1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|bm|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio-key|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: 70mai Co., Ltd.
31 description: Abilis Systems
33 description: Abracon Corporation
35 description: ShenZhen Asia Better Technology Ltd.
37 description: Acer Inc.
39 description: Acme Systems srl
41 description: Actions Semiconductor Co., Ltd.
43 description: Active-Semi International Inc
45 description: Avionic Design GmbH
47 description: Adafruit Industries, LLC
49 description: Adapteva, Inc.
51 description: Adaptrum, Inc.
53 description: AD Holdings Plc.
55 description: Analog Devices, Inc.
57 description: Advantech Corporation
58 "^aeroflexgaisler,.*":
59 description: Aeroflex Gaisler AB
61 description: Annapurna Labs
65 description: Allegro DVT
69 description: Allwinner Technology Co., Ltd.
71 description: AlphaScale Integrated Circuits Systems, Inc.
73 description: Alps Electric Co., Ltd.
75 description: Altus-Escon-Company BV
77 description: Altera Corp.
79 description: Amarula Solutions
81 description: Amazon.com, Inc.
83 description: Applied Micro Circuits Corporation (APM, formally AMCC)
85 description: Advanced Micro Devices (AMD), Inc.
87 description: Shenzhen Amediatech Technology Co., Ltd
89 description: Amlogic, Inc.
91 description: Ampere Computing LLC
93 description: Ampire Co., Ltd.
97 description: AMS-Taos Inc.
99 description: Analogix Semiconductor, Inc.
101 description: Andes Technology Corporation
103 description: Anvo-Systems Dresden GmbH
105 description: Applied Micro Circuits Corporation (APM)
107 description: Apple Inc.
109 description: Aptina Imaging
111 description: Arasan Chip Systems
113 description: ArcherMind Technology (Nanjing) Co., Ltd.
115 description: Arctic Sand
117 description: arcx Inc. / Archronix Inc.
119 description: Aries Embedded GmbH
121 description: ARM Ltd.
123 description: ARMadeus Systems SARL
125 description: Arrow Electronics
127 description: Artesyn Embedded Technologies Inc.
129 description: Asahi Kasei Corp.
131 description: All Sensors Corporation
133 description: ASPEED Technology Inc.
135 description: AsusTek Computer Inc.
137 description: Atlas Scientific LLC
139 description: Atmel Corporation
141 description: AU Optronics Corporation
143 description: Auvidea GmbH
145 description: Avago Technologies
147 description: avia semiconductor
149 description: Shanghai AVIC Optoelectronics Co., Ltd.
151 description: Avnet, Inc.
153 description: Shanghai Awinic Technology Co., Ltd.
155 description: Axentia Technologies AB
157 description: Axis Communications AB
159 description: Azoteq (Pty) Ltd
161 description: Shenzhen AZW Technology Co., Ltd.
163 description: BAIKAL ELECTRONICS, JSC
165 description: BIPAI KEJI LIMITED
167 description: Compass Electronics Group, LLC
169 description: BeagleBoard.org Foundation
171 description: Beckhoff Automation GmbH & Co. KG
173 description: Bitmain Technologies
175 description: BOE Technology Group Co., Ltd.
177 description: Bosch Sensortec GmbH
179 description: Boundary Devices Inc.
181 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
183 description: Broadcom Corporation
185 description: Buffalo, Inc.
187 description: B&R Industrial Automation GmbH
189 description: Bticino International
191 description: CALAO Systems SAS
195 description: Canaan, Inc.
197 description: Caninos Loucos Program
199 description: Capella Microsystems, Inc
201 description: Cascoda, Ltd.
203 description: Catalyst Semiconductor, Inc.
205 description: Cavium, Inc.
207 description: Cadence Design Systems Inc.
209 description: CDTech(H.K.) Electronics Limited
211 description: CellWise Microelectronics Co., Ltd
213 description: Ceva, Inc.
215 description: Check Point Software Technologies Ltd.
217 description: Chefree Technology Corp.
219 description: Chipidea, Inc
223 description: ChipSPARK
225 description: Chrontel, Inc.
227 description: Common Hardware Reference Platform
229 description: Chunghwa Picture Tubes Ltd.
231 description: Chuwi Innovation Ltd.
233 description: Computadora Industrial Abierta Argentina
235 description: Cirrus Logic, Inc.
237 description: Cisco Systems, Inc.
239 description: Cloud Engines, Inc.
241 description: Chips&Media, Inc.
