductor Corporation
223 description: CZ.NIC, z.s.p.o.
225 description: Maxim Integrated Products (formerly Dallas Semiconductor)
227 description: DataImage, Inc.
229 description: DAVICOM Semiconductor, Inc.
231 description: Delta Electronics, Inc.
233 description: Denx Software Engineering
235 description: Devantech, Ltd.
237 description: DH electronics GmbH
239 description: Shenzhen Yagu Electronic Technology Co., Ltd.
241 description: Digi International Inc.
243 description: Diglent, Inc.
245 description: Dioo Microcircuit Co., Ltd
247 description: DLC Display Co., Ltd.
249 description: Dialog Semiconductor
251 description: D-Link Corporation
253 description: Data Modul AG
255 description: Domintech Co., Ltd.
257 description: Dongwoon Anatech
259 description: DPTechnics
261 description: Dragino Technology Co., Limited
263 description: dServe Technology B.V.
265 description: Embedded Artists AB
267 description: EBS-SYSTART GmbH
269 description: EBV Elektronik
271 description: Eckelmann AG
273 description: Emerging Display Technologies
275 description: eGalax_eMPIA Technology Inc
277 description: Einfochips
279 description: Elan Microelectronic Corp.
281 description: Elgin S/A.
283 description: Shenzhen Embest Technology Co., Ltd.
285 description: Emlid, Ltd.
287 description: EM Microelectronic
288 "^empire-electronix,.*":
289 description: Empire Electronix
291 description: emtrion GmbH
293 description: Endless Mobile, Inc.
295 description: Silicon Laboratories (formerly Energy Micro AS)
297 description: Engicam S.r.l.
299 description: EPCOS AG
301 description: Ecole Polytechnique Fédérale de Lausanne
303 description: Seiko Epson Corp.
305 description: Espressif Systems Co. Ltd.
307 description: ESTeem Wireless Modems
309 description: NI Ettus Research
311 description: Eukréa Electromatique
313 description: Everest Semiconductor Co. Ltd.
315 description: Everspin Technologies, Inc.
317 description: Evervision Electronics Co. Ltd.
319 description: Exar Corporation
323 description: EZchip Semiconductor
325 description: Facebook
327 description: Fairphone B.V.
329 description: Faraday Technology Corporation
331 description: Fastrax Oy
333 description: Fairchild Semiconductor
335 description: Shenzhen Fly Young Technology Co.,LTD.
339 description: FocalTech Systems Co.,Ltd
341 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
343 description: Freescale Semiconductor
345 description: Fujitsu Ltd.
347 description: GARDENA GmbH
349 description: Gateworks Corporation
351 description: Game Consoles Worldwide
353 description: General Electric Company
355 description: GeekBuying
357 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
359 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
361 description: Gemei Digital Technology Co., Ltd.
363 description: Geniatech, Inc.
365 description: Giantec Semiconductor, Inc.
367 description: Giantplus Technology Co., Ltd.
369 description: Globalscale Technologies, Inc.
371 description: GlobalTop Technology, Inc.
373 description: Global Mixed-mode Technology, Inc.
375 description: Shenzhen Huiding Technology Co., Ltd.
377 description: Google, Inc.
381 description: Garmin Limited
383 description: Gumstix, Inc.
385 description: Gateworks Corporation
387 description: HannStar Display Corporation
389 description: Haoyu Microelectronic Co. Ltd.
391 description: Hardkernel Co., Ltd
393 description: HiDeep Inc.
395 description: Himax Technologies, Inc.
397 description: Hisilicon Limited.
399 description: Hitachi Ltd.
401 description: Hitex Development Tools
403 description: Holt Integrated Circuits, Inc.
405 description: Honeywell
407 description: Jiangsu HopeRun Software Co., Ltd.
409 description: Hewlett Packard
411 description: HannStar Display Co.
413 description: Holtek Semiconductor, Inc.
415 description: Shenzhen Hugsun Technology Co. Ltd.
417 description: HwaCom Systems Inc.
419 description: Hyundai Technology
421 description: I2SE GmbH
423 description: International Business Machines (IBM)
425 description: IC Plus Corp.
427 description: Integrated Device Technologies, Inc.
429 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
431 description: ILI Technology Corporation (ILITEK)
433 description: Imagination Technologies Ltd.
