1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|bm|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio-key|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Baiwen.com (100ask).
29 description: 70mai Co., Ltd.
31 description: 8devices, UAB
35 description: Abilis Systems
37 description: Abracon Corporation
39 description: ShenZhen Asia Better Technology Ltd.
41 description: Acer Inc.
43 description: Acme Systems srl
45 description: Actions Semiconductor Co., Ltd.
47 description: Active-Semi International Inc
49 description: Avionic Design GmbH
51 description: Adafruit Industries, LLC
53 description: Adapteva, Inc.
55 description: Adaptrum, Inc.
57 description: AD Holdings Plc.
59 description: Analog Devices, Inc.
61 description: Advantech Corporation
62 "^aeroflexgaisler,.*":
63 description: Aeroflex Gaisler AB
65 description: AESOP Embedded Forum
69 description: Annapurna Labs
73 description: Aldec, Inc.
75 description: ALFA Network Inc.
77 description: Allegro DVT
81 description: Allwinner Technology Co., Ltd.
83 description: AlphaScale Integrated Circuits Systems, Inc.
85 description: Alps Electric Co., Ltd.
87 description: Altus-Escon-Company BV
89 description: Altera Corp.
91 description: Amarula Solutions
93 description: Amazon.com, Inc.
95 description: Applied Micro Circuits Corporation (APM, formally AMCC)
97 description: Advanced Micro Devices (AMD), Inc.
99 description: Shenzhen Amediatech Technology Co., Ltd
101 description: Amlogic, Inc.
103 description: Ampere Computing LLC
105 description: Ampire Co., Ltd.
109 description: AMS-Taos Inc.
111 description: Analogix Semiconductor, Inc.
113 description: Anbernic
115 description: Andes Technology Corporation
117 description: Anvo-Systems Dresden GmbH
119 description: Applied Micro Circuits Corporation (APM)
121 description: Apple Inc.
123 description: Aptina Imaging
125 description: Arasan Chip Systems
127 description: ArcherMind Technology (Nanjing) Co., Ltd.
129 description: Arctic Sand
131 description: arcx Inc. / Archronix Inc.
133 description: Aries Embedded GmbH
135 description: ARM Ltd.
137 description: ARMadeus Systems SARL
139 description: Arrow Electronics
141 description: Artesyn Embedded Technologies Inc.
143 description: Asahi Kasei Corp.
145 description: All Sensors Corporation
147 description: ASIX Electronics Corporation
149 description: ASPEED Technology Inc.
151 description: ASRock Inc.
153 description: AsusTek Computer Inc.
155 description: Qualcomm Atheros, Inc. (deprecated, use qca)
158 description: Atlas Scientific LLC
160 description: Atmel Corporation
162 description: AU Optronics Corporation
164 description: Auvidea GmbH
166 description: Avago Technologies
168 description: avia semiconductor
170 description: Shanghai AVIC Optoelectronics Co., Ltd.
172 description: Avnet, Inc.
174 description: Shanghai Awinic Technology Co., Ltd.
176 description: Axentia Technologies AB
178 description: Axis Communications AB
180 description: Azoteq (Pty) Ltd
182 description: Shenzhen AZW Technology Co., Ltd.
184 description: BAIKAL ELECTRONICS, JSC
186 description: BIPAI KEJI LIMITED
188 description: Compass Electronics Group, LLC
190 description: BeagleBoard.org Foundation
192 description: Beckhoff Automation GmbH & Co. KG
194 description: Bitmain Technologies
196 description: BluTek Power
198 description: BOE Technology Group Co., Ltd.
200 description: Bosch Sensortec GmbH
202 description: Boundary Devices Inc.
204 description: Broadcom Corporation
206 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
208 description: BSH Hausgeraete GmbH
210 description: Bticino International
212 description: Buffalo, Inc.
214 description: B&R Industrial Automation GmbH
216 description: ByteDance Ltd.
218 description: CalAmp Corp.
220 description: CALAO Systems SAS
224 description: Canaan, Inc.
226 description: Caninos Loucos Program
228 description: Capella Microsystems, Inc
230 description: Cascoda, Ltd.
