1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|simple-graph-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Abilis Systems
29 description: Abracon Corporation
31 description: Acme Systems srl
33 description: Actions Semiconductor Co., Ltd.
35 description: Active-Semi International Inc
37 description: Avionic Design GmbH
39 description: Adafruit Industries, LLC
41 description: Adapteva, Inc.
43 description: Adaptrum, Inc.
45 description: AD Holdings Plc.
47 description: Analog Devices, Inc.
49 description: Advantech Corporation
50 "^aeroflexgaisler,.*":
51 description: Aeroflex Gaisler AB
53 description: Annapurna Labs
55 description: Allegro DVT
59 description: Allwinner Technology Co., Ltd.
61 description: AlphaScale Integrated Circuits Systems, Inc.
63 description: Alps Electric Co., Ltd.
65 description: Altera Corp.
67 description: Amarula Solutions
69 description: Amazon.com, Inc.
71 description: Applied Micro Circuits Corporation (APM, formally AMCC)
73 description: Advanced Micro Devices (AMD), Inc.
75 description: Shenzhen Amediatech Technology Co., Ltd
77 description: Amlogic, Inc.
79 description: Ampire Co., Ltd.
83 description: AMS-Taos Inc.
85 description: Analogix Semiconductor, Inc.
87 description: Andes Technology Corporation
89 description: Anvo-Systems Dresden GmbH
91 description: Applied Micro Circuits Corporation (APM)
93 description: Aptina Imaging
95 description: Arasan Chip Systems
97 description: ArcherMind Technology (Nanjing) Co., Ltd.
99 description: Arctic Sand
101 description: arcx Inc. / Archronix Inc.
103 description: Aries Embedded GmbH
105 description: ARM Ltd.
107 description: ARMadeus Systems SARL
109 description: Arrow Electronics
111 description: Artesyn Embedded Technologies Inc.
113 description: Asahi Kasei Corp.
115 description: All Sensors Corporation
117 description: ASPEED Technology Inc.
119 description: AsusTek Computer Inc.
121 description: Atlas Scientific LLC
123 description: Atmel Corporation
125 description: AU Optronics Corporation
127 description: Auvidea GmbH
129 description: Avago Technologies
131 description: avia semiconductor
133 description: Shanghai AVIC Optoelectronics Co., Ltd.
135 description: Avnet, Inc.
137 description: Axentia Technologies AB
139 description: Axis Communications AB
141 description: Azoteq (Pty) Ltd
143 description: Shenzhen AZW Technology Co., Ltd.
145 description: BAIKAL ELECTRONICS, JSC
147 description: BIPAI KEJI LIMITED
149 description: Compass Electronics Group, LLC
151 description: BeagleBoard.org Foundation
153 description: Beckhoff Automation GmbH & Co. KG
155 description: Bitmain Technologies
157 description: BOE Technology Group Co., Ltd.
159 description: Bosch Sensortec GmbH
161 description: Boundary Devices Inc.
163 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
165 description: Broadcom Corporation
167 description: Buffalo, Inc.
169 description: B&R Industrial Automation GmbH
171 description: Bticino International
173 description: CALAO Systems SAS
177 description: Capella Microsystems, Inc
179 description: Cascoda, Ltd.
181 description: Catalyst Semiconductor, Inc.
183 description: Cavium, Inc.
185 description: Cadence Design Systems Inc.
187 description: CDTech(H.K.) Electronics Limited
189 description: Ceva, Inc.
191 description: Check Point Software Technologies Ltd.
193 description: Chipidea, Inc
197 description: ChipSPARK
199 description: Common Hardware Reference Platform
201 description: Chunghwa Picture Tubes Ltd.
203 description: Chuwi Innovation Ltd.
205 description: Computadora Industrial Abierta Argentina
207 description: Cirrus Logic, Inc.
209 description: Cloud Engines, Inc.
211 description: Chips&Media, Inc.
