1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|simple-graph-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Abilis Systems
29 description: Abracon Corporation
31 description: Acme Systems srl
33 description: Actions Semiconductor Co., Ltd.
35 description: Active-Semi International Inc
37 description: Avionic Design GmbH
39 description: Adafruit Industries, LLC
41 description: Adapteva, Inc.
43 description: Adaptrum, Inc.
45 description: AD Holdings Plc.
47 description: Analog Devices, Inc.
49 description: Advantech Corporation
50 "^aeroflexgaisler,.*":
51 description: Aeroflex Gaisler AB
53 description: Annapurna Labs
55 description: Allegro DVT
59 description: Allwinner Technology Co., Ltd.
61 description: AlphaScale Integrated Circuits Systems, Inc.
63 description: Alps Electric Co., Ltd.
65 description: Altera Corp.
67 description: Amarula Solutions
69 description: Amazon.com, Inc.
71 description: Applied Micro Circuits Corporation (APM, formally AMCC)
73 description: Advanced Micro Devices (AMD), Inc.
75 description: Shenzhen Amediatech Technology Co., Ltd
77 description: Amlogic, Inc.
79 description: Ampire Co., Ltd.
83 description: AMS-Taos Inc.
85 description: Analogix Semiconductor, Inc.
87 description: Andes Technology Corporation
89 description: Anvo-Systems Dresden GmbH
91 description: Applied Micro Circuits Corporation (APM)
93 description: Aptina Imaging
95 description: Arasan Chip Systems
97 description: ArcherMind Technology (Nanjing) Co., Ltd.
99 description: Arctic Sand
101 description: arcx Inc. / Archronix Inc.
103 description: Aries Embedded GmbH
105 description: ARM Ltd.
107 description: ARMadeus Systems SARL
109 description: Arrow Electronics
111 description: Artesyn Embedded Technologies Inc.
113 description: Asahi Kasei Corp.
115 description: All Sensors Corporation
117 description: ASPEED Technology Inc.
119 description: AsusTek Computer Inc.
121 description: Atlas Scientific LLC
123 description: Atmel Corporation
125 description: AU Optronics Corporation
127 description: Auvidea GmbH
129 description: Avago Technologies
131 description: avia semiconductor
133 description: Shanghai AVIC Optoelectronics Co., Ltd.
135 description: Avnet, Inc.
137 description: Axentia Technologies AB
139 description: Axis Communications AB
141 description: Azoteq (Pty) Ltd
143 description: Shenzhen AZW Technology Co., Ltd.
145 description: BIPAI KEJI LIMITED
147 description: Compass Electronics Group, LLC
149 description: BeagleBoard.org Foundation
151 description: Beckhoff Automation GmbH & Co. KG
153 description: Bitmain Technologies
155 description: BOE Technology Group Co., Ltd.
157 description: Bosch Sensortec GmbH
159 description: Boundary Devices Inc.
161 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
163 description: Broadcom Corporation
165 description: Buffalo, Inc.
167 description: B&R Industrial Automation GmbH
169 description: Bticino International
171 description: CALAO Systems SAS
175 description: Capella Microsystems, Inc
177 description: Cascoda, Ltd.
179 description: Catalyst Semiconductor, Inc.
181 description: Cavium, Inc.
183 description: Cadence Design Systems Inc.
185 description: CDTech(H.K.) Electronics Limited
187 description: Ceva, Inc.
189 description: Chipidea, Inc
193 description: ChipSPARK
195 description: Common Hardware Reference Platform
197 description: Chunghwa Picture Tubes Ltd.
199 description: Chuwi Innovation Ltd.
201 description: Computadora Industrial Abierta Argentina
203 description: Cirrus Logic, Inc.
205 description: Cloud Engines, Inc.
207 description: Chips&Media, Inc.
209 description: Conexant Systems, Inc.
211 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
213 description: CompuLab Ltd.
215 description: CORERIVER Semiconductor Co.,Ltd.
217 description: Chengdu Corpro Technology Co., Ltd.
219 description: Cortina Systems, Inc.
221 description: Cosmic Circuits
223 description: Crane Connectivity Solutions
225 description: Creative Technology Ltd
227 description: Crystalfontz America, Inc.
229 description: Hangzhou C-SKY Microsystems Co., Ltd
231 description: Shenzen Chuangsiqi Technology Co.,Ltd.
233 description: Cubietech, Ltd.
235 description: Cypress Semiconductor Corporation
237 description: CZ.NIC, z.s.p.o.
239 description: Maxim Integrated Products (formerly Dallas Semiconductor)
241 description: DataImage, Inc.