232 description: Catalyst Semiconductor, Inc.
234 description: Cavium, Inc.
236 description: Cadence Design Systems Inc.
238 description: CDTech(H.K.) Electronics Limited
240 description: CellWise Microelectronics Co., Ltd
242 description: Ceva, Inc.
244 description: chargebyte GmbH
246 description: Check Point Software Technologies Ltd.
248 description: Chefree Technology Corp.
250 description: Chipidea, Inc
254 description: ChipSPARK
256 description: Shenzhen Chongzhou Electronic Technology Co., Ltd
258 description: Chrontel, Inc.
260 description: Common Hardware Reference Platform
262 description: Chunghwa Picture Tubes Ltd.
264 description: Chuwi Innovation Ltd.
266 description: Computadora Industrial Abierta Argentina
268 description: Cirrus Logic, Inc.
270 description: Cisco Systems, Inc.
272 description: Clockwork Tech LLC
274 description: Carl Cloos Schweisstechnik GmbH.
276 description: Cloud Engines, Inc.
278 description: Chips&Media, Inc.
280 description: Conexant Systems, Inc.
282 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
284 description: CompuLab Ltd.
286 description: congatec GmbH
288 description: CORERIVER Semiconductor Co.,Ltd.
290 description: Chengdu Corpro Technology Co., Ltd.
292 description: Cortina Systems, Inc.
294 description: Cosmic Circuits
296 description: Crane Connectivity Solutions
298 description: Creative Technology Ltd
300 description: Crystalfontz America, Inc.
302 description: Hangzhou C-SKY Microsystems Co., Ltd
304 description: Shenzen Chuangsiqi Technology Co.,Ltd.
306 description: CTERA Networks Intl.
308 description: Czech Technical University in Prague
310 description: Cubietech, Ltd.
312 description: CUI Devices
314 description: Cypress Semiconductor Corporation
316 description: Shenzhen CYX Industrial Co., Ltd
318 description: CZ.NIC, z.s.p.o.
320 description: Maxim Integrated Products (formerly Dallas Semiconductor)
322 description: DataImage, Inc.
324 description: DAVICOM Semiconductor, Inc.
326 description: Dell Inc.
328 description: Delta Electronics, Inc.
330 description: Densitron Technologies Ltd
332 description: Denx Software Engineering
334 description: Devantech, Ltd.
336 description: DFI Inc.
338 description: DH electronics GmbH
340 description: Shenzhen Yagu Electronic Technology Co., Ltd.
342 description: Digi International Inc.
344 description: Diglent, Inc.
346 description: Diodes, Inc.
348 description: Dioo Microcircuit Co., Ltd
350 description: DLC Display Co., Ltd.
352 description: Dialog Semiconductor
354 description: D-Link Corporation
356 description: Data Modul AG
358 description: Domintech Co., Ltd.
360 description: Dongwoon Anatech
362 description: DPTechnics
364 description: Dragino Technology Co., Limited
366 description: DaSheng, Inc.
368 description: dServe Technology B.V.
370 description: Dyna-Image
372 description: Embedded Artists AB
374 description: Zhejiang Ebang Communication Co., Ltd
378 description: EBS-SYSTART GmbH
380 description: EBV Elektronik
382 description: Eckelmann AG
384 description: Edgeble AI Technologies Pvt. Ltd.
386 description: EDIMAX Technology Co., Ltd
388 description: Emerging Display Technologies
390 description: eGalax_eMPIA Technology Inc
392 description: Einfochips
394 description: E Ink Corporation
396 description: Elan Microelectronic Corp.
398 description: Element14 (A Premier Farnell Company)
400 description: Elgin S/A.
402 description: Shenzhen Elida Technology Co., Ltd.
404 description: Elimo Engineering Ltd.
406 description: Elpida Memory, Inc.
408 description: Dongguan EmbedFire Electronic Technology Co., Ltd.
410 description: Shenzhen Embest Technology Co., Ltd.
412 description: Emlid, Ltd.