213 description: Conexant Systems, Inc.
215 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
217 description: CompuLab Ltd.
219 description: CORERIVER Semiconductor Co.,Ltd.
221 description: Chengdu Corpro Technology Co., Ltd.
223 description: Cortina Systems, Inc.
225 description: Cosmic Circuits
227 description: Crane Connectivity Solutions
229 description: Creative Technology Ltd
231 description: Crystalfontz America, Inc.
233 description: Hangzhou C-SKY Microsystems Co., Ltd
235 description: Shenzen Chuangsiqi Technology Co.,Ltd.
237 description: Cubietech, Ltd.
239 description: Cypress Semiconductor Corporation
241 description: CZ.NIC, z.s.p.o.
243 description: Maxim Integrated Products (formerly Dallas Semiconductor)
245 description: DataImage, Inc.
247 description: DAVICOM Semiconductor, Inc.
249 description: Dell Inc.
251 description: Delta Electronics, Inc.
253 description: Denx Software Engineering
255 description: Devantech, Ltd.
257 description: DH electronics GmbH
259 description: Shenzhen Yagu Electronic Technology Co., Ltd.
261 description: Digi International Inc.
263 description: Diglent, Inc.
265 description: Dioo Microcircuit Co., Ltd
267 description: DLC Display Co., Ltd.
269 description: Dialog Semiconductor
271 description: D-Link Corporation
273 description: Data Modul AG
275 description: Domintech Co., Ltd.
277 description: Dongwoon Anatech
279 description: DPTechnics
281 description: Dragino Technology Co., Limited
283 description: dServe Technology B.V.
285 description: Dyna-Image
287 description: Embedded Artists AB
289 description: EBS-SYSTART GmbH
291 description: EBV Elektronik
293 description: Eckelmann AG
295 description: Emerging Display Technologies
297 description: eGalax_eMPIA Technology Inc
299 description: Einfochips
301 description: Elan Microelectronic Corp.
303 description: Elgin S/A.
305 description: Shenzhen Elida Technology Co., Ltd.
307 description: Shenzhen Embest Technology Co., Ltd.
309 description: Emlid, Ltd.
311 description: EM Microelectronic
312 "^empire-electronix,.*":
313 description: Empire Electronix
315 description: emtrion GmbH
317 description: Endless Mobile, Inc.
319 description: ENE Technology, Inc.
321 description: Silicon Laboratories (formerly Energy Micro AS)
323 description: Engicam S.r.l.
325 description: EPCOS AG
327 description: Ecole Polytechnique Fédérale de Lausanne
329 description: Seiko Epson Corp.
331 description: Espressif Systems Co. Ltd.
333 description: ESTeem Wireless Modems
335 description: NI Ettus Research
337 description: Eukréa Electromatique
339 description: Everest Semiconductor Co. Ltd.
341 description: Everspin Technologies, Inc.
343 description: Evervision Electronics Co. Ltd.
345 description: Exar Corporation
349 description: EZchip Semiconductor
351 description: Facebook
353 description: Fairphone B.V.
355 description: Faraday Technology Corporation
357 description: Fastrax Oy
359 description: Fairchild Semiconductor
361 description: Shenzhen Feixin Photoelectic Co., Ltd
363 description: Shenzhen Fly Young Technology Co.,LTD.
367 description: FocalTech Systems Co.,Ltd
369 description: Shenzhen Frida LCD Co., Ltd.
371 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
373 description: Freescale Semiconductor
375 description: Fujitsu Ltd.
377 description: GARDENA GmbH
379 description: Gateworks Corporation
381 description: Game Consoles Worldwide
383 description: General Electric Company
385 description: GeekBuying
387 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
389 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
391 description: Gemei Digital Technology Co., Ltd.
393 description: Geniatech, Inc.
395 description: Giantec Semiconductor, Inc.
397 description: Giantplus Technology Co., Ltd.
