1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|simple-graph-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Abilis Systems
29 description: Abracon Corporation
31 description: Acme Systems srl
33 description: Actions Semiconductor Co., Ltd.
35 description: Active-Semi International Inc
37 description: Avionic Design GmbH
39 description: Adafruit Industries, LLC
41 description: Adapteva, Inc.
43 description: Adaptrum, Inc.
45 description: AD Holdings Plc.
47 description: Analog Devices, Inc.
49 description: Advantech Corporation
50 "^aeroflexgaisler,.*":
51 description: Aeroflex Gaisler AB
53 description: Annapurna Labs
55 description: Allegro DVT
59 description: Allwinner Technology Co., Ltd.
61 description: AlphaScale Integrated Circuits Systems, Inc.
63 description: Alps Electric Co., Ltd.
65 description: Altera Corp.
67 description: Amarula Solutions
69 description: Amazon.com, Inc.
71 description: Applied Micro Circuits Corporation (APM, formally AMCC)
73 description: Advanced Micro Devices (AMD), Inc.
75 description: Shenzhen Amediatech Technology Co., Ltd
77 description: Amlogic, Inc.
79 description: Ampire Co., Ltd.
83 description: AMS-Taos Inc.
85 description: Analogix Semiconductor, Inc.
87 description: Andes Technology Corporation
89 description: Anvo-Systems Dresden GmbH
91 description: Applied Micro Circuits Corporation (APM)
93 description: Aptina Imaging
95 description: Arasan Chip Systems
97 description: ArcherMind Technology (Nanjing) Co., Ltd.
99 description: Arctic Sand
101 description: arcx Inc. / Archronix Inc.
103 description: Aries Embedded GmbH
105 description: ARM Ltd.
107 description: ARMadeus Systems SARL
109 description: Arrow Electronics
111 description: Artesyn Embedded Technologies Inc.
113 description: Asahi Kasei Corp.
115 description: All Sensors Corporation
117 description: ASPEED Technology Inc.
119 description: AsusTek Computer Inc.
121 description: Atlas Scientific LLC
123 description: Atmel Corporation
125 description: AU Optronics Corporation
127 description: Auvidea GmbH
129 description: Avago Technologies
131 description: avia semiconductor
133 description: Shanghai AVIC Optoelectronics Co., Ltd.
135 description: Avnet, Inc.
137 description: Shanghai Awinic Technology Co., Ltd.
139 description: Axentia Technologies AB
141 description: Axis Communications AB
143 description: Azoteq (Pty) Ltd
145 description: Shenzhen AZW Technology Co., Ltd.
147 description: BAIKAL ELECTRONICS, JSC
149 description: BIPAI KEJI LIMITED
151 description: Compass Electronics Group, LLC
153 description: BeagleBoard.org Foundation
155 description: Beckhoff Automation GmbH & Co. KG
157 description: Bitmain Technologies
159 description: BOE Technology Group Co., Ltd.
161 description: Bosch Sensortec GmbH
163 description: Boundary Devices Inc.
165 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
167 description: Broadcom Corporation
169 description: Buffalo, Inc.
171 description: B&R Industrial Automation GmbH
173 description: Bticino International
175 description: CALAO Systems SAS
179 description: Capella Microsystems, Inc
181 description: Cascoda, Ltd.
183 description: Catalyst Semiconductor, Inc.
185 description: Cavium, Inc.
187 description: Cadence Design Systems Inc.
189 description: CDTech(H.K.) Electronics Limited
191 description: Ceva, Inc.
193 description: Check Point Software Technologies Ltd.
195 description: Chipidea, Inc
199 description: ChipSPARK
201 description: Chrontel, Inc.
203 description: Common Hardware Reference Platform
205 description: Chunghwa Picture Tubes Ltd.
207 description: Chuwi Innovation Ltd.
209 description: Computadora Industrial Abierta Argentina
211 description: Cirrus Logic, Inc.
213 description: Cloud Engines, Inc.