414 description: EM Microelectronic
415 "^empire-electronix,.*":
416 description: Empire Electronix
418 description: emtrion GmbH
420 description: Enclustra GmbH
422 description: Endless Mobile, Inc.
424 description: ENE Technology, Inc.
426 description: Silicon Laboratories (formerly Energy Micro AS)
428 description: Engicam S.r.l.
430 description: Engleder
432 description: EPCOS AG
434 description: Ecole Polytechnique Fédérale de Lausanne
436 description: Seiko Epson Corp.
438 description: Espressif Systems Co. Ltd.
440 description: ESTeem Wireless Modems
442 description: NI Ettus Research
444 description: Eukréa Electromatique
446 description: Everest Semiconductor Co. Ltd.
448 description: Everspin Technologies, Inc.
450 description: Evervision Electronics Co. Ltd.
452 description: Exar Corporation
456 description: Exegin Technologies Limited
458 description: EZchip Semiconductor
460 description: Facebook
462 description: Fairphone B.V.
464 description: Faraday Technology Corporation
466 description: Fastrax Oy
468 description: Fairchild Semiconductor
470 description: Shenzhen Feixin Photoelectic Co., Ltd
472 description: Shenzhen Fly Young Technology Co.,LTD.
474 description: Foxconn Industrial Internet
478 description: FocalTech Systems Co.,Ltd
480 description: Baoding Forlinx Embedded Technology Co., Ltd.
482 description: Shenzhen Frida LCD Co., Ltd.
484 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
486 description: Freescale Semiconductor
488 description: Fujitsu Ltd.
490 description: FX Technology Ltd.
492 description: GARDENA GmbH
494 description: Gateworks Corporation
496 description: Game Consoles Worldwide
498 description: General Electric Company
500 description: GeekBuying
502 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
504 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
506 description: Gemei Digital Technology Co., Ltd.
508 description: Genesys Logic, Inc.
510 description: Geniatech, Inc.
512 description: Giantec Semiconductor, Inc.
514 description: Giantplus Technology Co., Ltd.
516 description: Globalscale Technologies, Inc.
518 description: GlobalTop Technology, Inc.
520 description: Global Mixed-mode Technology, Inc.
522 description: Golden Delicious Computers GmbH & Co. KG
524 description: Shenzhen Huiding Technology Co., Ltd.
526 description: Google, Inc.
532 description: Garmin Limited
534 description: Gumstix, Inc.
536 description: Gateworks Corporation
537 use "gateworks" vendor prefix
540 description: HannStar Display Corporation
542 description: Shenzhen Haochuangyi Technology Co.,Ltd
544 description: Haoyu Microelectronic Co. Ltd.
546 description: Hardkernel Co., Ltd
548 description: Shenzhen Hechuang Intelligent Co.
550 description: HiDeep Inc.
552 description: Himax Technologies, Inc.
554 description: Hirschmann Automation and Control GmbH
556 description: HiSilicon Limited (deprecated, use hisilicon)
559 description: HiSilicon Limited.
561 description: Hitachi Ltd.
563 description: Hitex Development Tools
565 description: Holt Integrated Circuits, Inc.
567 description: Holtek Semiconductor, Inc.
569 description: Honestar Technologies Co., Ltd.
571 description: Honeywell
573 description: Jiangsu HopeRun Software Co., Ltd.
575 description: Hewlett Packard Inc.
577 description: Hewlett Packard Enterprise
579 description: HannStar Display Co.
581 description: Huawei Technologies Co., Ltd.
583 description: Shenzhen Hugsun Technology Co. Ltd.
585 description: HwaCom Systems Inc.
587 description: HXT Semiconductor
589 description: Hycon Technology Corp.
591 description: Hydis Technologies
593 description: Shanghai Hynitron Microelectronics Co. Ltd.
595 description: SK Hynix Inc.
597 description: Hyundai Technology
599 description: I2SE GmbH
601 description: International Business Machines (IBM)
603 description: IC Plus Corp.
605 description: Integrated Device Technologies, Inc.
607 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
609 description: ILI Technology Corporation (ILITEK)
611 description: Imagis Technologies Co., Ltd.
613 description: Imagination Technologies Ltd.