399 description: Globalscale Technologies, Inc.
401 description: GlobalTop Technology, Inc.
403 description: Global Mixed-mode Technology, Inc.
405 description: Shenzhen Huiding Technology Co., Ltd.
407 description: Google, Inc.
411 description: Garmin Limited
413 description: Gumstix, Inc.
415 description: Gateworks Corporation
417 description: HannStar Display Corporation
419 description: Haoyu Microelectronic Co. Ltd.
421 description: Hardkernel Co., Ltd
423 description: HiDeep Inc.
425 description: Himax Technologies, Inc.
427 description: Hisilicon Limited.
429 description: Hitachi Ltd.
431 description: Hitex Development Tools
433 description: Holt Integrated Circuits, Inc.
435 description: Honeywell
437 description: Jiangsu HopeRun Software Co., Ltd.
439 description: Hewlett Packard
441 description: HannStar Display Co.
443 description: Holtek Semiconductor, Inc.
445 description: Shenzhen Hugsun Technology Co. Ltd.
447 description: HwaCom Systems Inc.
449 description: Hydis Technologies
451 description: Hyundai Technology
453 description: I2SE GmbH
455 description: International Business Machines (IBM)
457 description: IC Plus Corp.
459 description: Integrated Device Technologies, Inc.
461 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
463 description: ILI Technology Corporation (ILITEK)
465 description: Imagination Technologies Ltd.
467 description: In-Circuit GmbH
469 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
471 description: Infineon Technologies
473 description: Inforce Computing
475 description: Ingenic Semiconductor
477 description: Innolux Corporation
479 description: INSIDE Secure
481 description: Inspur Corporation
483 description: Intel Corporation
485 description: Inter Control Group
487 description: InvenSense Inc.
489 description: Inverse Path
491 description: Iomega Corporation
493 description: ISEE 2007 S.L.
495 description: Intersil
497 description: Integrated Silicon Solutions Inc.
499 description: ITE Tech, Inc.
501 description: ITEAD Intelligent Systems Co.Ltd
503 description: iWave Systems Technologies Pvt. Ltd.
505 description: Japan Display Inc.
507 description: JEDEC Solid State Technology Association
509 description: Shenzhen Jesurun Electronics Business Dept.
511 description: Jiandangjing Technology Co., Ltd.
513 description: Kamstrup A/S
515 description: Ka-Ro electronics GmbH
517 description: Keith & Koep GmbH
519 description: Keymile GmbH
523 description: Kieback & Peter GmbH
525 description: Kinetic Technologies
527 description: King & Display Technology Co., Ltd.
529 description: Kingnovel Technology Co., Ltd.
531 description: Kionix, Inc.
533 description: Rakuten Kobo Inc.
535 description: Kaohsiung Opto-Electronics Inc.
537 description: Kontron S&T AG
539 description: Sutajio Ko-Usagi PTE Ltd.
541 description: Kyocera Corporation
545 description: Laird PLC
547 description: Ketai Huajie Technology Co., Ltd.
549 description: Lantiq Semiconductor
551 description: Lattice Semiconductor
553 description: Shenzhen Leadtek Technology Co., Ltd.
557 description: LEGO Systems A/S
559 description: Shenzhen LeMaker Technology Co., Ltd.
561 description: Lenovo Group Ltd.
563 description: LG Corporation
565 description: LG Display
567 description: Shenzhen Libre Technology Co., Ltd
569 description: Lichee Pi
571 description: Linaro Limited
573 description: LinkSprite Technologies, Inc.
575 description: Belkin International, Inc. (Linksys)
577 description: Linutronix GmbH
579 description: Linux-specific binding
581 description: Linx Technologies
583 description: Linear Technology Corporation
585 description: Logic PD, Inc.
587 description: Logic Technologies Limited
589 description: Longcheer Technology (Shanghai) Co., Ltd.