215 description: Chips&Media, Inc.
217 description: Conexant Systems, Inc.
219 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
221 description: CompuLab Ltd.
223 description: CORERIVER Semiconductor Co.,Ltd.
225 description: Chengdu Corpro Technology Co., Ltd.
227 description: Cortina Systems, Inc.
229 description: Cosmic Circuits
231 description: Crane Connectivity Solutions
233 description: Creative Technology Ltd
235 description: Crystalfontz America, Inc.
237 description: Hangzhou C-SKY Microsystems Co., Ltd
239 description: Shenzen Chuangsiqi Technology Co.,Ltd.
241 description: Cubietech, Ltd.
243 description: Cypress Semiconductor Corporation
245 description: CZ.NIC, z.s.p.o.
247 description: Maxim Integrated Products (formerly Dallas Semiconductor)
249 description: DataImage, Inc.
251 description: DAVICOM Semiconductor, Inc.
253 description: Dell Inc.
255 description: Delta Electronics, Inc.
257 description: Denx Software Engineering
259 description: Devantech, Ltd.
261 description: DH electronics GmbH
263 description: Shenzhen Yagu Electronic Technology Co., Ltd.
265 description: Digi International Inc.
267 description: Diglent, Inc.
269 description: Dioo Microcircuit Co., Ltd
271 description: DLC Display Co., Ltd.
273 description: Dialog Semiconductor
275 description: D-Link Corporation
277 description: Data Modul AG
279 description: Domintech Co., Ltd.
281 description: Dongwoon Anatech
283 description: DPTechnics
285 description: Dragino Technology Co., Limited
287 description: dServe Technology B.V.
289 description: Dyna-Image
291 description: Embedded Artists AB
293 description: EBS-SYSTART GmbH
295 description: EBV Elektronik
297 description: Eckelmann AG
299 description: Emerging Display Technologies
301 description: eGalax_eMPIA Technology Inc
303 description: Einfochips
305 description: Elan Microelectronic Corp.
307 description: Elgin S/A.
309 description: Shenzhen Elida Technology Co., Ltd.
311 description: Shenzhen Embest Technology Co., Ltd.
313 description: Emlid, Ltd.
315 description: EM Microelectronic
316 "^empire-electronix,.*":
317 description: Empire Electronix
319 description: emtrion GmbH
321 description: Endless Mobile, Inc.
323 description: ENE Technology, Inc.
325 description: Silicon Laboratories (formerly Energy Micro AS)
327 description: Engicam S.r.l.
329 description: EPCOS AG
331 description: Ecole Polytechnique Fédérale de Lausanne
333 description: Seiko Epson Corp.
335 description: Espressif Systems Co. Ltd.
337 description: ESTeem Wireless Modems
339 description: NI Ettus Research
341 description: Eukréa Electromatique
343 description: Everest Semiconductor Co. Ltd.
345 description: Everspin Technologies, Inc.
347 description: Evervision Electronics Co. Ltd.
349 description: Exar Corporation
353 description: EZchip Semiconductor
355 description: Facebook
357 description: Fairphone B.V.
359 description: Faraday Technology Corporation
361 description: Fastrax Oy
363 description: Fairchild Semiconductor
365 description: Shenzhen Feixin Photoelectic Co., Ltd
367 description: Shenzhen Fly Young Technology Co.,LTD.
371 description: FocalTech Systems Co.,Ltd
373 description: Shenzhen Frida LCD Co., Ltd.
375 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
377 description: Freescale Semiconductor
379 description: Fujitsu Ltd.
381 description: GARDENA GmbH
383 description: Gateworks Corporation
385 description: Game Consoles Worldwide
387 description: General Electric Company
389 description: GeekBuying
391 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
393 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
395 description: Gemei Digital Technology Co., Ltd.
397 description: Geniatech, Inc.
399 description: Giantec Semiconductor, Inc.
401 description: Giantplus Technology Co., Ltd.
403 description: Globalscale Technologies, Inc.