615 description: Integrated Micro-Electronics Inc.
617 description: In-Circuit GmbH
619 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
621 description: Infineon Technologies
623 description: Inforce Computing
625 description: Ingenic Semiconductor
627 description: Ingrasys Technology Inc.
629 description: Injoinic Technology Corp.
631 description: InnoComm Mobile Technology Corp.
633 description: Innolux Corporation
635 description: INSIDE Secure
637 description: Insignal Ltd.
639 description: Inspur Corporation
641 description: Intel Corporation
643 description: Inter Control Group
645 description: InvenSense Inc.
647 description: Inventec
649 description: Inverse Path
651 description: Iomega Corporation
653 description: Iron Device Corporation
655 description: ISEE 2007 S.L.
657 description: Intersil
659 description: Integrated Silicon Solutions Inc.
661 description: ITE Tech. Inc.
663 description: ITEAD Intelligent Systems Co.Ltd
665 description: ITian Corporation
667 description: InfoVision Optoelectronics Kunshan Co. Ltd.
669 description: iWave Systems Technologies Pvt. Ltd.
671 description: Jadard Technology Inc.
673 description: Japan Display Inc.
675 description: JEDEC Solid State Technology Association
677 description: Shenzhen Jesurun Electronics Business Dept.
679 description: JetHome (IP Sokolov P.A.)
681 description: Jiandangjing Technology Co., Ltd.
685 description: Kamstrup A/S
687 description: Ka-Ro electronics GmbH
689 description: Keith & Koep GmbH
691 description: Keymile GmbH
695 description: Kieback & Peter GmbH
697 description: Kinetic Technologies
699 description: King & Display Technology Co., Ltd.
701 description: Kingnovel Technology Co., Ltd.
703 description: Kionix, Inc.
705 description: Rakuten Kobo Inc.
707 description: Kobol Innovations Pte. Ltd.
709 description: Kaohsiung Opto-Electronics Inc.
711 description: Kontron S&T AG
713 description: Sutajio Ko-Usagi PTE Ltd.
715 description: Kverneland Group
717 description: Kyocera Corporation
721 description: Laird PLC
723 description: Ketai Huajie Technology Co., Ltd.
725 description: Lantiq Semiconductor
727 description: Lattice Semiconductor
729 description: Shenzen LC Technology Co., Ltd.
731 description: Shenzhen Leadtek Technology Co., Ltd.
735 description: LEGO Systems A/S
737 description: Shenzhen LeMaker Technology Co., Ltd.
739 description: Lenovo Group Ltd.
741 description: LG Corporation
743 description: LG Display
745 description: Shenzhen Libre Technology Co., Ltd
747 description: Lichee Pi
749 description: Linaro Limited
750 "^lineartechnology,.*":
751 description: Linear Technology
753 description: LinkSprite Technologies, Inc.
755 description: Belkin International, Inc. (Linksys)
757 description: Linutronix GmbH
759 description: Linux-specific binding
761 description: Linx Technologies
763 description: LITE-ON Technology Corp.
765 description: LiteX SoC builder
767 description: Linear Technology Corporation
769 description: Logic PD, Inc.
771 description: Logic Technologies Limited
773 description: Longcheer Technology (Shanghai) Co., Ltd.
775 description: Lontium Semiconductor Corporation
777 description: Loongson Technology Corporation Limited
779 description: LSI Corp. (LSI Logic)
781 description: Liebherr-Werk Nenzing GmbH
783 description: Linux Automation GmbH
787 description: Macnica Americas
789 description: Mantix Display Technology Co.,Ltd.
791 description: Mapleboard.org
793 description: Marvell Technology Group Ltd.
795 description: MaxBotix Inc.
797 description: Maxim Integrated Products
799 description: MaxLinear Inc.
801 description: Mobiveil Inc.
805 description: Measurement Specialties
807 description: Mustek Limited
809 description: MediaTek Inc.
811 description: MegaChips
813 description: Shenzhen MeLE Digital Technology Ltd.
815 description: Melexis N.V.
817 description: MELFAS Inc.
819 description: Mellanox Technologies
821 description: MEMSensing Microsystems Co., Ltd.