591 description: Loongson Technology Corporation Limited
593 description: LSI Corp. (LSI Logic)
595 description: Liebherr-Werk Nenzing GmbH
597 description: Macnica Americas
599 description: Mapleboard.org
601 description: Marvell Technology Group Ltd.
603 description: MaxBotix Inc.
605 description: Maxim Integrated Products
607 description: Mobiveil Inc.
611 description: Measurement Specialties
613 description: Mustek Limited
615 description: MediaTek Inc.
617 description: MegaChips
619 description: Shenzhen MeLE Digital Technology Ltd.
621 description: Melexis N.V.
623 description: MELFAS Inc.
625 description: Mellanox Technologies
627 description: MEMSIC Inc.
629 description: Menlo Systems GmbH
631 description: Merrii Technology Co., Ltd.
633 description: Micrel Inc.
635 description: Microchip Technology Inc.
637 description: Micro Crystal AG
639 description: Micron Technology Inc.
641 description: Microsoft Corporation
643 description: MikroElektronika d.o.o.
645 description: Miniand Tech
647 description: MINIX Technology Ltd.
649 description: MiraMEMS Sensing Technology Co., Ltd.
651 description: Mitsubishi Electric Corporation
653 description: Mosaix Technologies, Inc.
655 description: Motorola, Inc.
657 description: Moxa Inc.
661 description: Monolithic Power Systems Inc.
663 description: mqmaker Inc.
665 description: Marvell Technology Group Ltd.
668 description: Microsemi Corporation
670 description: Micro-Star International Co. Ltd.
672 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
674 description: Multi-Inno Technology Co.,Ltd
676 description: Mundo Reader S.L.
678 description: Murata Manufacturing Co., Ltd.
680 description: Macronix International Co., Ltd.
682 description: MYIR Tech Limited
684 description: National Semiconductor
686 description: NEC LCD Technologies, Ltd.
688 description: Neonode Inc.
692 description: Broadcom Corporation (formerly NetLogic Microsystems)
694 description: Netron DY
696 description: Shenzhen Netxeon Technology CO., LTD
698 description: Guangdong Neweast Optoelectronics CO., LTD
702 description: Next Thing Co.
704 description: Newhaven Display International
706 description: National Instruments
708 description: Nintendo
710 description: NLT Technologies, Ltd.
714 description: Nordic Semiconductor
716 description: NovTech, Inc.
718 description: NutsBoard
720 description: Nuvoton Technology Corporation
722 description: New Vision Display
726 description: NXP Semiconductors
728 description: Oceanic Systems (UK) Ltd.
730 description: Okaya Electric America, Inc.
732 description: Oki Electric Industry Co., Ltd.
734 description: OLIMEX Ltd.
736 description: One Laptop Per Child
738 description: Onion Corporation
740 description: ON Semiconductor Corp.
742 description: On Tat Industrial Company
744 description: Opal Kelly Incorporated
746 description: OpenCores.org
748 description: OpenRISC.io
750 description: Option NV
752 description: Shenzhen Oranth Technology Co., Ltd.
754 description: Oracle Corporation
756 description: Orise Technology
758 description: Ortus Technology Co., Ltd.
760 description: OSD Displays
762 description: Overkiz SAS
764 description: OmniVision Technologies
766 description: Oxford Semiconductor, Ltd.
768 description: OzzMaker
770 description: Panasonic Corporation
772 description: Parade Technologies Inc.
774 description: Parallax Inc.
776 description: Precision Design Associates, Inc.
778 description: Pericom Technology Inc.
780 description: Pervasive Displays, Inc.
782 description: PHICOMM Co., Ltd.
784 description: PHYTEC Messtechnik GmbH
786 description: Picochip Ltd
790 description: Shenzhen PineRiver Designs Co., Ltd.
792 description: PIXCIR MICROELECTRONICS Co., Ltd
794 description: Plantower Co., Ltd
796 description: Plat\'Home Co., Ltd.
