1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|simple-graph-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Abilis Systems
29 description: Abracon Corporation
31 description: Acme Systems srl
33 description: Actions Semiconductor Co., Ltd.
35 description: Active-Semi International Inc
37 description: Avionic Design GmbH
39 description: Adafruit Industries, LLC
41 description: Adapteva, Inc.
43 description: Adaptrum, Inc.
45 description: AD Holdings Plc.
47 description: Analog Devices, Inc.
49 description: Advantech Corporation
50 "^aeroflexgaisler,.*":
51 description: Aeroflex Gaisler AB
53 description: Annapurna Labs
55 description: Allegro DVT
59 description: Allwinner Technology Co., Ltd.
61 description: AlphaScale Integrated Circuits Systems, Inc.
63 description: Altera Corp.
65 description: Amarula Solutions
67 description: Amazon.com, Inc.
69 description: Applied Micro Circuits Corporation (APM, formally AMCC)
71 description: Advanced Micro Devices (AMD), Inc.
73 description: Shenzhen Amediatech Technology Co., Ltd
75 description: Amlogic, Inc.
77 description: Ampire Co., Ltd.
81 description: AMS-Taos Inc.
83 description: Analogix Semiconductor, Inc.
85 description: Andes Technology Corporation
87 description: Anvo-Systems Dresden GmbH
89 description: Applied Micro Circuits Corporation (APM)
91 description: Aptina Imaging
93 description: Arasan Chip Systems
95 description: ArcherMind Technology (Nanjing) Co., Ltd.
97 description: Arctic Sand
99 description: arcx Inc. / Archronix Inc.
101 description: Aries Embedded GmbH
103 description: ARM Ltd.
105 description: ARMadeus Systems SARL
107 description: Arrow Electronics
109 description: Artesyn Embedded Technologies Inc.
111 description: Asahi Kasei Corp.
113 description: All Sensors Corporation
115 description: ASPEED Technology Inc.
117 description: AsusTek Computer Inc.
119 description: Atlas Scientific LLC
121 description: Atmel Corporation
123 description: AU Optronics Corporation
125 description: Auvidea GmbH
127 description: Avago Technologies
129 description: avia semiconductor
131 description: Shanghai AVIC Optoelectronics Co., Ltd.
133 description: Avnet, Inc.
135 description: Axentia Technologies AB
137 description: Axis Communications AB
139 description: Azoteq (Pty) Ltd
141 description: Shenzhen AZW Technology Co., Ltd.
143 description: BIPAI KEJI LIMITED
145 description: Compass Electronics Group, LLC
147 description: Beckhoff Automation GmbH & Co. KG
149 description: Bitmain Technologies
151 description: BOE Technology Group Co., Ltd.
153 description: Bosch Sensortec GmbH
155 description: Boundary Devices Inc.
157 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
159 description: Broadcom Corporation
161 description: Buffalo, Inc.
163 description: B&R Industrial Automation GmbH
165 description: Bticino International
167 description: CALAO Systems SAS
171 description: Capella Microsystems, Inc
173 description: Cascoda, Ltd.
175 description: Catalyst Semiconductor, Inc.
177 description: Cavium, Inc.
179 description: Cadence Design Systems Inc.
181 description: CDTech(H.K.) Electronics Limited
183 description: Ceva, Inc.
185 description: Chipidea, Inc
189 description: ChipSPARK
191 description: Common Hardware Reference Platform
193 description: Chunghwa Picture Tubes Ltd.
195 description: Chuwi Innovation Ltd.
197 description: Computadora Industrial Abierta Argentina
199 description: Cirrus Logic, Inc.
201 description: Cloud Engines, Inc.
203 description: Chips&Media, Inc.
205 description: Conexant Systems, Inc.
207 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
209 description: CompuLab Ltd.
211 description: CORERIVER Semiconductor Co.,Ltd.
213 description: Chengdu Corpro Technology Co., Ltd.
215 description: Cortina Systems, Inc.
217 description: Cosmic Circuits
219 description: Crane Connectivity Solutions
221 description: Creative Technology Ltd
223 description: Crystalfontz America, Inc.
225 description: Hangzhou C-SKY Microsystems Co., Ltd
227 description: Shenzen Chuangsiqi Technology Co.,Ltd.
229 description: Cubietech, Ltd.
231 description: Cypress Semiconductor Corporation
233 description: CZ.NIC, z.s.p.o.
235 description: Maxim Integrated Products (formerly Dallas Semiconductor)
237 description: DataImage, Inc.
239 description: DAVICOM Semiconductor, Inc.
241 description: Dell Inc.