435 description: In-Circuit GmbH
437 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
439 description: Infineon Technologies
441 description: Inforce Computing
443 description: Ingenic Semiconductor
445 description: Innolux Corporation
447 description: INSIDE Secure
449 description: Inspur Corporation
451 description: Intel Corporation
453 description: Inter Control Group
455 description: InvenSense Inc.
457 description: Inverse Path
459 description: Iomega Corporation
461 description: ISEE 2007 S.L.
463 description: Intersil
465 description: Integrated Silicon Solutions Inc.
467 description: ITEAD Intelligent Systems Co.Ltd
469 description: iWave Systems Technologies Pvt. Ltd.
471 description: Japan Display Inc.
473 description: JEDEC Solid State Technology Association
475 description: Shenzhen Jesurun Electronics Business Dept.
477 description: Jiandangjing Technology Co., Ltd.
479 description: Ka-Ro electronics GmbH
481 description: Keith & Koep GmbH
483 description: Keymile GmbH
487 description: Kieback & Peter GmbH
489 description: Kinetic Technologies
491 description: King & Display Technology Co., Ltd.
493 description: Kingnovel Technology Co., Ltd.
495 description: Kionix, Inc.
497 description: Rakuten Kobo Inc.
499 description: Kaohsiung Opto-Electronics Inc.
501 description: Kontron S&T AG
503 description: Sutajio Ko-Usagi PTE Ltd.
505 description: Kyocera Corporation
509 description: Laird PLC
511 description: Ketai Huajie Technology Co., Ltd.
513 description: Lantiq Semiconductor
515 description: Lattice Semiconductor
519 description: LEGO Systems A/S
521 description: Shenzhen LeMaker Technology Co., Ltd.
523 description: Lenovo Group Ltd.
525 description: LG Corporation
527 description: LG Display
529 description: Shenzhen Libre Technology Co., Ltd
531 description: Lichee Pi
533 description: Linaro Limited
535 description: LinkSprite Technologies, Inc.
537 description: Belkin International, Inc. (Linksys)
539 description: Linux-specific binding
541 description: Linx Technologies
543 description: Linear Technology Corporation
545 description: Logic PD, Inc.
547 description: Longcheer Technology (Shanghai) Co., Ltd.
549 description: LSI Corp. (LSI Logic)
551 description: Liebherr-Werk Nenzing GmbH
553 description: Macnica Americas
555 description: Mapleboard.org
557 description: Marvell Technology Group Ltd.
559 description: MaxBotix Inc.
561 description: Maxim Integrated Products
563 description: Mobiveil Inc.
567 description: Measurement Specialties
569 description: Mustek Limited
571 description: MediaTek Inc.
573 description: MegaChips
575 description: Shenzhen MeLE Digital Technology Ltd.
577 description: Melexis N.V.
579 description: MELFAS Inc.
581 description: Mellanox Technologies
583 description: MEMSIC Inc.
585 description: Menlo Systems GmbH
587 description: Merrii Technology Co., Ltd.
589 description: Micrel Inc.
591 description: Microchip Technology Inc.
593 description: Micro Crystal AG
595 description: Micron Technology Inc.
597 description: Microsoft Corporation
599 description: MikroElektronika d.o.o.
601 description: Miniand Tech
603 description: MINIX Technology Ltd.
605 description: MiraMEMS Sensing Technology Co., Ltd.
607 description: Mitsubishi Electric Corporation
609 description: Mosaix Technologies, Inc.
611 description: Motorola, Inc.
613 description: Moxa Inc.
617 description: mqmaker Inc.
619 description: Microsemi Corporation
621 description: Micro-Star International Co. Ltd.
623 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
625 description: Multi-Inno Technology Co.,Ltd
627 description: Mundo Reader S.L.
629 description: Murata Manufacturing Co., Ltd.
631 description: Macronix International Co., Ltd.
633 description: MYIR Tech Limited
635 description: National Semiconductor
637 description: NEC LCD Technologies, Ltd.
639 description: Neonode Inc.
643 description: Broadcom Corporation (formerly NetLogic Microsystems)
645 description: Netron DY
647 description: Shenzhen Netxeon Technology CO., LTD
651 description: Next Thing Co.
653 description: Newhaven Display International
655 description: National Instruments
657 description: Nintendo
659 description: NLT Technologies, Ltd.
