1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|simple-graph-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Abilis Systems
29 description: Abracon Corporation
31 description: Acme Systems srl
33 description: Actions Semiconductor Co., Ltd.
35 description: Active-Semi International Inc
37 description: Avionic Design GmbH
39 description: Adafruit Industries, LLC
41 description: Adapteva, Inc.
43 description: Adaptrum, Inc.
45 description: AD Holdings Plc.
47 description: Analog Devices, Inc.
49 description: Advantech Corporation
50 "^aeroflexgaisler,.*":
51 description: Aeroflex Gaisler AB
53 description: Annapurna Labs
55 description: Allegro DVT
59 description: Allwinner Technology Co., Ltd.
61 description: AlphaScale Integrated Circuits Systems, Inc.
63 description: Alps Electric Co., Ltd.
65 description: Altera Corp.
67 description: Amarula Solutions
69 description: Amazon.com, Inc.
71 description: Applied Micro Circuits Corporation (APM, formally AMCC)
73 description: Advanced Micro Devices (AMD), Inc.
75 description: Shenzhen Amediatech Technology Co., Ltd
77 description: Amlogic, Inc.
79 description: Ampire Co., Ltd.
83 description: AMS-Taos Inc.
85 description: Analogix Semiconductor, Inc.
87 description: Andes Technology Corporation
89 description: Anvo-Systems Dresden GmbH
91 description: Applied Micro Circuits Corporation (APM)
93 description: Aptina Imaging
95 description: Arasan Chip Systems
97 description: ArcherMind Technology (Nanjing) Co., Ltd.
99 description: Arctic Sand
101 description: arcx Inc. / Archronix Inc.
103 description: Aries Embedded GmbH
105 description: ARM Ltd.
107 description: ARMadeus Systems SARL
109 description: Arrow Electronics
111 description: Artesyn Embedded Technologies Inc.
113 description: Asahi Kasei Corp.
115 description: All Sensors Corporation
117 description: ASPEED Technology Inc.
119 description: AsusTek Computer Inc.
121 description: Atlas Scientific LLC
123 description: Atmel Corporation
125 description: AU Optronics Corporation
127 description: Auvidea GmbH
129 description: Avago Technologies
131 description: avia semiconductor
133 description: Shanghai AVIC Optoelectronics Co., Ltd.
135 description: Avnet, Inc.
137 description: Shanghai Awinic Technology Co., Ltd.
139 description: Axentia Technologies AB
141 description: Axis Communications AB
143 description: Azoteq (Pty) Ltd
145 description: Shenzhen AZW Technology Co., Ltd.
147 description: BAIKAL ELECTRONICS, JSC
149 description: BIPAI KEJI LIMITED
151 description: Compass Electronics Group, LLC
153 description: BeagleBoard.org Foundation
155 description: Beckhoff Automation GmbH & Co. KG
157 description: Bitmain Technologies
159 description: BOE Technology Group Co., Ltd.
161 description: Bosch Sensortec GmbH
163 description: Boundary Devices Inc.
165 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
167 description: Broadcom Corporation
169 description: Buffalo, Inc.
171 description: B&R Industrial Automation GmbH
173 description: Bticino International
175 description: CALAO Systems SAS
179 description: Capella Microsystems, Inc
181 description: Cascoda, Ltd.
183 description: Catalyst Semiconductor, Inc.
185 description: Cavium, Inc.
187 description: Cadence Design Systems Inc.
189 description: CDTech(H.K.) Electronics Limited
191 description: CellWise Microelectronics Co., Ltd
193 description: Ceva, Inc.
195 description: Check Point Software Technologies Ltd.
197 description: Chipidea, Inc
201 description: ChipSPARK
203 description: Chrontel, Inc.
205 description: Common Hardware Reference Platform
207 description: Chunghwa Picture Tubes Ltd.
209 description: Chuwi Innovation Ltd.
211 description: Computadora Industrial Abierta Argentina
213 description: Cirrus Logic, Inc.