243 description: Delta Electronics, Inc.
245 description: Denx Software Engineering
247 description: Devantech, Ltd.
249 description: DH electronics GmbH
251 description: Shenzhen Yagu Electronic Technology Co., Ltd.
253 description: Digi International Inc.
255 description: Diglent, Inc.
257 description: Dioo Microcircuit Co., Ltd
259 description: DLC Display Co., Ltd.
261 description: Dialog Semiconductor
263 description: D-Link Corporation
265 description: Data Modul AG
267 description: Domintech Co., Ltd.
269 description: Dongwoon Anatech
271 description: DPTechnics
273 description: Dragino Technology Co., Limited
275 description: dServe Technology B.V.
277 description: Dyna-Image
279 description: Embedded Artists AB
281 description: EBS-SYSTART GmbH
283 description: EBV Elektronik
285 description: Eckelmann AG
287 description: Emerging Display Technologies
289 description: eGalax_eMPIA Technology Inc
291 description: Einfochips
293 description: Elan Microelectronic Corp.
295 description: Elgin S/A.
297 description: Shenzhen Elida Technology Co., Ltd.
299 description: Shenzhen Embest Technology Co., Ltd.
301 description: Emlid, Ltd.
303 description: EM Microelectronic
304 "^empire-electronix,.*":
305 description: Empire Electronix
307 description: emtrion GmbH
309 description: Endless Mobile, Inc.
311 description: ENE Technology, Inc.
313 description: Silicon Laboratories (formerly Energy Micro AS)
315 description: Engicam S.r.l.
317 description: EPCOS AG
319 description: Ecole Polytechnique Fédérale de Lausanne
321 description: Seiko Epson Corp.
323 description: Espressif Systems Co. Ltd.
325 description: ESTeem Wireless Modems
327 description: NI Ettus Research
329 description: Eukréa Electromatique
331 description: Everest Semiconductor Co. Ltd.
333 description: Everspin Technologies, Inc.
335 description: Evervision Electronics Co. Ltd.
337 description: Exar Corporation
341 description: EZchip Semiconductor
343 description: Facebook
345 description: Fairphone B.V.
347 description: Faraday Technology Corporation
349 description: Fastrax Oy
351 description: Fairchild Semiconductor
353 description: Shenzhen Feixin Photoelectic Co., Ltd
355 description: Shenzhen Fly Young Technology Co.,LTD.
359 description: FocalTech Systems Co.,Ltd
361 description: Shenzhen Frida LCD Co., Ltd.
363 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
365 description: Freescale Semiconductor
367 description: Fujitsu Ltd.
369 description: GARDENA GmbH
371 description: Gateworks Corporation
373 description: Game Consoles Worldwide
375 description: General Electric Company
377 description: GeekBuying
379 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
381 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
383 description: Gemei Digital Technology Co., Ltd.
385 description: Geniatech, Inc.
387 description: Giantec Semiconductor, Inc.
389 description: Giantplus Technology Co., Ltd.
391 description: Globalscale Technologies, Inc.
393 description: GlobalTop Technology, Inc.
395 description: Global Mixed-mode Technology, Inc.
397 description: Shenzhen Huiding Technology Co., Ltd.
399 description: Google, Inc.
403 description: Garmin Limited
405 description: Gumstix, Inc.
407 description: Gateworks Corporation
409 description: HannStar Display Corporation
411 description: Haoyu Microelectronic Co. Ltd.
413 description: Hardkernel Co., Ltd
415 description: HiDeep Inc.
417 description: Himax Technologies, Inc.
419 description: Hisilicon Limited.
421 description: Hitachi Ltd.
423 description: Hitex Development Tools
425 description: Holt Integrated Circuits, Inc.
427 description: Honeywell
429 description: Jiangsu HopeRun Software Co., Ltd.
431 description: Hewlett Packard
433 description: HannStar Display Co.
435 description: Holtek Semiconductor, Inc.
437 description: Shenzhen Hugsun Technology Co. Ltd.
439 description: HwaCom Systems Inc.
441 description: Hydis Technologies
443 description: Hyundai Technology
445 description: I2SE GmbH
447 description: International Business Machines (IBM)
449 description: IC Plus Corp.
451 description: Integrated Device Technologies, Inc.
453 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
455 description: ILI Technology Corporation (ILITEK)
457 description: Imagination Technologies Ltd.
459 description: In-Circuit GmbH
461 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
463 description: Infineon Technologies
465 description: Inforce Computing
467 description: Ingenic Semiconductor
469 description: Innolux Corporation
471 description: INSIDE Secure
473 description: Inspur Corporation
475 description: Intel Corporation
477 description: Inter Control Group
479 description: InvenSense Inc.