405 description: GlobalTop Technology, Inc.
407 description: Global Mixed-mode Technology, Inc.
409 description: Shenzhen Huiding Technology Co., Ltd.
411 description: Google, Inc.
415 description: Garmin Limited
417 description: Gumstix, Inc.
419 description: Gateworks Corporation
421 description: HannStar Display Corporation
423 description: Haoyu Microelectronic Co. Ltd.
425 description: Hardkernel Co., Ltd
427 description: HiDeep Inc.
429 description: Himax Technologies, Inc.
431 description: Hisilicon Limited.
433 description: Hitachi Ltd.
435 description: Hitex Development Tools
437 description: Holt Integrated Circuits, Inc.
439 description: Honeywell
441 description: Jiangsu HopeRun Software Co., Ltd.
443 description: Hewlett Packard
445 description: HannStar Display Co.
447 description: Holtek Semiconductor, Inc.
449 description: Shenzhen Hugsun Technology Co. Ltd.
451 description: HwaCom Systems Inc.
453 description: Hydis Technologies
455 description: Hyundai Technology
457 description: I2SE GmbH
459 description: International Business Machines (IBM)
461 description: IC Plus Corp.
463 description: Integrated Device Technologies, Inc.
465 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
467 description: ILI Technology Corporation (ILITEK)
469 description: Imagination Technologies Ltd.
471 description: In-Circuit GmbH
473 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
475 description: Infineon Technologies
477 description: Inforce Computing
479 description: InfoVision Optoelectronics Kunshan Co. Ltd.
481 description: Ingenic Semiconductor
483 description: Innolux Corporation
485 description: INSIDE Secure
487 description: Inspur Corporation
489 description: Intel Corporation
491 description: Inter Control Group
493 description: InvenSense Inc.
495 description: Inverse Path
497 description: Iomega Corporation
499 description: ISEE 2007 S.L.
501 description: Intersil
503 description: Integrated Silicon Solutions Inc.
505 description: ITE Tech. Inc.
507 description: ITEAD Intelligent Systems Co.Ltd
509 description: iWave Systems Technologies Pvt. Ltd.
511 description: Japan Display Inc.
513 description: JEDEC Solid State Technology Association
515 description: Shenzhen Jesurun Electronics Business Dept.
517 description: Jiandangjing Technology Co., Ltd.
519 description: Kamstrup A/S
521 description: Ka-Ro electronics GmbH
523 description: Keith & Koep GmbH
525 description: Keymile GmbH
529 description: Kieback & Peter GmbH
531 description: Kinetic Technologies
533 description: King & Display Technology Co., Ltd.
535 description: Kingnovel Technology Co., Ltd.
537 description: Kionix, Inc.
539 description: Rakuten Kobo Inc.
541 description: Kaohsiung Opto-Electronics Inc.
543 description: Kontron S&T AG
545 description: Sutajio Ko-Usagi PTE Ltd.
547 description: Kyocera Corporation
551 description: Laird PLC
553 description: Ketai Huajie Technology Co., Ltd.
555 description: Lantiq Semiconductor
557 description: Lattice Semiconductor
559 description: Shenzhen Leadtek Technology Co., Ltd.
563 description: LEGO Systems A/S
565 description: Shenzhen LeMaker Technology Co., Ltd.
567 description: Lenovo Group Ltd.
569 description: LG Corporation
571 description: LG Display
573 description: Shenzhen Libre Technology Co., Ltd
575 description: Lichee Pi
577 description: Linaro Limited
579 description: LinkSprite Technologies, Inc.
581 description: Belkin International, Inc. (Linksys)
583 description: Linutronix GmbH
585 description: Linux-specific binding
587 description: Linx Technologies
589 description: Linear Technology Corporation
591 description: Logic PD, Inc.
593 description: Logic Technologies Limited
595 description: Longcheer Technology (Shanghai) Co., Ltd.