215 description: Cloud Engines, Inc.
217 description: Chips&Media, Inc.
219 description: Conexant Systems, Inc.
221 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
223 description: CompuLab Ltd.
225 description: CORERIVER Semiconductor Co.,Ltd.
227 description: Chengdu Corpro Technology Co., Ltd.
229 description: Cortina Systems, Inc.
231 description: Cosmic Circuits
233 description: Crane Connectivity Solutions
235 description: Creative Technology Ltd
237 description: Crystalfontz America, Inc.
239 description: Hangzhou C-SKY Microsystems Co., Ltd
241 description: Shenzen Chuangsiqi Technology Co.,Ltd.
243 description: Cubietech, Ltd.
245 description: Cypress Semiconductor Corporation
247 description: CZ.NIC, z.s.p.o.
249 description: Maxim Integrated Products (formerly Dallas Semiconductor)
251 description: DataImage, Inc.
253 description: DAVICOM Semiconductor, Inc.
255 description: Dell Inc.
257 description: Delta Electronics, Inc.
259 description: Denx Software Engineering
261 description: Devantech, Ltd.
263 description: DH electronics GmbH
265 description: Shenzhen Yagu Electronic Technology Co., Ltd.
267 description: Digi International Inc.
269 description: Diglent, Inc.
271 description: Dioo Microcircuit Co., Ltd
273 description: DLC Display Co., Ltd.
275 description: Dialog Semiconductor
277 description: D-Link Corporation
279 description: Data Modul AG
281 description: Domintech Co., Ltd.
283 description: Dongwoon Anatech
285 description: DPTechnics
287 description: Dragino Technology Co., Limited
289 description: dServe Technology B.V.
291 description: Dyna-Image
293 description: Embedded Artists AB
295 description: EBS-SYSTART GmbH
297 description: EBV Elektronik
299 description: Eckelmann AG
301 description: Emerging Display Technologies
303 description: eGalax_eMPIA Technology Inc
305 description: Einfochips
307 description: Elan Microelectronic Corp.
309 description: Elgin S/A.
311 description: Shenzhen Elida Technology Co., Ltd.
313 description: Shenzhen Embest Technology Co., Ltd.
315 description: Emlid, Ltd.
317 description: EM Microelectronic
318 "^empire-electronix,.*":
319 description: Empire Electronix
321 description: emtrion GmbH
323 description: Endless Mobile, Inc.
325 description: ENE Technology, Inc.
327 description: Silicon Laboratories (formerly Energy Micro AS)
329 description: Engicam S.r.l.
331 description: EPCOS AG
333 description: Ecole Polytechnique Fédérale de Lausanne
335 description: Seiko Epson Corp.
337 description: Espressif Systems Co. Ltd.
339 description: ESTeem Wireless Modems
341 description: NI Ettus Research
343 description: Eukréa Electromatique
345 description: Everest Semiconductor Co. Ltd.
347 description: Everspin Technologies, Inc.
349 description: Evervision Electronics Co. Ltd.
351 description: Exar Corporation
355 description: EZchip Semiconductor
357 description: Facebook
359 description: Fairphone B.V.
361 description: Faraday Technology Corporation
363 description: Fastrax Oy
365 description: Fairchild Semiconductor
367 description: Shenzhen Feixin Photoelectic Co., Ltd
369 description: Shenzhen Fly Young Technology Co.,LTD.
373 description: FocalTech Systems Co.,Ltd
375 description: Shenzhen Frida LCD Co., Ltd.
377 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
379 description: Freescale Semiconductor
381 description: Fujitsu Ltd.
383 description: GARDENA GmbH
385 description: Gateworks Corporation
387 description: Game Consoles Worldwide
389 description: General Electric Company
391 description: GeekBuying
393 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
395 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
397 description: Gemei Digital Technology Co., Ltd.
399 description: Geniatech, Inc.
401 description: Giantec Semiconductor, Inc.
403 description: Giantplus Technology Co., Ltd.