243 description: Conexant Systems, Inc.
245 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
247 description: CompuLab Ltd.
249 description: CORERIVER Semiconductor Co.,Ltd.
251 description: Chengdu Corpro Technology Co., Ltd.
253 description: Cortina Systems, Inc.
255 description: Cosmic Circuits
257 description: Crane Connectivity Solutions
259 description: Creative Technology Ltd
261 description: Crystalfontz America, Inc.
263 description: Hangzhou C-SKY Microsystems Co., Ltd
265 description: Shenzen Chuangsiqi Technology Co.,Ltd.
267 description: Cubietech, Ltd.
269 description: Cypress Semiconductor Corporation
271 description: CZ.NIC, z.s.p.o.
273 description: Maxim Integrated Products (formerly Dallas Semiconductor)
275 description: DataImage, Inc.
277 description: DAVICOM Semiconductor, Inc.
279 description: Dell Inc.
281 description: Delta Electronics, Inc.
283 description: Denx Software Engineering
285 description: Devantech, Ltd.
287 description: DFI Inc.
289 description: DH electronics GmbH
291 description: Shenzhen Yagu Electronic Technology Co., Ltd.
293 description: Digi International Inc.
295 description: Diglent, Inc.
297 description: Dioo Microcircuit Co., Ltd
299 description: DLC Display Co., Ltd.
301 description: Dialog Semiconductor
303 description: D-Link Corporation
305 description: Data Modul AG
307 description: Domintech Co., Ltd.
309 description: Dongwoon Anatech
311 description: DPTechnics
313 description: Dragino Technology Co., Limited
315 description: dServe Technology B.V.
317 description: Dyna-Image
319 description: Embedded Artists AB
321 description: Zhejiang Ebang Communication Co., Ltd
323 description: EBS-SYSTART GmbH
325 description: EBV Elektronik
327 description: Eckelmann AG
329 description: Emerging Display Technologies
331 description: eGalax_eMPIA Technology Inc
333 description: Einfochips
335 description: Elan Microelectronic Corp.
337 description: Element14 (A Premier Farnell Company)
339 description: Elgin S/A.
341 description: Shenzhen Elida Technology Co., Ltd.
343 description: Elimo Engineering Ltd.
345 description: Shenzhen Embest Technology Co., Ltd.
347 description: Emlid, Ltd.
349 description: EM Microelectronic
350 "^empire-electronix,.*":
351 description: Empire Electronix
353 description: emtrion GmbH
355 description: Endless Mobile, Inc.
357 description: ENE Technology, Inc.
359 description: Silicon Laboratories (formerly Energy Micro AS)
361 description: Engicam S.r.l.
363 description: EPCOS AG
365 description: Ecole Polytechnique Fédérale de Lausanne
367 description: Seiko Epson Corp.
369 description: Espressif Systems Co. Ltd.
371 description: ESTeem Wireless Modems
373 description: NI Ettus Research
375 description: Eukréa Electromatique
377 description: Everest Semiconductor Co. Ltd.
379 description: Everspin Technologies, Inc.
381 description: Evervision Electronics Co. Ltd.
383 description: Exar Corporation
387 description: EZchip Semiconductor
389 description: Facebook
391 description: Fairphone B.V.
393 description: Faraday Technology Corporation
395 description: Fastrax Oy
397 description: Fairchild Semiconductor
399 description: Shenzhen Feixin Photoelectic Co., Ltd
401 description: Shenzhen Fly Young Technology Co.,LTD.
403 description: Foxconn Industrial Internet
407 description: FocalTech Systems Co.,Ltd
409 description: Shenzhen Frida LCD Co., Ltd.
411 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
413 description: Freescale Semiconductor
415 description: Fujitsu Ltd.
417 description: GARDENA GmbH
419 description: Gateworks Corporation
421 description: Game Consoles Worldwide
423 description: General Electric Company
425 description: GeekBuying
427 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
429 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
431 description: Gemei Digital Technology Co., Ltd.
433 description: Geniatech, Inc.
435 description: Giantec Semiconductor, Inc.
437 description: Giantplus Technology Co., Ltd.
439 description: Globalscale Technologies, Inc.
441 description: GlobalTop Technology, Inc.
443 description: Global Mixed-mode Technology, Inc.
445 description: Shenzhen Huiding Technology Co., Ltd.
447 description: Google, Inc.
451 description: Garmin Limited
453 description: Gumstix, Inc.