481 description: Inverse Path
483 description: Iomega Corporation
485 description: ISEE 2007 S.L.
487 description: Intersil
489 description: Integrated Silicon Solutions Inc.
491 description: ITE Tech, Inc.
493 description: ITEAD Intelligent Systems Co.Ltd
495 description: iWave Systems Technologies Pvt. Ltd.
497 description: Japan Display Inc.
499 description: JEDEC Solid State Technology Association
501 description: Shenzhen Jesurun Electronics Business Dept.
503 description: Jiandangjing Technology Co., Ltd.
505 description: Kamstrup A/S
507 description: Ka-Ro electronics GmbH
509 description: Keith & Koep GmbH
511 description: Keymile GmbH
515 description: Kieback & Peter GmbH
517 description: Kinetic Technologies
519 description: King & Display Technology Co., Ltd.
521 description: Kingnovel Technology Co., Ltd.
523 description: Kionix, Inc.
525 description: Rakuten Kobo Inc.
527 description: Kaohsiung Opto-Electronics Inc.
529 description: Kontron S&T AG
531 description: Sutajio Ko-Usagi PTE Ltd.
533 description: Kyocera Corporation
537 description: Laird PLC
539 description: Ketai Huajie Technology Co., Ltd.
541 description: Lantiq Semiconductor
543 description: Lattice Semiconductor
545 description: Shenzhen Leadtek Technology Co., Ltd.
549 description: LEGO Systems A/S
551 description: Shenzhen LeMaker Technology Co., Ltd.
553 description: Lenovo Group Ltd.
555 description: LG Corporation
557 description: LG Display
559 description: Shenzhen Libre Technology Co., Ltd
561 description: Lichee Pi
563 description: Linaro Limited
565 description: LinkSprite Technologies, Inc.
567 description: Belkin International, Inc. (Linksys)
569 description: Linutronix GmbH
571 description: Linux-specific binding
573 description: Linx Technologies
575 description: Linear Technology Corporation
577 description: Logic PD, Inc.
579 description: Logic Technologies Limited
581 description: Longcheer Technology (Shanghai) Co., Ltd.
583 description: Loongson Technology Corporation Limited
585 description: LSI Corp. (LSI Logic)
587 description: Liebherr-Werk Nenzing GmbH
589 description: Macnica Americas
591 description: Mapleboard.org
593 description: Marvell Technology Group Ltd.
595 description: MaxBotix Inc.
597 description: Maxim Integrated Products
599 description: Mobiveil Inc.
603 description: Measurement Specialties
605 description: Mustek Limited
607 description: MediaTek Inc.
609 description: MegaChips
611 description: Shenzhen MeLE Digital Technology Ltd.
613 description: Melexis N.V.
615 description: MELFAS Inc.
617 description: Mellanox Technologies
619 description: MEMSIC Inc.
621 description: Menlo Systems GmbH
623 description: Merrii Technology Co., Ltd.
625 description: Micrel Inc.
627 description: Microchip Technology Inc.
629 description: Micro Crystal AG
631 description: Micron Technology Inc.
633 description: Microsoft Corporation
635 description: MikroElektronika d.o.o.
637 description: Miniand Tech
639 description: MINIX Technology Ltd.
641 description: MiraMEMS Sensing Technology Co., Ltd.
643 description: Mitsubishi Electric Corporation
645 description: Mosaix Technologies, Inc.
647 description: Motorola, Inc.
649 description: Moxa Inc.
653 description: Monolithic Power Systems Inc.
655 description: mqmaker Inc.
657 description: Marvell Technology Group Ltd.
660 description: Microsemi Corporation
662 description: Micro-Star International Co. Ltd.
664 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
666 description: Multi-Inno Technology Co.,Ltd
668 description: Mundo Reader S.L.
670 description: Murata Manufacturing Co., Ltd.
672 description: Macronix International Co., Ltd.
674 description: MYIR Tech Limited
676 description: National Semiconductor
678 description: NEC LCD Technologies, Ltd.
680 description: Neonode Inc.
684 description: Broadcom Corporation (formerly NetLogic Microsystems)
686 description: Netron DY
688 description: Shenzhen Netxeon Technology CO., LTD
690 description: Guangdong Neweast Optoelectronics CO., LTD
694 description: Next Thing Co.
696 description: Newhaven Display International
698 description: National Instruments
700 description: Nintendo
702 description: NLT Technologies, Ltd.
706 description: Nordic Semiconductor
708 description: NovTech, Inc.