405 description: Globalscale Technologies, Inc.
407 description: GlobalTop Technology, Inc.
409 description: Global Mixed-mode Technology, Inc.
411 description: Shenzhen Huiding Technology Co., Ltd.
413 description: Google, Inc.
417 description: Garmin Limited
419 description: Gumstix, Inc.
421 description: Gateworks Corporation
423 description: HannStar Display Corporation
425 description: Haoyu Microelectronic Co. Ltd.
427 description: Hardkernel Co., Ltd
429 description: HiDeep Inc.
431 description: Himax Technologies, Inc.
433 description: Hisilicon Limited.
435 description: Hitachi Ltd.
437 description: Hitex Development Tools
439 description: Holt Integrated Circuits, Inc.
441 description: Honeywell
443 description: Jiangsu HopeRun Software Co., Ltd.
445 description: Hewlett Packard
447 description: HannStar Display Co.
449 description: Holtek Semiconductor, Inc.
451 description: Shenzhen Hugsun Technology Co. Ltd.
453 description: HwaCom Systems Inc.
455 description: Hydis Technologies
457 description: Hyundai Technology
459 description: I2SE GmbH
461 description: International Business Machines (IBM)
463 description: IC Plus Corp.
465 description: Integrated Device Technologies, Inc.
467 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
469 description: ILI Technology Corporation (ILITEK)
471 description: Imagination Technologies Ltd.
473 description: In-Circuit GmbH
475 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
477 description: Infineon Technologies
479 description: Inforce Computing
481 description: InfoVision Optoelectronics Kunshan Co. Ltd.
483 description: Ingenic Semiconductor
485 description: Innolux Corporation
487 description: INSIDE Secure
489 description: Inspur Corporation
491 description: Intel Corporation
493 description: Inter Control Group
495 description: InvenSense Inc.
497 description: Inverse Path
499 description: Iomega Corporation
501 description: ISEE 2007 S.L.
503 description: Intersil
505 description: Integrated Silicon Solutions Inc.
507 description: ITE Tech. Inc.
509 description: ITEAD Intelligent Systems Co.Ltd
511 description: iWave Systems Technologies Pvt. Ltd.
513 description: Japan Display Inc.
515 description: JEDEC Solid State Technology Association
517 description: Shenzhen Jesurun Electronics Business Dept.
519 description: Jiandangjing Technology Co., Ltd.
521 description: Kamstrup A/S
523 description: Ka-Ro electronics GmbH
525 description: Keith & Koep GmbH
527 description: Keymile GmbH
531 description: Kieback & Peter GmbH
533 description: Kinetic Technologies
535 description: King & Display Technology Co., Ltd.
537 description: Kingnovel Technology Co., Ltd.
539 description: Kionix, Inc.
541 description: Rakuten Kobo Inc.
543 description: Kaohsiung Opto-Electronics Inc.
545 description: Kontron S&T AG
547 description: Sutajio Ko-Usagi PTE Ltd.
549 description: Kyocera Corporation
553 description: Laird PLC
555 description: Ketai Huajie Technology Co., Ltd.
557 description: Lantiq Semiconductor
559 description: Lattice Semiconductor
561 description: Shenzhen Leadtek Technology Co., Ltd.
565 description: LEGO Systems A/S
567 description: Shenzhen LeMaker Technology Co., Ltd.
569 description: Lenovo Group Ltd.
571 description: LG Corporation
573 description: LG Display
575 description: Shenzhen Libre Technology Co., Ltd
577 description: Lichee Pi
579 description: Linaro Limited
581 description: LinkSprite Technologies, Inc.
583 description: Belkin International, Inc. (Linksys)
585 description: Linutronix GmbH
587 description: Linux-specific binding
589 description: Linx Technologies
591 description: Linear Technology Corporation
593 description: Logic PD, Inc.
595 description: Logic Technologies Limited
597 description: Longcheer Technology (Shanghai) Co., Ltd.