455 description: Gateworks Corporation
456 use "gateworks" vendor prefix
459 description: HannStar Display Corporation
461 description: Haoyu Microelectronic Co. Ltd.
463 description: Hardkernel Co., Ltd
465 description: HiDeep Inc.
467 description: Himax Technologies, Inc.
469 description: Hirschmann Automation and Control GmbH
471 description: Hisilicon Limited.
473 description: Hitachi Ltd.
475 description: Hitex Development Tools
477 description: Holt Integrated Circuits, Inc.
479 description: Honestar Technologies Co., Ltd.
481 description: Honeywell
483 description: Jiangsu HopeRun Software Co., Ltd.
485 description: Hewlett Packard
487 description: HannStar Display Co.
489 description: Holtek Semiconductor, Inc.
491 description: Shenzhen Hugsun Technology Co. Ltd.
493 description: HwaCom Systems Inc.
495 description: Hydis Technologies
497 description: Hyundai Technology
499 description: I2SE GmbH
501 description: International Business Machines (IBM)
503 description: IC Plus Corp.
505 description: Integrated Device Technologies, Inc.
507 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
509 description: ILI Technology Corporation (ILITEK)
511 description: Imagination Technologies Ltd.
513 description: Integrated Micro-Electronics Inc.
515 description: In-Circuit GmbH
517 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
519 description: Infineon Technologies
521 description: Inforce Computing
523 description: InfoVision Optoelectronics Kunshan Co. Ltd.
525 description: Ingenic Semiconductor
527 description: Innolux Corporation
529 description: INSIDE Secure
531 description: Inspur Corporation
533 description: Intel Corporation
535 description: Inter Control Group
537 description: InvenSense Inc.
539 description: Inverse Path
541 description: Iomega Corporation
543 description: ISEE 2007 S.L.
545 description: Intersil
547 description: Integrated Silicon Solutions Inc.
549 description: ITE Tech. Inc.
551 description: ITEAD Intelligent Systems Co.Ltd
553 description: iWave Systems Technologies Pvt. Ltd.
555 description: Japan Display Inc.
557 description: JEDEC Solid State Technology Association
559 description: Shenzhen Jesurun Electronics Business Dept.
561 description: Jiandangjing Technology Co., Ltd.
563 description: Kamstrup A/S
565 description: Ka-Ro electronics GmbH
567 description: Keith & Koep GmbH
569 description: Keymile GmbH
573 description: Kieback & Peter GmbH
575 description: Kinetic Technologies
577 description: King & Display Technology Co., Ltd.
579 description: Kingnovel Technology Co., Ltd.
581 description: Kionix, Inc.
583 description: Rakuten Kobo Inc.
585 description: Kobol Innovations Pte. Ltd.
587 description: Kaohsiung Opto-Electronics Inc.
589 description: Kontron S&T AG
591 description: Sutajio Ko-Usagi PTE Ltd.
593 description: Kverneland Group
595 description: Kyocera Corporation
599 description: Laird PLC
601 description: Ketai Huajie Technology Co., Ltd.
603 description: Lantiq Semiconductor
605 description: Lattice Semiconductor
607 description: Shenzhen Leadtek Technology Co., Ltd.
611 description: LEGO Systems A/S
613 description: Shenzhen LeMaker Technology Co., Ltd.
615 description: Lenovo Group Ltd.
617 description: LG Corporation
619 description: LG Display
621 description: Shenzhen Libre Technology Co., Ltd
623 description: Lichee Pi
625 description: Linaro Limited
627 description: LinkSprite Technologies, Inc.
629 description: Belkin International, Inc. (Linksys)
631 description: Linutronix GmbH
633 description: Linux-specific binding
635 description: Linx Technologies
637 description: LiteX SoC builder
639 description: Linear Technology Corporation
641 description: Logic PD, Inc.
643 description: Logic Technologies Limited
645 description: Longcheer Technology (Shanghai) Co., Ltd.
647 description: Lontium Semiconductor Corporation
649 description: Loongson Technology Corporation Limited
651 description: LSI Corp. (LSI Logic)
653 description: Liebherr-Werk Nenzing GmbH
655 description: Linux Automation GmbH
659 description: Macnica Americas
661 description: Mantix Display Technology Co.,Ltd.
663 description: Mapleboard.org
665 description: Marvell Technology Group Ltd.
667 description: MaxBotix Inc.
669 description: Maxim Integrated Products
671 description: Mobiveil Inc.