800 description: Broadcom Corporation (formerly PLX Technology)
802 description: PNI Sensor Corporation
804 description: PocketBook International SA
806 description: Polaroid Corporation
808 description: Portwell Inc.
810 description: Poslab Technology Co., Ltd.
812 description: Point of View International B.V.
814 description: PowerVR (deprecated, use img)
816 description: Primux Trading, S.L.
818 description: PROBOX2 (by W2COMP Co., Ltd.)
820 description: Protonic Holland
822 description: PulsedLight, Inc
824 description: Purism, SPC
826 description: Qualcomm Atheros, Inc.
828 description: Qualcomm Technologies, Inc
830 description: QEMU, a generic and open source machine emulator and virtualizer
832 description: Qi Hardware
834 description: Chengdu Kaixuan Information Technology Co., Ltd.
836 description: QiaoDian XianShi Corporation
838 description: QNAP Systems, Inc.
842 description: RaidSonic Technology GmbH
844 description: Mediatek/Ralink Technology Corp.
846 description: Ramtron International
848 description: Raspberry Pi Foundation
850 description: Raydium Semiconductor Corp.
852 description: Unisoc Communications, Inc.
854 description: Realtek Semiconductor Corp.
856 description: Renesas Electronics Corporation
858 description: Shenzhen Rervision Technology Co., Ltd.
860 description: Richtek Technology Corporation
862 description: Ricoh Co. Ltd.
864 description: Rikomagic Tech Corp. Ltd
866 description: RISC-V Foundation
868 description: Fuzhou Rockchip Electronics Co., Ltd
870 description: ROCKTECH DISPLAYS LIMITED
872 description: ROHM Semiconductor Co., Ltd
874 description: Ronbo Electronics
876 description: Shenzhen Roofull Technology Co, Ltd
878 description: Samsung Semiconductor
880 description: Samtec/Softing company
882 description: Sancloud Ltd
884 description: Sandisk Corporation
886 description: Satoz International Co., Ltd
888 description: Smart Battery System
890 description: Schindler
892 description: Seagate Technology PLC
894 description: Shenzhen SEI Robotics Co., Ltd
896 description: Semtech Corporation
898 description: Sensirion AG
900 description: Sensortek Technology Corporation
902 description: Small Form Factor Committee
904 description: Solomon Goldentek Display Corporation
906 description: SG Micro Corp
908 description: SGX Sensortech
910 description: Sharp Corporation
912 description: Shimafuji Electric, Inc.
914 description: Si-En Technology Ltd.
916 description: Silicon Linux Corporation
918 description: SiFive, Inc.
920 description: Sigma Designs, Inc.
922 description: Seiko Instruments, Inc.
924 description: Silicon Image
926 description: Silicon Laboratories
928 description: Silead Inc.
930 description: Silergy Corp.
932 description: Silicon Mitus, Inc.
934 description: Cypress Semiconductor Corporation (Simtek Corporation)
936 description: Sinlinx Electronics Technology Co., LTD
938 description: SinoVoip Co., Ltd
940 description: Shenzhen Sipeed Technology Co., Ltd.
942 description: SiRF Technology, Inc.
944 description: Silicon Integrated Systems Corp.
946 description: Sitronix Technology Corporation
948 description: Skyworks Solutions, Inc.
950 description: Standard Microsystems Corporation
952 description: Synopsys, Inc.
954 description: Shenzhen SoChip Technology Co., Ltd.
956 description: Socionext Inc.
958 description: SolidRun
960 description: Solomon Systech Limited
962 description: Sony Corporation
964 description: Spansion Inc.
966 description: Spreadtrum Communications Inc.
968 description: Silicon Storage Technology, Inc.
970 description: STMicroelectronics
972 description: Starry Electronic Technology (ShenZhen) Co., LTD
976 description: ST-Ericsson
979 description: ST-Ericsson
981 description: ST-Ericsson
984 description: Summit microelectronics
986 description: Shenzhen Sunchip Technology Co., Ltd
988 description: Sun Microsystems, Inc
990 description: Sierra Wireless
992 description: Synaptics Inc.