710 description: NutsBoard
712 description: Nuvoton Technology Corporation
714 description: New Vision Display
718 description: NXP Semiconductors
720 description: Oceanic Systems (UK) Ltd.
722 description: Okaya Electric America, Inc.
724 description: Oki Electric Industry Co., Ltd.
726 description: OLIMEX Ltd.
728 description: One Laptop Per Child
730 description: Onion Corporation
732 description: ON Semiconductor Corp.
734 description: On Tat Industrial Company
736 description: Opal Kelly Incorporated
738 description: OpenCores.org
740 description: OpenRISC.io
742 description: Option NV
744 description: Shenzhen Oranth Technology Co., Ltd.
746 description: Oracle Corporation
748 description: Orise Technology
750 description: Ortus Technology Co., Ltd.
752 description: OSD Displays
754 description: Overkiz SAS
756 description: OmniVision Technologies
758 description: Oxford Semiconductor, Ltd.
760 description: OzzMaker
762 description: Panasonic Corporation
764 description: Parade Technologies Inc.
766 description: Parallax Inc.
768 description: Precision Design Associates, Inc.
770 description: Pericom Technology Inc.
772 description: Pervasive Displays, Inc.
774 description: PHICOMM Co., Ltd.
776 description: PHYTEC Messtechnik GmbH
778 description: Picochip Ltd
782 description: Shenzhen PineRiver Designs Co., Ltd.
784 description: PIXCIR MICROELECTRONICS Co., Ltd
786 description: Plantower Co., Ltd
788 description: Plat\'Home Co., Ltd.
792 description: Broadcom Corporation (formerly PLX Technology)
794 description: PNI Sensor Corporation
796 description: PocketBook International SA
798 description: Polaroid Corporation
800 description: Portwell Inc.
802 description: Poslab Technology Co., Ltd.
804 description: Point of View International B.V.
806 description: PowerVR (deprecated, use img)
808 description: Primux Trading, S.L.
810 description: PROBOX2 (by W2COMP Co., Ltd.)
812 description: PulsedLight, Inc
814 description: Purism, SPC
816 description: Qualcomm Atheros, Inc.
818 description: Qualcomm Technologies, Inc
820 description: QEMU, a generic and open source machine emulator and virtualizer
822 description: Qi Hardware
824 description: Chengdu Kaixuan Information Technology Co., Ltd.
826 description: QiaoDian XianShi Corporation
828 description: QNAP Systems, Inc.
832 description: RaidSonic Technology GmbH
834 description: Mediatek/Ralink Technology Corp.
836 description: Ramtron International
838 description: Raspberry Pi Foundation
840 description: Raydium Semiconductor Corp.
842 description: Unisoc Communications, Inc.
844 description: Realtek Semiconductor Corp.
846 description: Renesas Electronics Corporation
848 description: Shenzhen Rervision Technology Co., Ltd.
850 description: Richtek Technology Corporation
852 description: Ricoh Co. Ltd.
854 description: Rikomagic Tech Corp. Ltd
856 description: RISC-V Foundation
858 description: Fuzhou Rockchip Electronics Co., Ltd
860 description: ROCKTECH DISPLAYS LIMITED
862 description: ROHM Semiconductor Co., Ltd
864 description: Ronbo Electronics
866 description: Shenzhen Roofull Technology Co, Ltd
868 description: Samsung Semiconductor
870 description: Samtec/Softing company
872 description: Sancloud Ltd
874 description: Sandisk Corporation
876 description: Satoz International Co., Ltd
878 description: Smart Battery System
880 description: Schindler
882 description: Seagate Technology PLC
884 description: Shenzhen SEI Robotics Co., Ltd
886 description: Semtech Corporation
888 description: Sensirion AG
890 description: Sensortek Technology Corporation
892 description: Small Form Factor Committee
894 description: Solomon Goldentek Display Corporation
896 description: SG Micro Corp
898 description: SGX Sensortech
900 description: Sharp Corporation
902 description: Shimafuji Electric, Inc.
904 description: Si-En Technology Ltd.
906 description: Silicon Linux Corporation
908 description: SiFive, Inc.
910 description: Sigma Designs, Inc.
912 description: Seiko Instruments, Inc.
914 description: Silicon Image
916 description: Silicon Laboratories
918 description: Silead Inc.
920 description: Silergy Corp.
922 description: Silicon Mitus, Inc.
924 description: Cypress Semiconductor Corporation (Simtek Corporation)
926 description: Sinlinx Electronics Technology Co., LTD
928 description: SinoVoip Co., Ltd
930 description: Shenzhen Sipeed Technology Co., Ltd.