599 description: Loongson Technology Corporation Limited
601 description: LSI Corp. (LSI Logic)
603 description: Liebherr-Werk Nenzing GmbH
605 description: Linux Automation GmbH
607 description: Macnica Americas
609 description: Mapleboard.org
611 description: Marvell Technology Group Ltd.
613 description: MaxBotix Inc.
615 description: Maxim Integrated Products
617 description: Mobiveil Inc.
621 description: Measurement Specialties
623 description: Mustek Limited
625 description: MediaTek Inc.
627 description: MegaChips
629 description: Shenzhen MeLE Digital Technology Ltd.
631 description: Melexis N.V.
633 description: MELFAS Inc.
635 description: Mellanox Technologies
637 description: MEMSIC Inc.
639 description: Menlo Systems GmbH
641 description: Merrii Technology Co., Ltd.
643 description: Micrel Inc.
645 description: Microchip Technology Inc.
647 description: Micro Crystal AG
649 description: Micron Technology Inc.
651 description: Microsoft Corporation
653 description: MikroElektronika d.o.o.
655 description: MikroTik
657 description: Miniand Tech
659 description: MINIX Technology Ltd.
661 description: MiraMEMS Sensing Technology Co., Ltd.
663 description: Mitsubishi Electric Corporation
665 description: Mosaix Technologies, Inc.
667 description: Motorola, Inc.
669 description: Moxa Inc.
673 description: Monolithic Power Systems Inc.
675 description: mqmaker Inc.
677 description: Marvell Technology Group Ltd.
680 description: Microsemi Corporation
682 description: Micro-Star International Co. Ltd.
684 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
686 description: Multi-Inno Technology Co.,Ltd
688 description: Mundo Reader S.L.
690 description: Murata Manufacturing Co., Ltd.
692 description: Macronix International Co., Ltd.
694 description: MYIR Tech Limited
696 description: National Semiconductor
698 description: NEC LCD Technologies, Ltd.
700 description: Neonode Inc.
704 description: Broadcom Corporation (formerly NetLogic Microsystems)
706 description: Netron DY
708 description: Shenzhen Netxeon Technology CO., LTD
710 description: Guangdong Neweast Optoelectronics CO., LTD
714 description: Next Thing Co.
716 description: Newhaven Display International
718 description: National Instruments
720 description: Nintendo
722 description: NLT Technologies, Ltd.
726 description: Nordic Semiconductor
728 description: NovTech, Inc.
730 description: NutsBoard
732 description: Nuvoton Technology Corporation
734 description: New Vision Display
738 description: NXP Semiconductors
740 description: Oceanic Systems (UK) Ltd.
742 description: Okaya Electric America, Inc.
744 description: Oki Electric Industry Co., Ltd.
746 description: OLIMEX Ltd.
748 description: One Laptop Per Child
750 description: Onion Corporation
752 description: ON Semiconductor Corp.
754 description: On Tat Industrial Company
756 description: Opal Kelly Incorporated
758 description: OpenCores.org
760 description: OpenRISC.io
762 description: Option NV
764 description: Shenzhen Oranth Technology Co., Ltd.
766 description: Oracle Corporation
768 description: Orise Technology
770 description: Ortus Technology Co., Ltd.
772 description: OSD Displays
774 description: Overkiz SAS
776 description: OmniVision Technologies
778 description: Oxford Semiconductor, Ltd.
780 description: OzzMaker
782 description: Panasonic Corporation
784 description: Parade Technologies Inc.
786 description: Parallax Inc.
788 description: Precision Design Associates, Inc.
790 description: Pericom Technology Inc.
792 description: Pervasive Displays, Inc.
794 description: PHICOMM Co., Ltd.
796 description: PHYTEC Messtechnik GmbH
798 description: Picochip Ltd
802 description: Shenzhen PineRiver Designs Co., Ltd.
804 description: PIXCIR MICROELECTRONICS Co., Ltd
806 description: Plantower Co., Ltd
808 description: Plat\'Home Co., Ltd.