994 description: Synology, Inc.
996 description: TBS Technologies
997 "^tbs-biometrics,.*":
998 description: Touchless Biometric Systems AG
1000 description: Trusted Computing Group
1002 description: Toby Churchill Ltd.
1004 description: TechNexion
1006 description: Technologic Systems
1008 description: Tempo Semiconductor
1010 description: Shenzhen Techstar Electronics Co., Ltd.
1012 description: Terasic Inc.
1014 description: Three Five Corp
1016 description: THine Electronics, Inc.
1018 description: Texas Instruments
1020 description: Tianma Micro-electronics Co., Ltd.
1022 description: Trusted Logic Mobility
1024 description: Tecon Microprocessor Technologies, LLC.
1028 description: TPO (deprecated, use tpo)
1031 description: Topwise Communication Co., Ltd.
1033 description: Toradex AG
1035 description: Toshiba Corporation
1039 description: TPK U.S.A. LLC
1041 description: TP-LINK Technologies Co., Ltd.
1045 description: TQ Systems GmbH
1049 description: Tronsmart
1051 description: Truly Semiconductors Limited
1053 description: Theobroma Systems Design und Consulting GmbH
1055 description: Tyan Computer Corporation
1059 description: U-Boot bootloader
1061 description: uCRobotics
1063 description: Ubiquiti Networks
1067 description: Ugoos Industrial Co., Ltd.
1069 description: United Western Technologies Corp (UniWest)
1071 description: uPI Semiconductor Corp.
1073 description: United Radiant Technology Corporation
1075 description: Universal Scientific Industrial Co., Ltd.
1077 description: Aigo Digital Technology Co., Ltd.
1079 description: V3 Semiconductor
1081 description: Vaisala
1083 description: Vamrs Ltd.
1085 description: Variscite Ltd.
1087 description: VIA Technologies, Inc.
1089 description: Videostrong Technology Co., Ltd.
1091 description: Virtual I/O Device Specification, developed by the OASIS consortium
1093 description: Vishay Intertechnology, Inc
1095 description: Vitesse Semiconductor Corporation
1097 description: Vivante Corporation
1099 description: VoCore Studio
1101 description: Voipac Technologies s.r.o.
1103 description: Vision Optical Technology Co., Ltd.
1105 description: VXT Ltd
1107 description: Waveshare Electronics
1109 description: Western Digital Corp.
1111 description: Würth Elektronik GmbH.
1113 description: WeTek Electronics, limited.
1117 description: Shenzhen whwave Electronics, Inc.
1119 description: Wi2Wi, Inc.
1121 description: Winbond Electronics corp.
1123 description: Winstar Display Corp.
1125 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1127 description: Wolfson Microelectronics
1129 description: Wondermedia Technologies, Inc.
1133 description: X-Powers
1135 description: Extreme Engineering Solutions (X-ES)
1137 description: Xiaomi Technology Co., Ltd.
1139 description: Xillybus Ltd.
1141 description: Shenzhen Xinpeng Technology Co., Ltd
1145 description: Shenzhen Xunlong Software CO.,Limited
1149 description: YSH & ATIL
1150 "^yones-toptech,.*":
1151 description: Yones Toptech Co., Ltd.
1153 description: Y Soft Corporation a.s.
1155 description: Zarlink Semiconductor
1157 description: ZEITEC Semiconductor Co., LTD.
1159 description: Shenzhen Zidoo Technology Co., Ltd.
1161 description: Zodiac Inflight Innovations
1163 description: ZTE Corp.
1165 description: ZyXEL Communications Corp.
1167 # Normal property name match without a comma
1168 # These should catch all node/property names without a prefix
1169 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1170 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1173 additionalProperties: false