675 description: Measurement Specialties
677 description: Mustek Limited
679 description: MediaTek Inc.
681 description: MegaChips
683 description: Shenzhen MeLE Digital Technology Ltd.
685 description: Melexis N.V.
687 description: MELFAS Inc.
689 description: Mellanox Technologies
691 description: MEMSIC Inc.
693 description: Menlo Systems GmbH
695 description: Mentor Graphics
697 description: Cisco Meraki, LLC
699 description: Merrii Technology Co., Ltd.
701 description: Micrel Inc.
703 description: Microchip Technology Inc.
705 description: Micro Crystal AG
707 description: Micron Technology Inc.
709 description: Microsoft Corporation
711 description: MicroSys Electronics GmbH
713 description: MikroElektronika d.o.o.
715 description: MikroTik
717 description: Miniand Tech
719 description: MINIX Technology Ltd.
721 description: MiraMEMS Sensing Technology Co., Ltd.
723 description: Mitsubishi Electric Corporation
725 description: Modtronix Engineering
727 description: Mosaix Technologies, Inc.
729 description: Motorola, Inc.
731 description: Moxa Inc.
735 description: Monolithic Power Systems Inc.
737 description: mqmaker Inc.
739 description: Marvell Technology Group Ltd.
742 description: Microsemi Corporation
744 description: Micro-Star International Co. Ltd.
746 description: MStar Semiconductor, Inc. (acquired by MediaTek Inc.)
748 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
750 description: Multi-Inno Technology Co.,Ltd
752 description: Mundo Reader S.L.
754 description: Murata Manufacturing Co., Ltd.
756 description: Macronix International Co., Ltd.
758 description: MYIR Tech Limited
760 description: National Semiconductor
762 description: NEC LCD Technologies, Ltd.
764 description: Neonode Inc.
768 description: Broadcom Corporation (formerly NetLogic Microsystems)
770 description: Netron DY
772 description: Shenzhen Netxeon Technology CO., LTD
774 description: Guangdong Neweast Optoelectronics CO., LTD
778 description: Next Thing Co.
780 description: Newhaven Display International
782 description: National Instruments
784 description: Nintendo
786 description: NLT Technologies, Ltd.
790 description: Nordic Semiconductor
792 description: NovTech, Inc.
794 description: NutsBoard
796 description: Nuvoton Technology Corporation
798 description: New Vision Display
802 description: NXP Semiconductors
804 description: Oceanic Systems (UK) Ltd.
806 description: Octavo Systems LLC
808 description: Okaya Electric America, Inc.
810 description: Oki Electric Industry Co., Ltd.
812 description: OLIMEX Ltd.
814 description: One Laptop Per Child
816 description: Onion Corporation
818 description: ON Semiconductor Corp.
820 description: On Tat Industrial Company
822 description: Opal Kelly Incorporated
824 description: OpenCores.org
826 description: OpenRISC.io
828 description: Option NV
830 description: Shenzhen Oranth Technology Co., Ltd.
832 description: Oracle Corporation
834 description: Orise Technology
836 description: Ortus Technology Co., Ltd.
838 description: OSD Displays
840 description: Ouya Inc.
842 description: Overkiz SAS
844 description: OmniVision Technologies
846 description: Oxford Semiconductor, Ltd.
848 description: OzzMaker
850 description: Panasonic Corporation
852 description: Parade Technologies Inc.
854 description: Parallax Inc.
856 description: Precision Design Associates, Inc.
858 description: Pericom Technology Inc.
860 description: Pervasive Displays, Inc.
862 description: PHICOMM Co., Ltd.
864 description: PHYTEC Messtechnik GmbH
866 description: Picochip Ltd
870 description: Shenzhen PineRiver Designs Co., Ltd.
872 description: PIXCIR MICROELECTRONICS Co., Ltd
874 description: Plantower Co., Ltd
876 description: Plat\'Home Co., Ltd.
880 description: Broadcom Corporation (formerly PLX Technology)
882 description: Plymovent Group BV
884 description: PNI Sensor Corporation
886 description: PocketBook International SA
888 description: Polaroid Corporation
890 description: Portwell Inc.
892 description: Poslab Technology Co., Ltd.
894 description: Point of View International B.V.
896 description: Powertip Tech. Corp.
898 description: PowerVR (deprecated, use img)
900 description: Primux Trading, S.L.
902 description: PROBOX2 (by W2COMP Co., Ltd.)