663 description: Nordic Semiconductor
665 description: NovTech, Inc.
667 description: NutsBoard
669 description: Nuvoton Technology Corporation
671 description: New Vision Display
675 description: NXP Semiconductors
677 description: Oceanic Systems (UK) Ltd.
679 description: Okaya Electric America, Inc.
681 description: Oki Electric Industry Co., Ltd.
683 description: OLIMEX Ltd.
685 description: One Laptop Per Child
687 description: Onion Corporation
689 description: ON Semiconductor Corp.
691 description: On Tat Industrial Company
693 description: Opal Kelly Incorporated
695 description: OpenCores.org
697 description: OpenRISC.io
699 description: Option NV
701 description: Shenzhen Oranth Technology Co., Ltd.
703 description: Oracle Corporation
705 description: Orise Technology
707 description: Ortus Technology Co., Ltd.
709 description: OSD Displays
711 description: Overkiz SAS
713 description: OmniVision Technologies
715 description: Oxford Semiconductor, Ltd.
717 description: Panasonic Corporation
719 description: Parade Technologies Inc.
721 description: Precision Design Associates, Inc.
723 description: Pericom Technology Inc.
725 description: Pervasive Displays, Inc.
727 description: PHICOMM Co., Ltd.
729 description: PHYTEC Messtechnik GmbH
731 description: Picochip Ltd
735 description: Shenzhen PineRiver Designs Co., Ltd.
737 description: PIXCIR MICROELECTRONICS Co., Ltd
739 description: Plantower Co., Ltd
741 description: Plat\'Home Co., Ltd.
745 description: Broadcom Corporation (formerly PLX Technology)
747 description: PNI Sensor Corporation
749 description: Polaroid Corporation
751 description: Portwell Inc.
753 description: Poslab Technology Co., Ltd.
755 description: Point of View International B.V.
757 description: PowerVR (deprecated, use img)
759 description: Primux Trading, S.L.
761 description: PROBOX2 (by W2COMP Co., Ltd.)
763 description: PulsedLight, Inc
765 description: Purism, SPC
767 description: Qualcomm Atheros, Inc.
769 description: Qualcomm Technologies, Inc
771 description: QEMU, a generic and open source machine emulator and virtualizer
773 description: Qi Hardware
775 description: Chengdu Kaixuan Information Technology Co., Ltd.
777 description: QiaoDian XianShi Corporation
779 description: QNAP Systems, Inc.
783 description: RaidSonic Technology GmbH
785 description: Mediatek/Ralink Technology Corp.
787 description: Ramtron International
789 description: Raspberry Pi Foundation
791 description: Raydium Semiconductor Corp.
793 description: Unisoc Communications, Inc.
795 description: Realtek Semiconductor Corp.
797 description: Renesas Electronics Corporation
799 description: Shenzhen Rervision Technology Co., Ltd.
801 description: Richtek Technology Corporation
803 description: Ricoh Co. Ltd.
805 description: Rikomagic Tech Corp. Ltd
807 description: RISC-V Foundation
809 description: Fuzhou Rockchip Electronics Co., Ltd
811 description: ROCKTECH DISPLAYS LIMITED
813 description: ROHM Semiconductor Co., Ltd
815 description: Ronbo Electronics
817 description: Shenzhen Roofull Technology Co, Ltd
819 description: Samsung Semiconductor
821 description: Samtec/Softing company
823 description: Sancloud Ltd
825 description: Sandisk Corporation
827 description: Smart Battery System
829 description: Schindler
831 description: Seagate Technology PLC
833 description: Shenzhen SEI Robotics Co., Ltd
835 description: Semtech Corporation
837 description: Sensirion AG
839 description: Sensortek Technology Corporation
841 description: Small Form Factor Committee
843 description: Solomon Goldentek Display Corporation
845 description: SGX Sensortech
847 description: Sharp Corporation
849 description: Shimafuji Electric, Inc.
851 description: Si-En Technology Ltd.
853 description: Silicon Linux Corporation
855 description: SiFive, Inc.
857 description: Sigma Designs, Inc.
859 description: Seiko Instruments, Inc.
861 description: Silicon Image
863 description: Silicon Laboratories
865 description: Silead Inc.
867 description: Silergy Corp.
869 description: Silicon Mitus, Inc.