812 description: Broadcom Corporation (formerly PLX Technology)
814 description: PNI Sensor Corporation
816 description: PocketBook International SA
818 description: Polaroid Corporation
820 description: Portwell Inc.
822 description: Poslab Technology Co., Ltd.
824 description: Point of View International B.V.
826 description: PowerVR (deprecated, use img)
828 description: Primux Trading, S.L.
830 description: PROBOX2 (by W2COMP Co., Ltd.)
832 description: Protonic Holland
834 description: PulsedLight, Inc
836 description: Purism, SPC
838 description: Qualcomm Atheros, Inc.
840 description: Qualcomm Technologies, Inc
842 description: QEMU, a generic and open source machine emulator and virtualizer
844 description: Qi Hardware
846 description: Chengdu Kaixuan Information Technology Co., Ltd.
848 description: QiaoDian XianShi Corporation
850 description: QNAP Systems, Inc.
854 description: RaidSonic Technology GmbH
856 description: Mediatek/Ralink Technology Corp.
858 description: Ramtron International
860 description: Raspberry Pi Foundation
862 description: Raydium Semiconductor Corp.
864 description: Unisoc Communications, Inc.
866 description: Realtek Semiconductor Corp.
868 description: Renesas Electronics Corporation
870 description: Shenzhen Rervision Technology Co., Ltd.
872 description: Richtek Technology Corporation
874 description: Ricoh Co. Ltd.
876 description: Rikomagic Tech Corp. Ltd
878 description: RISC-V Foundation
880 description: Fuzhou Rockchip Electronics Co., Ltd
882 description: ROCKTECH DISPLAYS LIMITED
884 description: ROHM Semiconductor Co., Ltd
886 description: Ronbo Electronics
888 description: Shenzhen Roofull Technology Co, Ltd
890 description: Samsung Semiconductor
892 description: Samtec/Softing company
894 description: Sancloud Ltd
896 description: Sandisk Corporation
898 description: Satoz International Co., Ltd
900 description: Smart Battery System
902 description: Schindler
904 description: Seagate Technology PLC
906 description: Shenzhen SEI Robotics Co., Ltd
908 description: Semtech Corporation
910 description: Sensirion AG
912 description: Sensortek Technology Corporation
914 description: Small Form Factor Committee
916 description: Solomon Goldentek Display Corporation
918 description: SG Micro Corp
920 description: SGX Sensortech
922 description: Sharp Corporation
924 description: Shimafuji Electric, Inc.
926 description: Shiratech Solutions
928 description: Si-En Technology Ltd.
930 description: Silicon Linux Corporation
932 description: SiFive, Inc.
934 description: Sigma Designs, Inc.
936 description: Seiko Instruments, Inc.
938 description: Silicon Image
940 description: Silicon Laboratories
942 description: Silead Inc.
944 description: Silergy Corp.
946 description: Silex Insight
948 description: Silicon Mitus, Inc.
950 description: Cypress Semiconductor Corporation (Simtek Corporation)
952 description: Sinlinx Electronics Technology Co., LTD
954 description: SinoVoip Co., Ltd
956 description: Shenzhen Sipeed Technology Co., Ltd.
958 description: SiRF Technology, Inc.
960 description: Silicon Integrated Systems Corp.
962 description: Sitronix Technology Corporation
964 description: Skyworks Solutions, Inc.
966 description: SmartLabs LLC
968 description: Standard Microsystems Corporation
970 description: Synopsys, Inc.
972 description: Shenzhen SoChip Technology Co., Ltd.
974 description: Socionext Inc.
976 description: SolidRun
978 description: Solomon Systech Limited
980 description: Sony Corporation
982 description: Spansion Inc.
984 description: Spreadtrum Communications Inc.
986 description: Silicon Storage Technology, Inc.