932 description: SiRF Technology, Inc.
934 description: Silicon Integrated Systems Corp.
936 description: Sitronix Technology Corporation
938 description: Skyworks Solutions, Inc.
940 description: Standard Microsystems Corporation
942 description: Synopsys, Inc.
944 description: Shenzhen SoChip Technology Co., Ltd.
946 description: Socionext Inc.
948 description: SolidRun
950 description: Solomon Systech Limited
952 description: Sony Corporation
954 description: Spansion Inc.
956 description: Spreadtrum Communications Inc.
958 description: Silicon Storage Technology, Inc.
960 description: STMicroelectronics
962 description: Starry Electronic Technology (ShenZhen) Co., LTD
966 description: ST-Ericsson
969 description: ST-Ericsson
971 description: ST-Ericsson
974 description: Summit microelectronics
976 description: Shenzhen Sunchip Technology Co., Ltd
978 description: Sun Microsystems, Inc
980 description: Sierra Wireless
982 description: Synaptics Inc.
984 description: Synology, Inc.
986 description: TBS Technologies
987 "^tbs-biometrics,.*":
988 description: Touchless Biometric Systems AG
990 description: Trusted Computing Group
992 description: Toby Churchill Ltd.
994 description: TechNexion
996 description: Technologic Systems
998 description: Tempo Semiconductor
1000 description: Shenzhen Techstar Electronics Co., Ltd.
1002 description: Terasic Inc.
1004 description: Three Five Corp
1006 description: THine Electronics, Inc.
1008 description: Texas Instruments
1010 description: Tianma Micro-electronics Co., Ltd.
1012 description: Trusted Logic Mobility
1014 description: Tecon Microprocessor Technologies, LLC.
1018 description: TPO (deprecated, use tpo)
1021 description: Topwise Communication Co., Ltd.
1023 description: Toradex AG
1025 description: Toshiba Corporation
1029 description: TPK U.S.A. LLC
1031 description: TP-LINK Technologies Co., Ltd.
1035 description: TQ Systems GmbH
1039 description: Tronsmart
1041 description: Truly Semiconductors Limited
1043 description: Theobroma Systems Design und Consulting GmbH
1045 description: Tyan Computer Corporation
1049 description: uCRobotics
1051 description: Ubiquiti Networks
1055 description: Ugoos Industrial Co., Ltd.
1057 description: United Western Technologies Corp (UniWest)
1059 description: uPI Semiconductor Corp.
1061 description: United Radiant Technology Corporation
1063 description: Universal Scientific Industrial Co., Ltd.
1065 description: Aigo Digital Technology Co., Ltd.
1067 description: V3 Semiconductor
1069 description: Vamrs Ltd.
1071 description: Variscite Ltd.
1073 description: VIA Technologies, Inc.
1075 description: Videostrong Technology Co., Ltd.
1077 description: Virtual I/O Device Specification, developed by the OASIS consortium
1079 description: Vishay Intertechnology, Inc
1081 description: Vitesse Semiconductor Corporation
1083 description: Vivante Corporation
1085 description: VoCore Studio
1087 description: Voipac Technologies s.r.o.
1089 description: Vision Optical Technology Co., Ltd.
1091 description: VXT Ltd
1093 description: Waveshare Electronics
1095 description: Western Digital Corp.
1097 description: WeTek Electronics, limited.
1101 description: Shenzhen whwave Electronics, Inc.
1103 description: Wi2Wi, Inc.
1105 description: Winbond Electronics corp.
1107 description: Winstar Display Corp.
1109 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1111 description: Wolfson Microelectronics
1113 description: Wondermedia Technologies, Inc.
1117 description: X-Powers
1119 description: Extreme Engineering Solutions (X-ES)
1121 description: Xiaomi Technology Co., Ltd.
1123 description: Xillybus Ltd.
1125 description: Shenzhen Xinpeng Technology Co., Ltd
1129 description: Shenzhen Xunlong Software CO.,Limited
1133 description: YSH & ATIL
1134 "^yones-toptech,.*":
1135 description: Yones Toptech Co., Ltd.
1137 description: Y Soft Corporation a.s.
1139 description: Zarlink Semiconductor
1141 description: ZEITEC Semiconductor Co., LTD.
1143 description: Shenzhen Zidoo Technology Co., Ltd.
1145 description: Zodiac Inflight Innovations
1147 description: ZTE Corp.
1149 description: ZyXEL Communications Corp.
1151 # Normal property name match without a comma
1152 # These should catch all node/property names without a prefix
1153 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1154 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1157 additionalProperties: false