243 description: DAVICOM Semiconductor, Inc.
245 description: Dell Inc.
247 description: Delta Electronics, Inc.
249 description: Denx Software Engineering
251 description: Devantech, Ltd.
253 description: DH electronics GmbH
255 description: Shenzhen Yagu Electronic Technology Co., Ltd.
257 description: Digi International Inc.
259 description: Diglent, Inc.
261 description: Dioo Microcircuit Co., Ltd
263 description: DLC Display Co., Ltd.
265 description: Dialog Semiconductor
267 description: D-Link Corporation
269 description: Data Modul AG
271 description: Domintech Co., Ltd.
273 description: Dongwoon Anatech
275 description: DPTechnics
277 description: Dragino Technology Co., Limited
279 description: dServe Technology B.V.
281 description: Dyna-Image
283 description: Embedded Artists AB
285 description: EBS-SYSTART GmbH
287 description: EBV Elektronik
289 description: Eckelmann AG
291 description: Emerging Display Technologies
293 description: eGalax_eMPIA Technology Inc
295 description: Einfochips
297 description: Elan Microelectronic Corp.
299 description: Elgin S/A.
301 description: Shenzhen Elida Technology Co., Ltd.
303 description: Shenzhen Embest Technology Co., Ltd.
305 description: Emlid, Ltd.
307 description: EM Microelectronic
308 "^empire-electronix,.*":
309 description: Empire Electronix
311 description: emtrion GmbH
313 description: Endless Mobile, Inc.
315 description: ENE Technology, Inc.
317 description: Silicon Laboratories (formerly Energy Micro AS)
319 description: Engicam S.r.l.
321 description: EPCOS AG
323 description: Ecole Polytechnique Fédérale de Lausanne
325 description: Seiko Epson Corp.
327 description: Espressif Systems Co. Ltd.
329 description: ESTeem Wireless Modems
331 description: NI Ettus Research
333 description: Eukréa Electromatique
335 description: Everest Semiconductor Co. Ltd.
337 description: Everspin Technologies, Inc.
339 description: Evervision Electronics Co. Ltd.
341 description: Exar Corporation
345 description: EZchip Semiconductor
347 description: Facebook
349 description: Fairphone B.V.
351 description: Faraday Technology Corporation
353 description: Fastrax Oy
355 description: Fairchild Semiconductor
357 description: Shenzhen Feixin Photoelectic Co., Ltd
359 description: Shenzhen Fly Young Technology Co.,LTD.
363 description: FocalTech Systems Co.,Ltd
365 description: Shenzhen Frida LCD Co., Ltd.
367 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
369 description: Freescale Semiconductor
371 description: Fujitsu Ltd.
373 description: GARDENA GmbH
375 description: Gateworks Corporation
377 description: Game Consoles Worldwide
379 description: General Electric Company
381 description: GeekBuying
383 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
385 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
387 description: Gemei Digital Technology Co., Ltd.
389 description: Geniatech, Inc.
391 description: Giantec Semiconductor, Inc.
393 description: Giantplus Technology Co., Ltd.
395 description: Globalscale Technologies, Inc.
397 description: GlobalTop Technology, Inc.
399 description: Global Mixed-mode Technology, Inc.
401 description: Shenzhen Huiding Technology Co., Ltd.
403 description: Google, Inc.
407 description: Garmin Limited
409 description: Gumstix, Inc.
411 description: Gateworks Corporation
413 description: HannStar Display Corporation
415 description: Haoyu Microelectronic Co. Ltd.
417 description: Hardkernel Co., Ltd
419 description: HiDeep Inc.
421 description: Himax Technologies, Inc.
423 description: Hisilicon Limited.
425 description: Hitachi Ltd.
427 description: Hitex Development Tools
429 description: Holt Integrated Circuits, Inc.
431 description: Honeywell
433 description: Jiangsu HopeRun Software Co., Ltd.
435 description: Hewlett Packard
437 description: HannStar Display Co.
439 description: Holtek Semiconductor, Inc.
441 description: Shenzhen Hugsun Technology Co. Ltd.
443 description: HwaCom Systems Inc.
445 description: Hydis Technologies
447 description: Hyundai Technology
449 description: I2SE GmbH
451 description: International Business Machines (IBM)
453 description: IC Plus Corp.
455 description: Integrated Device Technologies, Inc.
457 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
459 description: ILI Technology Corporation (ILITEK)
461 description: Imagination Technologies Ltd.
463 description: In-Circuit GmbH
465 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
467 description: Infineon Technologies
469 description: Inforce Computing
471 description: Ingenic Semiconductor
473 description: Innolux Corporation
475 description: INSIDE Secure
477 description: Inspur Corporation
479 description: Intel Corporation
481 description: Inter Control Group
483 description: InvenSense Inc.