823 description: MEMSIC Inc.
825 description: Menlo Systems GmbH
827 description: Mentor Graphics
829 description: Cisco Meraki, LLC
831 description: Merrii Technology Co., Ltd.
833 description: Methode Electronics, Inc.
835 description: Micrel Inc.
837 description: Microchip Technology Inc.
839 description: Micro Crystal AG
841 description: Micron Technology Inc.
843 description: Microsoft Corporation
845 description: MicroSys Electronics GmbH
847 description: MikroElektronika d.o.o.
849 description: MikroTik
851 description: Miniand Tech
853 description: MINIX Technology Ltd.
855 description: MiraMEMS Sensing Technology Co., Ltd.
857 description: Mitsubishi Electric Corporation
859 description: Mixel, Inc.
863 description: MNT Research GmbH
865 description: Modtronix Engineering
867 description: Moortec Semiconductor Ltd.
869 description: Mosaix Technologies, Inc.
871 description: MotorComm, Inc.
873 description: Motorola, Inc.
875 description: Moxa Inc.
879 description: Monolithic Power Systems Inc.
881 description: mqmaker Inc.
883 description: Marvell Technology Group Ltd.
886 description: Microsemi Corporation
888 description: Micro-Star International Co. Ltd.
890 description: MStar Semiconductor, Inc. (acquired by MediaTek Inc.)
892 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
894 description: Multi-Inno Technology Co.,Ltd
896 description: Mundo Reader S.L.
898 description: Murata Manufacturing Co., Ltd.
900 description: Macronix International Co., Ltd.
903 description: Macronix International Co., Ltd.
905 description: MYIR Tech Limited
907 description: National Semiconductor
909 description: NEC LCD Technologies, Ltd.
911 description: Neonode Inc.
915 description: Broadcom Corporation (formerly NetLogic Microsystems)
917 description: Netron DY
919 description: Netronix, Inc.
921 description: Shenzhen Netxeon Technology CO., LTD
923 description: Guangdong Neweast Optoelectronics CO., LTD
925 description: Newhaven Display International
927 description: New Vision Display (Shenzhen) Co., Ltd.
931 description: Next Thing Co.
933 description: National Instruments
935 description: Nintendo
937 description: NLT Technologies, Ltd.
941 description: Nordic Semiconductor
943 description: NovTech, Inc.
945 description: NutsBoard
947 description: Nuvoton Technology Corporation
949 description: New Vision Display
953 description: NXP Semiconductors
955 description: Oceanic Systems (UK) Ltd.
957 description: Orient Chip Technology Co., Ltd.
959 description: Octavo Systems LLC
961 description: Okaya Electric America, Inc.
963 description: Oki Electric Industry Co., Ltd.
965 description: OLIMEX Ltd.
967 description: One Laptop Per Child
969 description: OnePlus Technology (Shenzhen) Co., Ltd.
971 description: Open Network Install Environment group
973 description: Onion Corporation
975 description: ON Semiconductor Corp.
977 description: On Tat Industrial Company
979 description: Opal Kelly Incorporated
981 description: openailab.com
983 description: OpenCores.org
985 description: OpenEmbed
987 description: OpenPandora GmbH
989 description: OpenRISC.io
991 description: Option NV
993 description: Shenzhen Oranth Technology Co., Ltd.
995 description: Oracle Corporation
997 description: Orise Technology
999 description: Ortus Technology Co., Ltd.
1001 description: OSD Displays
1003 description: Sam Nazarko Trading Ltd. (Open Source Media Centre)
1005 description: Ouya Inc.
1007 description: Overkiz SAS
1009 description: OmniVision Technologies
1011 description: Oxford Semiconductor, Ltd.
1013 description: OzzMaker
1015 description: Panasonic Corporation
1017 description: Parade Technologies Inc.
1019 description: Parallax Inc.
1021 description: Precision Design Associates, Inc.
1023 description: Pericom Technology Inc.
1025 description: Pervasive Displays, Inc.
1027 description: PHICOMM Co., Ltd.