904 description: Protonic Holland
906 description: PulsedLight, Inc
908 description: Purism, SPC
910 description: Qualcomm Atheros, Inc.
912 description: Qualcomm Technologies, Inc
914 description: QEMU, a generic and open source machine emulator and virtualizer
916 description: Qi Hardware
918 description: Chengdu Kaixuan Information Technology Co., Ltd.
920 description: QiaoDian XianShi Corporation
922 description: QNAP Systems, Inc.
926 description: RaidSonic Technology GmbH
928 description: Mediatek/Ralink Technology Corp.
930 description: Ramtron International
932 description: Raspberry Pi Foundation
934 description: Raydium Semiconductor Corp.
936 description: Unisoc Communications, Inc.
938 description: Realtek Semiconductor Corp.
940 description: reMarkable AS
942 description: Renesas Electronics Corporation
944 description: iMX6 Rex Project
946 description: Shenzhen Rervision Technology Co., Ltd.
948 description: Revolution Robotics, Inc. (Revotics)
950 description: Richtek Technology Corporation
952 description: Ricoh Co. Ltd.
954 description: Rikomagic Tech Corp. Ltd
956 description: RISC-V Foundation
958 description: Embest RIoT
960 description: Fuzhou Rockchip Electronics Co., Ltd
962 description: ROCKTECH DISPLAYS LIMITED
964 description: ROHM Semiconductor Co., Ltd
966 description: Ronbo Electronics
968 description: Shenzhen Roofull Technology Co, Ltd
970 description: RoseapplePi.org
972 description: Samsung Semiconductor
974 description: Samtec/Softing company
976 description: Sancloud Ltd
978 description: Sandisk Corporation
980 description: Satoz International Co., Ltd
982 description: Smart Battery System
984 description: Schindler
986 description: Seagate Technology PLC
988 description: Seeed Technology Co., Ltd
990 description: Shenzhen SEI Robotics Co., Ltd
992 description: Semtech Corporation
994 description: Sensirion AG
996 description: Sensortek Technology Corporation
998 description: Small Form Factor Committee
1000 description: Solomon Goldentek Display Corporation
1002 description: SG Micro Corp
1004 description: SGX Sensortech
1006 description: Sharp Corporation
1008 description: Shimafuji Electric, Inc.
1010 description: Shiratech Solutions
1012 description: Si-En Technology Ltd.
1014 description: Silicon Linux Corporation
1016 description: SiFive, Inc.
1018 description: Sigma Designs, Inc.
1020 description: Seiko Instruments, Inc.
1022 description: Silicon Image
1024 description: Silicon Laboratories
1026 description: Silead Inc.
1028 description: Silergy Corp.
1029 "^silex-insight,.*":
1030 description: Silex Insight
1032 description: Silicon Mitus, Inc.
1034 description: Siemens AG
1036 description: Cypress Semiconductor Corporation (Simtek Corporation)
1038 description: Sinlinx Electronics Technology Co., LTD
1040 description: SinoVoip Co., Ltd
1042 description: Shenzhen Sipeed Technology Co., Ltd.
1044 description: SiRF Technology, Inc.
1046 description: Silicon Integrated Systems Corp.
1048 description: Sitronix Technology Corporation
1050 description: Skyworks Solutions, Inc.
1052 description: SmartLabs LLC
1054 description: Standard Microsystems Corporation
1056 description: Synopsys, Inc.
1058 description: Shenzhen SoChip Technology Co., Ltd.
1060 description: Socionext Inc.
1062 description: SolidRun
1064 description: Solomon Systech Limited
1066 description: Sony Corporation
1068 description: Spansion Inc.
1070 description: Spreadtrum Communications Inc.
1072 description: Silicon Storage Technology, Inc.
1074 description: Xiamen Xingchen(SigmaStar) Technology Co., Ltd.
1075 (formerly part of MStar Semiconductor, Inc.)
1077 description: STMicroelectronics
1079 description: Starry Electronic Technology (ShenZhen) Co., LTD
1081 description: Startek
1083 description: ST-Ericsson
1086 description: ST-Ericsson
1088 description: ST-Ericsson
1091 description: Summit microelectronics
1093 description: Shenzhen Sunchip Technology Co., Ltd
1095 description: Sun Microsystems, Inc
1097 description: Super Micro Computer, Inc.
1099 description: Silvaco, Inc.
1101 description: Sierra Wireless
1103 description: Synaptics Inc.
1105 description: Synology, Inc.