988 description: STMicroelectronics
990 description: Starry Electronic Technology (ShenZhen) Co., LTD
994 description: ST-Ericsson
997 description: ST-Ericsson
999 description: ST-Ericsson
1002 description: Summit microelectronics
1004 description: Shenzhen Sunchip Technology Co., Ltd
1006 description: Sun Microsystems, Inc
1008 description: Sierra Wireless
1010 description: Synaptics Inc.
1012 description: Synology, Inc.
1014 description: TBS Technologies
1015 "^tbs-biometrics,.*":
1016 description: Touchless Biometric Systems AG
1018 description: Trusted Computing Group
1020 description: Toby Churchill Ltd.
1022 description: TechNexion
1024 description: Technologic Systems
1026 description: Tempo Semiconductor
1028 description: Shenzhen Techstar Electronics Co., Ltd.
1030 description: Terasic Inc.
1032 description: Three Five Corp
1034 description: THine Electronics, Inc.
1036 description: Texas Instruments
1038 description: Tianma Micro-electronics Co., Ltd.
1040 description: Trusted Logic Mobility
1042 description: Tecon Microprocessor Technologies, LLC.
1046 description: TPO (deprecated, use tpo)
1049 description: Topwise Communication Co., Ltd.
1051 description: Toradex AG
1053 description: Toshiba Corporation
1057 description: TPK U.S.A. LLC
1059 description: TP-LINK Technologies Co., Ltd.
1063 description: TQ Systems GmbH
1067 description: Tronsmart
1069 description: Truly Semiconductors Limited
1071 description: Visionox
1073 description: Theobroma Systems Design und Consulting GmbH
1075 description: Tyan Computer Corporation
1079 description: U-Boot bootloader
1081 description: uCRobotics
1083 description: Ubiquiti Networks
1087 description: Ugoos Industrial Co., Ltd.
1089 description: United Western Technologies Corp (UniWest)
1091 description: uPI Semiconductor Corp.
1093 description: United Radiant Technology Corporation
1095 description: Universal Scientific Industrial Co., Ltd.
1097 description: Aigo Digital Technology Co., Ltd.
1099 description: V3 Semiconductor
1101 description: Vaisala
1103 description: Vamrs Ltd.
1105 description: Variscite Ltd.
1107 description: VIA Technologies, Inc.
1109 description: Videostrong Technology Co., Ltd.
1111 description: Virtual I/O Device Specification, developed by the OASIS consortium
1113 description: Vishay Intertechnology, Inc
1115 description: Vitesse Semiconductor Corporation
1117 description: Vivante Corporation
1119 description: VoCore Studio
1121 description: Voipac Technologies s.r.o.
1123 description: Vision Optical Technology Co., Ltd.
1125 description: VXT Ltd
1127 description: Waveshare Electronics
1129 description: Western Digital Corp.
1131 description: Würth Elektronik GmbH.
1133 description: WeTek Electronics, limited.
1137 description: Shenzhen whwave Electronics, Inc.
1139 description: Wi2Wi, Inc.
1141 description: Winbond Electronics corp.
1143 description: Winstar Display Corp.
1145 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1147 description: Wolfson Microelectronics
1149 description: Wondermedia Technologies, Inc.
1153 description: X-Powers
1155 description: Extreme Engineering Solutions (X-ES)
1157 description: Xiaomi Technology Co., Ltd.
1159 description: Xillybus Ltd.
1161 description: Shenzhen Xinpeng Technology Co., Ltd
1167 description: Shenzhen Xunlong Software CO.,Limited
1171 description: YSH & ATIL
1172 "^yones-toptech,.*":
1173 description: Yones Toptech Co., Ltd.
1175 description: Y Soft Corporation a.s.
1177 description: Zarlink Semiconductor
1179 description: ZEITEC Semiconductor Co., LTD.
1181 description: Shenzhen Zidoo Technology Co., Ltd.
1183 description: Zodiac Inflight Innovations
1185 description: ZTE Corp.
1187 description: ZyXEL Communications Corp.
1189 # Normal property name match without a comma
1190 # These should catch all node/property names without a prefix
1191 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1192 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1195 additionalProperties: false