485 description: Inverse Path
487 description: Iomega Corporation
489 description: ISEE 2007 S.L.
491 description: Intersil
493 description: Integrated Silicon Solutions Inc.
495 description: ITE Tech, Inc.
497 description: ITEAD Intelligent Systems Co.Ltd
499 description: iWave Systems Technologies Pvt. Ltd.
501 description: Japan Display Inc.
503 description: JEDEC Solid State Technology Association
505 description: Shenzhen Jesurun Electronics Business Dept.
507 description: Jiandangjing Technology Co., Ltd.
509 description: Kamstrup A/S
511 description: Ka-Ro electronics GmbH
513 description: Keith & Koep GmbH
515 description: Keymile GmbH
519 description: Kieback & Peter GmbH
521 description: Kinetic Technologies
523 description: King & Display Technology Co., Ltd.
525 description: Kingnovel Technology Co., Ltd.
527 description: Kionix, Inc.
529 description: Rakuten Kobo Inc.
531 description: Kaohsiung Opto-Electronics Inc.
533 description: Kontron S&T AG
535 description: Sutajio Ko-Usagi PTE Ltd.
537 description: Kyocera Corporation
541 description: Laird PLC
543 description: Ketai Huajie Technology Co., Ltd.
545 description: Lantiq Semiconductor
547 description: Lattice Semiconductor
549 description: Shenzhen Leadtek Technology Co., Ltd.
553 description: LEGO Systems A/S
555 description: Shenzhen LeMaker Technology Co., Ltd.
557 description: Lenovo Group Ltd.
559 description: LG Corporation
561 description: LG Display
563 description: Shenzhen Libre Technology Co., Ltd
565 description: Lichee Pi
567 description: Linaro Limited
569 description: LinkSprite Technologies, Inc.
571 description: Belkin International, Inc. (Linksys)
573 description: Linutronix GmbH
575 description: Linux-specific binding
577 description: Linx Technologies
579 description: Linear Technology Corporation
581 description: Logic PD, Inc.
583 description: Logic Technologies Limited
585 description: Longcheer Technology (Shanghai) Co., Ltd.
587 description: Loongson Technology Corporation Limited
589 description: LSI Corp. (LSI Logic)
591 description: Liebherr-Werk Nenzing GmbH
593 description: Macnica Americas
595 description: Mapleboard.org
597 description: Marvell Technology Group Ltd.
599 description: MaxBotix Inc.
601 description: Maxim Integrated Products
603 description: Mobiveil Inc.
607 description: Measurement Specialties
609 description: Mustek Limited
611 description: MediaTek Inc.
613 description: MegaChips
615 description: Shenzhen MeLE Digital Technology Ltd.
617 description: Melexis N.V.
619 description: MELFAS Inc.
621 description: Mellanox Technologies
623 description: MEMSIC Inc.
625 description: Menlo Systems GmbH
627 description: Merrii Technology Co., Ltd.
629 description: Micrel Inc.
631 description: Microchip Technology Inc.
633 description: Micro Crystal AG
635 description: Micron Technology Inc.
637 description: Microsoft Corporation
639 description: MikroElektronika d.o.o.
641 description: Miniand Tech
643 description: MINIX Technology Ltd.
645 description: MiraMEMS Sensing Technology Co., Ltd.
647 description: Mitsubishi Electric Corporation
649 description: Mosaix Technologies, Inc.
651 description: Motorola, Inc.
653 description: Moxa Inc.
657 description: Monolithic Power Systems Inc.
659 description: mqmaker Inc.
661 description: Marvell Technology Group Ltd.
664 description: Microsemi Corporation
666 description: Micro-Star International Co. Ltd.
668 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
670 description: Multi-Inno Technology Co.,Ltd
672 description: Mundo Reader S.L.
674 description: Murata Manufacturing Co., Ltd.
676 description: Macronix International Co., Ltd.
678 description: MYIR Tech Limited
680 description: National Semiconductor
682 description: NEC LCD Technologies, Ltd.
684 description: Neonode Inc.
688 description: Broadcom Corporation (formerly NetLogic Microsystems)
690 description: Netron DY
692 description: Shenzhen Netxeon Technology CO., LTD
694 description: Guangdong Neweast Optoelectronics CO., LTD
698 description: Next Thing Co.
700 description: Newhaven Display International
702 description: National Instruments
704 description: Nintendo
706 description: NLT Technologies, Ltd.
710 description: Nordic Semiconductor
712 description: NovTech, Inc.