871 description: Cypress Semiconductor Corporation (Simtek Corporation)
873 description: Sinlinx Electronics Technology Co., LTD
875 description: SinoVoip Co., Ltd
877 description: Shenzhen Sipeed Technology Co., Ltd.
879 description: SiRF Technology, Inc.
881 description: Silicon Integrated Systems Corp.
883 description: Sitronix Technology Corporation
885 description: Skyworks Solutions, Inc.
887 description: Standard Microsystems Corporation
889 description: Synopsys, Inc.
891 description: Shenzhen SoChip Technology Co., Ltd.
893 description: Socionext Inc.
895 description: SolidRun
897 description: Solomon Systech Limited
899 description: Sony Corporation
901 description: Spansion Inc.
903 description: Spreadtrum Communications Inc.
905 description: Silicon Storage Technology, Inc.
907 description: STMicroelectronics
909 description: Starry Electronic Technology (ShenZhen) Co., LTD
913 description: ST-Ericsson
915 description: ST-Ericsson
917 description: Summit microelectronics
919 description: Shenzhen Sunchip Technology Co., Ltd
921 description: Sun Microsystems, Inc
923 description: Sierra Wireless
925 description: Synaptics Inc.
927 description: Synology, Inc.
929 description: TBS Technologies
930 "^tbs-biometrics,.*":
931 description: Touchless Biometric Systems AG
933 description: Trusted Computing Group
935 description: Toby Churchill Ltd.
937 description: TechNexion
939 description: Technologic Systems
941 description: Tempo Semiconductor
943 description: Shenzhen Techstar Electronics Co., Ltd.
945 description: Terasic Inc.
947 description: Three Five Corp
949 description: THine Electronics, Inc.
951 description: Texas Instruments
953 description: Tianma Micro-electronics Co., Ltd.
955 description: Trusted Logic Mobility
957 description: Tecon Microprocessor Technologies, LLC.
961 description: TPO (deprecated, use tpo)
964 description: Toradex AG
966 description: Toshiba Corporation
970 description: TPK U.S.A. LLC
972 description: TP-LINK Technologies Co., Ltd.
976 description: TQ Systems GmbH
980 description: Tronsmart
982 description: Truly Semiconductors Limited
984 description: Theobroma Systems Design und Consulting GmbH
986 description: Tyan Computer Corporation
990 description: uCRobotics
992 description: Ubiquiti Networks
996 description: Ugoos Industrial Co., Ltd.
998 description: United Western Technologies Corp (UniWest)
1000 description: uPI Semiconductor Corp.
1002 description: United Radiant Technology Corporation
1004 description: Universal Scientific Industrial Co., Ltd.
1006 description: Aigo Digital Technology Co., Ltd.
1008 description: V3 Semiconductor
1010 description: Vamrs Ltd.
1012 description: Variscite Ltd.
1014 description: VIA Technologies, Inc.
1016 description: Virtual I/O Device Specification, developed by the OASIS consortium
1018 description: Vishay Intertechnology, Inc
1020 description: Vitesse Semiconductor Corporation
1022 description: Vivante Corporation
1024 description: VoCore Studio
1026 description: Voipac Technologies s.r.o.
1028 description: Vision Optical Technology Co., Ltd.
1030 description: VXT Ltd
1032 description: Western Digital Corp.
1034 description: WeTek Electronics, limited.
1038 description: Shenzhen whwave Electronics, Inc.
1040 description: Wi2Wi, Inc.
1042 description: Winbond Electronics corp.
1044 description: Winstar Display Corp.
1046 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1048 description: Wolfson Microelectronics
1050 description: Wondermedia Technologies, Inc.
1054 description: X-Powers
1056 description: Extreme Engineering Solutions (X-ES)
1058 description: Xillybus Ltd.
1062 description: Shenzhen Xunlong Software CO.,Limited
1063 "^yones-toptech,.*":
1064 description: Yones Toptech Co., Ltd.
1066 description: Y Soft Corporation a.s.
1068 description: Zarlink Semiconductor
1070 description: ZEITEC Semiconductor Co., LTD.
1072 description: Shenzhen Zidoo Technology Co., Ltd.
1074 description: Zodiac Inflight Innovations
1076 description: ZTE Corp.
1078 description: ZyXEL Communications Corp.
1080 # Normal property name match without a comma
1081 # These should catch all node/property names without a prefix
1082 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1083 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1086 additionalProperties: false