597 description: Loongson Technology Corporation Limited
599 description: LSI Corp. (LSI Logic)
601 description: Liebherr-Werk Nenzing GmbH
603 description: Linux Automation GmbH
605 description: Macnica Americas
607 description: Mapleboard.org
609 description: Marvell Technology Group Ltd.
611 description: MaxBotix Inc.
613 description: Maxim Integrated Products
615 description: Mobiveil Inc.
619 description: Measurement Specialties
621 description: Mustek Limited
623 description: MediaTek Inc.
625 description: MegaChips
627 description: Shenzhen MeLE Digital Technology Ltd.
629 description: Melexis N.V.
631 description: MELFAS Inc.
633 description: Mellanox Technologies
635 description: MEMSIC Inc.
637 description: Menlo Systems GmbH
639 description: Merrii Technology Co., Ltd.
641 description: Micrel Inc.
643 description: Microchip Technology Inc.
645 description: Micro Crystal AG
647 description: Micron Technology Inc.
649 description: Microsoft Corporation
651 description: MikroElektronika d.o.o.
653 description: MikroTik
655 description: Miniand Tech
657 description: MINIX Technology Ltd.
659 description: MiraMEMS Sensing Technology Co., Ltd.
661 description: Mitsubishi Electric Corporation
663 description: Mosaix Technologies, Inc.
665 description: Motorola, Inc.
667 description: Moxa Inc.
671 description: Monolithic Power Systems Inc.
673 description: mqmaker Inc.
675 description: Marvell Technology Group Ltd.
678 description: Microsemi Corporation
680 description: Micro-Star International Co. Ltd.
682 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
684 description: Multi-Inno Technology Co.,Ltd
686 description: Mundo Reader S.L.
688 description: Murata Manufacturing Co., Ltd.
690 description: Macronix International Co., Ltd.
692 description: MYIR Tech Limited
694 description: National Semiconductor
696 description: NEC LCD Technologies, Ltd.
698 description: Neonode Inc.
702 description: Broadcom Corporation (formerly NetLogic Microsystems)
704 description: Netron DY
706 description: Shenzhen Netxeon Technology CO., LTD
708 description: Guangdong Neweast Optoelectronics CO., LTD
712 description: Next Thing Co.
714 description: Newhaven Display International
716 description: National Instruments
718 description: Nintendo
720 description: NLT Technologies, Ltd.
724 description: Nordic Semiconductor
726 description: NovTech, Inc.
728 description: NutsBoard
730 description: Nuvoton Technology Corporation
732 description: New Vision Display
736 description: NXP Semiconductors
738 description: Oceanic Systems (UK) Ltd.
740 description: Okaya Electric America, Inc.
742 description: Oki Electric Industry Co., Ltd.
744 description: OLIMEX Ltd.
746 description: One Laptop Per Child
748 description: Onion Corporation
750 description: ON Semiconductor Corp.
752 description: On Tat Industrial Company
754 description: Opal Kelly Incorporated
756 description: OpenCores.org
758 description: OpenRISC.io
760 description: Option NV
762 description: Shenzhen Oranth Technology Co., Ltd.
764 description: Oracle Corporation
766 description: Orise Technology
768 description: Ortus Technology Co., Ltd.
770 description: OSD Displays
772 description: Overkiz SAS
774 description: OmniVision Technologies
776 description: Oxford Semiconductor, Ltd.
778 description: OzzMaker
780 description: Panasonic Corporation
782 description: Parade Technologies Inc.
784 description: Parallax Inc.
786 description: Precision Design Associates, Inc.
788 description: Pericom Technology Inc.
790 description: Pervasive Displays, Inc.
792 description: PHICOMM Co., Ltd.
794 description: PHYTEC Messtechnik GmbH
796 description: Picochip Ltd
800 description: Shenzhen PineRiver Designs Co., Ltd.
802 description: PIXCIR MICROELECTRONICS Co., Ltd
804 description: Plantower Co., Ltd
806 description: Plat\'Home Co., Ltd.