714 description: NutsBoard
716 description: Nuvoton Technology Corporation
718 description: New Vision Display
722 description: NXP Semiconductors
724 description: Oceanic Systems (UK) Ltd.
726 description: Okaya Electric America, Inc.
728 description: Oki Electric Industry Co., Ltd.
730 description: OLIMEX Ltd.
732 description: One Laptop Per Child
734 description: Onion Corporation
736 description: ON Semiconductor Corp.
738 description: On Tat Industrial Company
740 description: Opal Kelly Incorporated
742 description: OpenCores.org
744 description: OpenRISC.io
746 description: Option NV
748 description: Shenzhen Oranth Technology Co., Ltd.
750 description: Oracle Corporation
752 description: Orise Technology
754 description: Ortus Technology Co., Ltd.
756 description: OSD Displays
758 description: Overkiz SAS
760 description: OmniVision Technologies
762 description: Oxford Semiconductor, Ltd.
764 description: OzzMaker
766 description: Panasonic Corporation
768 description: Parade Technologies Inc.
770 description: Parallax Inc.
772 description: Precision Design Associates, Inc.
774 description: Pericom Technology Inc.
776 description: Pervasive Displays, Inc.
778 description: PHICOMM Co., Ltd.
780 description: PHYTEC Messtechnik GmbH
782 description: Picochip Ltd
786 description: Shenzhen PineRiver Designs Co., Ltd.
788 description: PIXCIR MICROELECTRONICS Co., Ltd
790 description: Plantower Co., Ltd
792 description: Plat\'Home Co., Ltd.
796 description: Broadcom Corporation (formerly PLX Technology)
798 description: PNI Sensor Corporation
800 description: PocketBook International SA
802 description: Polaroid Corporation
804 description: Portwell Inc.
806 description: Poslab Technology Co., Ltd.
808 description: Point of View International B.V.
810 description: PowerVR (deprecated, use img)
812 description: Primux Trading, S.L.
814 description: PROBOX2 (by W2COMP Co., Ltd.)
816 description: Protonic Holland
818 description: PulsedLight, Inc
820 description: Purism, SPC
822 description: Qualcomm Atheros, Inc.
824 description: Qualcomm Technologies, Inc
826 description: QEMU, a generic and open source machine emulator and virtualizer
828 description: Qi Hardware
830 description: Chengdu Kaixuan Information Technology Co., Ltd.
832 description: QiaoDian XianShi Corporation
834 description: QNAP Systems, Inc.
838 description: RaidSonic Technology GmbH
840 description: Mediatek/Ralink Technology Corp.
842 description: Ramtron International
844 description: Raspberry Pi Foundation
846 description: Raydium Semiconductor Corp.
848 description: Unisoc Communications, Inc.
850 description: Realtek Semiconductor Corp.
852 description: Renesas Electronics Corporation
854 description: Shenzhen Rervision Technology Co., Ltd.
856 description: Richtek Technology Corporation
858 description: Ricoh Co. Ltd.
860 description: Rikomagic Tech Corp. Ltd
862 description: RISC-V Foundation
864 description: Fuzhou Rockchip Electronics Co., Ltd
866 description: ROCKTECH DISPLAYS LIMITED
868 description: ROHM Semiconductor Co., Ltd
870 description: Ronbo Electronics
872 description: Shenzhen Roofull Technology Co, Ltd
874 description: Samsung Semiconductor
876 description: Samtec/Softing company
878 description: Sancloud Ltd
880 description: Sandisk Corporation
882 description: Satoz International Co., Ltd
884 description: Smart Battery System
886 description: Schindler
888 description: Seagate Technology PLC
890 description: Shenzhen SEI Robotics Co., Ltd
892 description: Semtech Corporation
894 description: Sensirion AG
896 description: Sensortek Technology Corporation
898 description: Small Form Factor Committee
900 description: Solomon Goldentek Display Corporation
902 description: SG Micro Corp
904 description: SGX Sensortech
906 description: Sharp Corporation
908 description: Shimafuji Electric, Inc.
910 description: Si-En Technology Ltd.
912 description: Silicon Linux Corporation
914 description: SiFive, Inc.
916 description: Sigma Designs, Inc.
918 description: Seiko Instruments, Inc.
920 description: Silicon Image
922 description: Silicon Laboratories
924 description: Silead Inc.
926 description: Silergy Corp.
928 description: Silicon Mitus, Inc.
930 description: Cypress Semiconductor Corporation (Simtek Corporation)
932 description: Sinlinx Electronics Technology Co., LTD
934 description: SinoVoip Co., Ltd
936 description: Shenzhen Sipeed Technology Co., Ltd.