1029 description: PHYTEC Messtechnik GmbH
1031 description: Picochip Ltd
1035 description: Shenzhen PineRiver Designs Co., Ltd.
1037 description: PIXCIR MICROELECTRONICS Co., Ltd
1039 description: Plantower Co., Ltd
1041 description: Plat\'Home Co., Ltd.
1045 description: Broadcom Corporation (formerly PLX Technology)
1047 description: Plymovent Group BV
1049 description: PNI Sensor Corporation
1051 description: PocketBook International SA
1053 description: Polaroid Corporation
1055 description: Polyhex Technology Co. Ltd.
1057 description: Portwell Inc.
1059 description: Poslab Technology Co., Ltd.
1061 description: Point of View International B.V.
1063 description: Powertip Tech. Corp.
1065 description: PowerVR (deprecated, use img)
1067 description: Primux Trading, S.L.
1069 description: PROBOX2 (by W2COMP Co., Ltd.)
1071 description: Protonic Holland
1073 description: PulsedLight, Inc
1075 description: Purism, SPC
1077 description: Qualcomm Atheros, Inc.
1079 description: Qualcomm Technologies, Inc
1081 description: QEMU, a generic and open source machine emulator and virtualizer
1083 description: Qi Hardware
1085 description: QiaoDian XianShi Corporation
1087 description: Chengdu Kaixuan Information Technology Co., Ltd.
1089 description: Shenzhen QiShenglong Industrialist Co., Ltd.
1091 description: QNAP Systems, Inc.
1093 description: Quanta Computer Inc.
1097 description: RaidSonic Technology GmbH
1099 description: Mediatek/Ralink Technology Corp.
1101 description: Ramtron International
1103 description: Raspberry Pi Foundation
1105 description: Raydium Semiconductor Corp.
1107 description: Unisoc Communications, Inc.
1109 description: Realtek Semiconductor Corp.
1111 description: reMarkable AS
1113 description: Renesas Electronics Corporation
1115 description: Shenzhen Rervision Technology Co., Ltd.
1117 description: Revolution Robotics, Inc. (Revotics)
1119 description: iMX6 Rex Project
1121 description: Richtek Technology Corporation
1123 description: Ricoh Co. Ltd.
1125 description: Rikomagic Tech Corp. Ltd
1127 description: Embest RIoT
1129 description: RISC-V Foundation
1131 description: Fuzhou Rockchip Electronics Co., Ltd
1133 description: ROCKTECH DISPLAYS LIMITED
1135 description: ROHM Semiconductor Co., Ltd
1137 description: Ronbo Electronics
1139 description: Shenzhen Roofull Technology Co, Ltd
1141 description: RoseapplePi.org
1143 description: Samsung Semiconductor
1145 description: Samtec/Softing company
1147 description: Sancloud Ltd
1149 description: Sandisk Corporation
1151 description: Satoz International Co., Ltd
1153 description: Smart Battery System
1155 description: Schindler
1157 description: Seagate Technology PLC
1159 description: Seeed Technology Co., Ltd
1161 description: Shenzhen SEI Robotics Co., Ltd
1163 description: Semtech Corporation
1165 description: Senseair AB
1167 description: Sensirion AG
1169 description: Sensortek Technology Corporation
1171 description: Sercomm (Suzhou) Corporation
1173 description: Small Form Factor Committee
1175 description: Solomon Goldentek Display Corporation
1177 description: SG Micro Corp
1179 description: SGX Sensortech
1181 description: Sharp Corporation
1183 description: SHIFT GmbH
1185 description: Shimafuji Electric, Inc.
1187 description: Shiratech Solutions
1189 description: Si-En Technology Ltd.
1191 description: Silicon Linux Corporation
1193 description: Siemens AG
1195 description: SiFive, Inc.
1197 description: Sigma Designs, Inc.
1199 description: Seiko Instruments, Inc.
1201 description: Silicon Image
1203 description: Silicon Laboratories
1205 description: Hangzhou Silan Microelectronics Co., Ltd.
1207 description: Silead Inc.
1209 description: Silergy Corp.
1210 "^silex-insight,.*":
1211 description: Silex Insight
1213 description: Siliconfile Technologies lnc.