810 description: Broadcom Corporation (formerly PLX Technology)
812 description: PNI Sensor Corporation
814 description: PocketBook International SA
816 description: Polaroid Corporation
818 description: Portwell Inc.
820 description: Poslab Technology Co., Ltd.
822 description: Point of View International B.V.
824 description: PowerVR (deprecated, use img)
826 description: Primux Trading, S.L.
828 description: PROBOX2 (by W2COMP Co., Ltd.)
830 description: Protonic Holland
832 description: PulsedLight, Inc
834 description: Purism, SPC
836 description: Qualcomm Atheros, Inc.
838 description: Qualcomm Technologies, Inc
840 description: QEMU, a generic and open source machine emulator and virtualizer
842 description: Qi Hardware
844 description: Chengdu Kaixuan Information Technology Co., Ltd.
846 description: QiaoDian XianShi Corporation
848 description: QNAP Systems, Inc.
852 description: RaidSonic Technology GmbH
854 description: Mediatek/Ralink Technology Corp.
856 description: Ramtron International
858 description: Raspberry Pi Foundation
860 description: Raydium Semiconductor Corp.
862 description: Unisoc Communications, Inc.
864 description: Realtek Semiconductor Corp.
866 description: Renesas Electronics Corporation
868 description: Shenzhen Rervision Technology Co., Ltd.
870 description: Richtek Technology Corporation
872 description: Ricoh Co. Ltd.
874 description: Rikomagic Tech Corp. Ltd
876 description: RISC-V Foundation
878 description: Fuzhou Rockchip Electronics Co., Ltd
880 description: ROCKTECH DISPLAYS LIMITED
882 description: ROHM Semiconductor Co., Ltd
884 description: Ronbo Electronics
886 description: Shenzhen Roofull Technology Co, Ltd
888 description: Samsung Semiconductor
890 description: Samtec/Softing company
892 description: Sancloud Ltd
894 description: Sandisk Corporation
896 description: Satoz International Co., Ltd
898 description: Smart Battery System
900 description: Schindler
902 description: Seagate Technology PLC
904 description: Shenzhen SEI Robotics Co., Ltd
906 description: Semtech Corporation
908 description: Sensirion AG
910 description: Sensortek Technology Corporation
912 description: Small Form Factor Committee
914 description: Solomon Goldentek Display Corporation
916 description: SG Micro Corp
918 description: SGX Sensortech
920 description: Sharp Corporation
922 description: Shimafuji Electric, Inc.
924 description: Shiratech Solutions
926 description: Si-En Technology Ltd.
928 description: Silicon Linux Corporation
930 description: SiFive, Inc.
932 description: Sigma Designs, Inc.
934 description: Seiko Instruments, Inc.
936 description: Silicon Image
938 description: Silicon Laboratories
940 description: Silead Inc.
942 description: Silergy Corp.
944 description: Silex Insight
946 description: Silicon Mitus, Inc.
948 description: Cypress Semiconductor Corporation (Simtek Corporation)
950 description: Sinlinx Electronics Technology Co., LTD
952 description: SinoVoip Co., Ltd
954 description: Shenzhen Sipeed Technology Co., Ltd.
956 description: SiRF Technology, Inc.
958 description: Silicon Integrated Systems Corp.
960 description: Sitronix Technology Corporation
962 description: Skyworks Solutions, Inc.
964 description: SmartLabs LLC
966 description: Standard Microsystems Corporation
968 description: Synopsys, Inc.
970 description: Shenzhen SoChip Technology Co., Ltd.
972 description: Socionext Inc.
974 description: SolidRun
976 description: Solomon Systech Limited
978 description: Sony Corporation
980 description: Spansion Inc.
982 description: Spreadtrum Communications Inc.
984 description: Silicon Storage Technology, Inc.