1107 description: TBS Technologies
1108 "^tbs-biometrics,.*":
1109 description: Touchless Biometric Systems AG
1111 description: Trusted Computing Group
1113 description: Toby Churchill Ltd.
1115 description: Shangai Top Display Optoelectronics Co., Ltd
1117 description: TechNexion
1119 description: Technologic Systems
1121 description: Tempo Semiconductor
1123 description: Shenzhen Techstar Electronics Co., Ltd.
1125 description: Terasic Inc.
1127 description: Three Five Corp
1129 description: THine Electronics, Inc.
1131 description: thingy.jp
1133 description: Texas Instruments
1135 description: Tianma Micro-electronics Co., Ltd.
1137 description: Trusted Logic Mobility
1139 description: Tecon Microprocessor Technologies, LLC.
1143 description: TPO (deprecated, use tpo)
1146 description: Topwise Communication Co., Ltd.
1148 description: Toradex AG
1150 description: Toshiba Corporation
1154 description: TPK U.S.A. LLC
1156 description: TP-LINK Technologies Co., Ltd.
1160 description: TQ-Systems GmbH
1164 description: Tronsmart
1166 description: Truly Semiconductors Limited
1168 description: Visionox
1170 description: Theobroma Systems Design und Consulting GmbH
1172 description: Tyan Computer Corporation
1176 description: U-Boot bootloader
1178 description: uCRobotics
1180 description: Ubiquiti Networks
1184 description: Ugoos Industrial Co., Ltd.
1186 description: United Western Technologies Corp (UniWest)
1188 description: uPI Semiconductor Corp.
1190 description: United Radiant Technology Corporation
1192 description: Universal Scientific Industrial Co., Ltd.
1194 description: Aigo Digital Technology Co., Ltd.
1196 description: V3 Semiconductor
1198 description: Vaisala
1200 description: Vamrs Ltd.
1202 description: Variscite Ltd.
1204 description: Van der Laan b.v.
1206 description: VIA Technologies, Inc.
1208 description: Videostrong Technology Co., Ltd.
1210 description: Virtual I/O Device Specification, developed by the OASIS consortium
1212 description: Used for virtual device without specific vendor.
1214 description: Vishay Intertechnology, Inc
1216 description: Vitesse Semiconductor Corporation
1218 description: Vivante Corporation
1220 description: VoCore Studio
1222 description: Voipac Technologies s.r.o.
1224 description: Vision Optical Technology Co., Ltd.
1226 description: VXT Ltd
1228 description: Wandbord (Technexion)
1230 description: Waveshare Electronics
1232 description: Western Digital Corp.
1234 description: Würth Elektronik GmbH.
1236 description: WeTek Electronics, limited.
1240 description: Shenzhen whwave Electronics, Inc.
1242 description: Wi2Wi, Inc.
1244 description: Winbond Electronics corp.
1246 description: Winstar Display Corp.
1248 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1250 description: Wolfson Microelectronics
1252 description: Wondermedia Technologies, Inc.
1256 description: X-Powers
1258 description: Extreme Engineering Solutions (X-ES)
1260 description: Xiaomi Technology Co., Ltd.
1262 description: Xillybus Ltd.
1264 description: Shenzhen Xingbangda Display Technology Co., Ltd
1266 description: Shenzhen Xinpeng Technology Co., Ltd
1268 description: Xiphera Ltd.
1274 description: Shenzhen Xunlong Software CO.,Limited
1278 description: Yamaha Corporation
1279 "^yes-optoelectronics,.*":
1280 description: Yes Optoelectronics Co.,Ltd.
1282 description: Shenzhen Yangliming Electronic Technology Co., Ltd.
1284 description: YSH & ATIL
1285 "^yones-toptech,.*":
1286 description: Yones Toptech Co., Ltd.
1288 description: Shenzhen Yashi Changhua Intelligent Technology Co., Ltd.
1290 description: Y Soft Corporation a.s.
1294 description: Zarlink Semiconductor
1296 description: ZEITEC Semiconductor Co., LTD.
1298 description: Shenzhen Zidoo Technology Co., Ltd.
1300 description: Zodiac Inflight Innovations
1302 description: Zinitix Co., Ltd
1304 description: Shenzhen Zkmagic Technology Co., Ltd.
1306 description: ZTE Corp.
1308 description: ZyXEL Communications Corp.
1310 # Normal property name match without a comma
1311 # These should catch all node/property names without a prefix
1312 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1313 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1316 additionalProperties: false