1215 description: Silicon Mitus, Inc.
1217 description: Silvaco, Inc.
1219 description: Cypress Semiconductor Corporation (Simtek Corporation)
1221 description: Sinlinx Electronics Technology Co., LTD
1223 description: SinoVoip Co., Ltd
1225 description: SINO WEALTH Electronic Ltd.
1227 description: Shenzhen Sipeed Technology Co., Ltd.
1229 description: SiRF Technology, Inc.
1231 description: Silicon Integrated Systems Corp.
1233 description: Sitronix Technology Corporation
1235 description: SKOV A/S
1237 description: Skyworks Solutions, Inc.
1239 description: SmartLabs LLC
1241 description: Standard Microsystems Corporation
1243 description: Synopsys, Inc.
1245 description: Shenzhen SoChip Technology Co., Ltd.
1247 description: Socionext Inc.
1249 description: SolidRun
1251 description: Solomon Systech Limited
1253 description: Sony Corporation
1255 description: Source Parts Inc.
1257 description: Spansion Inc.
1259 description: SparkFun Electronics
1261 description: SpinalHDL
1263 description: Spreadtrum Communications Inc.
1265 description: SSI Computer Corp
1267 description: Silicon Storage Technology, Inc.
1269 description: Xiamen Xingchen(SigmaStar) Technology Co., Ltd.
1270 (formerly part of MStar Semiconductor, Inc.)
1272 description: STMicroelectronics
1274 description: StarFive Technology Co. Ltd.
1276 description: Starry Electronic Technology (ShenZhen) Co., LTD
1278 description: Startek
1280 description: Starterkit
1282 description: ST-Ericsson
1285 description: ST-Ericsson
1287 description: ST-Ericsson
1290 description: StorLink Semiconductors, Inc.
1292 description: Storm Semiconductor, Inc.
1294 description: Storopack
1296 description: Summit microelectronics
1298 description: Shenzhen Sunchip Technology Co., Ltd
1300 description: Sundance DSP Inc.
1302 description: Sunplus Technology Co., Ltd.
1304 description: Sun Microsystems, Inc
1306 description: Super Micro Computer, Inc.
1308 description: Sierra Wireless
1310 description: Synaptics Inc.
1312 description: Synology, Inc.
1314 description: Synopsys, Inc. (deprecated, use snps)
1317 description: TBS Technologies
1318 "^tbs-biometrics,.*":
1319 description: Touchless Biometric Systems AG
1321 description: Trusted Computing Group
1323 description: Toby Churchill Ltd.
1325 description: Shenzhen City Tang Cheng Technology Co., Ltd.
1327 description: Shangai Top Display Optoelectronics Co., Ltd
1328 "^team-source-display,.*":
1329 description: Shenzhen Team Source Display Technology Co., Ltd. (TSD)
1331 description: TechNexion
1333 description: Technologic Systems
1335 description: Shenzhen Techstar Electronics Co., Ltd.
1337 description: Teltonika Networks
1339 description: Tempo Semiconductor
1341 description: Terasic Inc.
1343 description: Tesla, Inc.
1345 description: Three Five Corp
1347 description: T-Head Semiconductor Co., Ltd.
1349 description: THine Electronics, Inc.
1351 description: thingy.jp
1353 description: Thundercomm Technology Co., Ltd.
1355 description: Shenzhen Tong Heng Wei Chuang Technology Co., Ltd.
1357 description: Texas Instruments
1359 description: Tianma Micro-electronics Co., Ltd.
1361 description: Trusted Logic Mobility
1363 description: Tecon Microprocessor Technologies, LLC.
1367 description: Topic Embedded Systems
1369 description: TPO (deprecated, use tpo)
1372 description: Topwise Communication Co., Ltd.
1374 description: Toradex AG
1376 description: Toshiba Corporation
1380 description: TPK U.S.A. LLC
1382 description: TP-LINK Technologies Co., Ltd.