986 description: STMicroelectronics
988 description: Starry Electronic Technology (ShenZhen) Co., LTD
992 description: ST-Ericsson
995 description: ST-Ericsson
997 description: ST-Ericsson
1000 description: Summit microelectronics
1002 description: Shenzhen Sunchip Technology Co., Ltd
1004 description: Sun Microsystems, Inc
1006 description: Sierra Wireless
1008 description: Synaptics Inc.
1010 description: Synology, Inc.
1012 description: TBS Technologies
1013 "^tbs-biometrics,.*":
1014 description: Touchless Biometric Systems AG
1016 description: Trusted Computing Group
1018 description: Toby Churchill Ltd.
1020 description: TechNexion
1022 description: Technologic Systems
1024 description: Tempo Semiconductor
1026 description: Shenzhen Techstar Electronics Co., Ltd.
1028 description: Terasic Inc.
1030 description: Three Five Corp
1032 description: THine Electronics, Inc.
1034 description: Texas Instruments
1036 description: Tianma Micro-electronics Co., Ltd.
1038 description: Trusted Logic Mobility
1040 description: Tecon Microprocessor Technologies, LLC.
1044 description: TPO (deprecated, use tpo)
1047 description: Topwise Communication Co., Ltd.
1049 description: Toradex AG
1051 description: Toshiba Corporation
1055 description: TPK U.S.A. LLC
1057 description: TP-LINK Technologies Co., Ltd.
1061 description: TQ Systems GmbH
1065 description: Tronsmart
1067 description: Truly Semiconductors Limited
1069 description: Visionox
1071 description: Theobroma Systems Design und Consulting GmbH
1073 description: Tyan Computer Corporation
1077 description: U-Boot bootloader
1079 description: uCRobotics
1081 description: Ubiquiti Networks
1085 description: Ugoos Industrial Co., Ltd.
1087 description: United Western Technologies Corp (UniWest)
1089 description: uPI Semiconductor Corp.
1091 description: United Radiant Technology Corporation
1093 description: Universal Scientific Industrial Co., Ltd.
1095 description: Aigo Digital Technology Co., Ltd.
1097 description: V3 Semiconductor
1099 description: Vaisala
1101 description: Vamrs Ltd.
1103 description: Variscite Ltd.
1105 description: VIA Technologies, Inc.
1107 description: Videostrong Technology Co., Ltd.
1109 description: Virtual I/O Device Specification, developed by the OASIS consortium
1111 description: Vishay Intertechnology, Inc
1113 description: Vitesse Semiconductor Corporation
1115 description: Vivante Corporation
1117 description: VoCore Studio
1119 description: Voipac Technologies s.r.o.
1121 description: Vision Optical Technology Co., Ltd.
1123 description: VXT Ltd
1125 description: Waveshare Electronics
1127 description: Western Digital Corp.
1129 description: Würth Elektronik GmbH.
1131 description: WeTek Electronics, limited.
1135 description: Shenzhen whwave Electronics, Inc.
1137 description: Wi2Wi, Inc.
1139 description: Winbond Electronics corp.
1141 description: Winstar Display Corp.
1143 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1145 description: Wolfson Microelectronics
1147 description: Wondermedia Technologies, Inc.
1151 description: X-Powers
1153 description: Extreme Engineering Solutions (X-ES)
1155 description: Xiaomi Technology Co., Ltd.
1157 description: Xillybus Ltd.
1159 description: Shenzhen Xinpeng Technology Co., Ltd
1165 description: Shenzhen Xunlong Software CO.,Limited
1169 description: YSH & ATIL
1170 "^yones-toptech,.*":
1171 description: Yones Toptech Co., Ltd.
1173 description: Y Soft Corporation a.s.
1175 description: Zarlink Semiconductor
1177 description: ZEITEC Semiconductor Co., LTD.
1179 description: Shenzhen Zidoo Technology Co., Ltd.
1181 description: Zodiac Inflight Innovations
1183 description: ZTE Corp.
1185 description: ZyXEL Communications Corp.
1187 # Normal property name match without a comma
1188 # These should catch all node/property names without a prefix
1189 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1190 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1193 additionalProperties: false