938 description: SiRF Technology, Inc.
940 description: Silicon Integrated Systems Corp.
942 description: Sitronix Technology Corporation
944 description: Skyworks Solutions, Inc.
946 description: Standard Microsystems Corporation
948 description: Synopsys, Inc.
950 description: Shenzhen SoChip Technology Co., Ltd.
952 description: Socionext Inc.
954 description: SolidRun
956 description: Solomon Systech Limited
958 description: Sony Corporation
960 description: Spansion Inc.
962 description: Spreadtrum Communications Inc.
964 description: Silicon Storage Technology, Inc.
966 description: STMicroelectronics
968 description: Starry Electronic Technology (ShenZhen) Co., LTD
972 description: ST-Ericsson
975 description: ST-Ericsson
977 description: ST-Ericsson
980 description: Summit microelectronics
982 description: Shenzhen Sunchip Technology Co., Ltd
984 description: Sun Microsystems, Inc
986 description: Sierra Wireless
988 description: Synaptics Inc.
990 description: Synology, Inc.
992 description: TBS Technologies
993 "^tbs-biometrics,.*":
994 description: Touchless Biometric Systems AG
996 description: Trusted Computing Group
998 description: Toby Churchill Ltd.
1000 description: TechNexion
1002 description: Technologic Systems
1004 description: Tempo Semiconductor
1006 description: Shenzhen Techstar Electronics Co., Ltd.
1008 description: Terasic Inc.
1010 description: Three Five Corp
1012 description: THine Electronics, Inc.
1014 description: Texas Instruments
1016 description: Tianma Micro-electronics Co., Ltd.
1018 description: Trusted Logic Mobility
1020 description: Tecon Microprocessor Technologies, LLC.
1024 description: TPO (deprecated, use tpo)
1027 description: Topwise Communication Co., Ltd.
1029 description: Toradex AG
1031 description: Toshiba Corporation
1035 description: TPK U.S.A. LLC
1037 description: TP-LINK Technologies Co., Ltd.
1041 description: TQ Systems GmbH
1045 description: Tronsmart
1047 description: Truly Semiconductors Limited
1049 description: Theobroma Systems Design und Consulting GmbH
1051 description: Tyan Computer Corporation
1055 description: uCRobotics
1057 description: Ubiquiti Networks
1061 description: Ugoos Industrial Co., Ltd.
1063 description: United Western Technologies Corp (UniWest)
1065 description: uPI Semiconductor Corp.
1067 description: United Radiant Technology Corporation
1069 description: Universal Scientific Industrial Co., Ltd.
1071 description: Aigo Digital Technology Co., Ltd.
1073 description: V3 Semiconductor
1075 description: Vamrs Ltd.
1077 description: Variscite Ltd.
1079 description: VIA Technologies, Inc.
1081 description: Videostrong Technology Co., Ltd.
1083 description: Virtual I/O Device Specification, developed by the OASIS consortium
1085 description: Vishay Intertechnology, Inc
1087 description: Vitesse Semiconductor Corporation
1089 description: Vivante Corporation
1091 description: VoCore Studio
1093 description: Voipac Technologies s.r.o.
1095 description: Vision Optical Technology Co., Ltd.
1097 description: VXT Ltd
1099 description: Waveshare Electronics
1101 description: Western Digital Corp.
1103 description: WeTek Electronics, limited.
1107 description: Shenzhen whwave Electronics, Inc.
1109 description: Wi2Wi, Inc.
1111 description: Winbond Electronics corp.
1113 description: Winstar Display Corp.
1115 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1117 description: Wolfson Microelectronics
1119 description: Wondermedia Technologies, Inc.
1123 description: X-Powers
1125 description: Extreme Engineering Solutions (X-ES)
1127 description: Xiaomi Technology Co., Ltd.
1129 description: Xillybus Ltd.
1131 description: Shenzhen Xinpeng Technology Co., Ltd
1135 description: Shenzhen Xunlong Software CO.,Limited
1139 description: YSH & ATIL
1140 "^yones-toptech,.*":
1141 description: Yones Toptech Co., Ltd.
1143 description: Y Soft Corporation a.s.
1145 description: Zarlink Semiconductor
1147 description: ZEITEC Semiconductor Co., LTD.
1149 description: Shenzhen Zidoo Technology Co., Ltd.
1151 description: Zodiac Inflight Innovations
1153 description: ZTE Corp.
1155 description: ZyXEL Communications Corp.
1157 # Normal property name match without a comma
1158 # These should catch all node/property names without a prefix
1159 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1160 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1163 additionalProperties: false