1386 description: TQ-Systems GmbH
1388 description: Traverse Technologies Australia Pty Ltd
1392 description: Tronsmart
1394 description: Truly Semiconductors Limited
1396 description: Theobroma Systems Design und Consulting GmbH
1398 description: Tyan Computer Corporation
1402 description: U-Boot bootloader
1404 description: Ubiquiti Networks
1406 description: uCRobotics
1410 description: Ufi Space Co., Ltd.
1412 description: Ugoos Industrial Co., Ltd.
1414 description: United Western Technologies Corp (UniWest)
1416 description: uPI Semiconductor Corp.
1418 description: United Radiant Technology Corporation
1420 description: Universal Scientific Industrial Co., Ltd.
1422 description: Aigo Digital Technology Co., Ltd.
1424 description: V3 Semiconductor
1426 description: Vaisala
1428 description: Vamrs Ltd.
1430 description: Variscite Ltd.
1432 description: Van der Laan b.v.
1434 description: Vertexcom Technologies, Inc.
1436 description: VIA Technologies, Inc.
1438 description: VIA Labs, Inc.
1440 description: Vicor Corporation
1442 description: Videostrong Technology Co., Ltd.
1444 description: Virtual I/O Device Specification, developed by the OASIS consortium
1446 description: Used for virtual device without specific vendor.
1448 description: Vishay Intertechnology, Inc
1450 description: Visionox
1452 description: Vitesse Semiconductor Corporation
1454 description: Vivante Corporation
1456 description: Vivax brand by M SAN Grupa d.o.o.
1458 description: VoCore Studio
1460 description: Voipac Technologies s.r.o.
1462 description: Vision Optical Technology Co., Ltd.
1464 description: VXT Ltd
1466 description: Wanchanglong Electronics Technology(SHENZHEN)Co.,Ltd.
1468 description: Wandbord (Technexion)
1470 description: Waveshare Electronics
1472 description: Western Digital Corp.
1474 description: Würth Elektronik GmbH.
1476 description: Welltech Computer Co., Limited.
1478 description: WeTek Electronics, limited.
1482 description: Shenzhen whwave Electronics, Inc.
1484 description: Wi2Wi, Inc.
1486 description: Beijing Widora Technology Co., Ltd.
1488 description: Wiligear, Ltd.
1490 description: Will Semiconductor Ltd.
1492 description: Winbond Electronics corp.
1494 description: Wingtech Technology Co., Ltd.
1496 description: WinLink Co., Ltd
1498 description: Winstar Display Corp.
1500 description: Wireless Tag (qiming yunduan)
1502 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1504 description: Wolfson Microelectronics
1506 description: Wondermedia Technologies, Inc.
1510 description: X-Powers
1512 description: Xen Hypervisor
1514 description: Extreme Engineering Solutions (X-ES)
1516 description: Xiaomi Technology Co., Ltd.
1518 description: Xillybus Ltd.
1520 description: Shenzhen Xingbangda Display Technology Co., Ltd
1522 description: Shenzhen Xinpeng Technology Co., Ltd
1524 description: Xiphera Ltd.
1530 description: Shenzhen Xunlong Software CO.,Limited
1536 description: Yamaha Corporation
1537 "^yes-optoelectronics,.*":
1538 description: Yes Optoelectronics Co.,Ltd.
1540 description: YIC System Co., Ltd.
1542 description: Shenzhen Yangliming Electronic Technology Co., Ltd.
1544 description: YSH & ATIL
1545 "^yones-toptech,.*":
1546 description: Yones Toptech Co., Ltd.
1548 description: Shenzhen Yashi Changhua Intelligent Technology Co., Ltd.
1550 description: Y Soft Corporation a.s.
1552 description: Zarlink Semiconductor
1556 description: ZEITEC Semiconductor Co., LTD.
1558 description: Shenzhen Zidoo Technology Co., Ltd.
1560 description: Zodiac Inflight Innovations
1562 description: Zinitix Co., Ltd
1564 description: Shenzhen Zkmagic Technology Co., Ltd.
1566 description: ZTE Corp.
1568 description: ZyXEL Communications Corp.
1570 # Normal property name match without a comma
1571 # These should catch all node/property names without a prefix
1572 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1573 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1576 additionalProperties: false