1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|simple-graph-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Abilis Systems
29 description: Abracon Corporation
31 description: Actions Semiconductor Co., Ltd.
33 description: Active-Semi International Inc
35 description: Avionic Design GmbH
37 description: Adafruit Industries, LLC
39 description: Adapteva, Inc.
41 description: Adaptrum, Inc.
43 description: AD Holdings Plc.
45 description: Analog Devices, Inc.
47 description: Advantech Corporation
48 "^aeroflexgaisler,.*":
49 description: Aeroflex Gaisler AB
51 description: Annapurna Labs
55 description: Allwinner Technology Co., Ltd.
57 description: AlphaScale Integrated Circuits Systems, Inc.
59 description: Altera Corp.
61 description: Amarula Solutions
63 description: Amazon.com, Inc.
65 description: Applied Micro Circuits Corporation (APM, formally AMCC)
67 description: Advanced Micro Devices (AMD), Inc.
69 description: Shenzhen Amediatech Technology Co., Ltd
71 description: Amlogic, Inc.
73 description: Ampire Co., Ltd.
77 description: AMS-Taos Inc.
79 description: Analogix Semiconductor, Inc.
81 description: Andes Technology Corporation
83 description: Applied Micro Circuits Corporation (APM)
85 description: Aptina Imaging
87 description: Arasan Chip Systems
89 description: ArcherMind Technology (Nanjing) Co., Ltd.
91 description: Arctic Sand
93 description: arcx Inc. / Archronix Inc.
95 description: Aries Embedded GmbH
99 description: ARMadeus Systems SARL
101 description: Arrow Electronics
103 description: Artesyn Embedded Technologies Inc.
105 description: Asahi Kasei Corp.
107 description: ASPEED Technology Inc.
109 description: AsusTek Computer Inc.
111 description: Atlas Scientific LLC
113 description: Atmel Corporation
115 description: AU Optronics Corporation
117 description: Auvidea GmbH
119 description: Avago Technologies
121 description: avia semiconductor
123 description: Shanghai AVIC Optoelectronics Co., Ltd.
125 description: Avnet, Inc.
127 description: Axentia Technologies AB
129 description: Axis Communications AB
131 description: Azoteq (Pty) Ltd
133 description: Shenzhen AZW Technology Co., Ltd.
135 description: BIPAI KEJI LIMITED
137 description: Beckhoff Automation GmbH & Co. KG
139 description: Bitmain Technologies
141 description: BOE Technology Group Co., Ltd.
143 description: Bosch Sensortec GmbH
145 description: Boundary Devices Inc.
147 description: Broadcom Corporation
149 description: Buffalo, Inc.
151 description: Bticino International
155 description: Capella Microsystems, Inc
157 description: Cascoda, Ltd.
159 description: Catalyst Semiconductor, Inc.
161 description: Cavium, Inc.
163 description: Cadence Design Systems Inc.
165 description: CDTech(H.K.) Electronics Limited
167 description: Ceva, Inc.
169 description: Chipidea, Inc
173 description: ChipSPARK
175 description: Common Hardware Reference Platform
177 description: Chunghwa Picture Tubes Ltd.
179 description: Computadora Industrial Abierta Argentina
181 description: Cirrus Logic, Inc.
183 description: Cloud Engines, Inc.
185 description: Chips&Media, Inc.
187 description: Conexant Systems, Inc.
189 description: CompuLab Ltd.
191 description: Cortina Systems, Inc.
193 description: Cosmic Circuits
195 description: Crane Connectivity Solutions
197 description: Creative Technology Ltd
199 description: Crystalfontz America, Inc.
201 description: Hangzhou C-SKY Microsystems Co., Ltd
203 description: Cubietech, Ltd.
205 description: Cypress Semiconductor Corporation
207 description: CZ.NIC, z.s.p.o.
209 description: Maxim Integrated Products (formerly Dallas Semiconductor)
211 description: DataImage, Inc.
213 description: DAVICOM Semiconductor, Inc.
215 description: Delta Electronics, Inc.
217 description: Denx Software Engineering
219 description: Devantech, Ltd.
221 description: DH electronics GmbH
223 description: Digi International Inc.
225 description: Diglent, Inc.
227 description: Dioo Microcircuit Co., Ltd
229 description: DLC Display Co., Ltd.
231 description: Dialog Semiconductor
233 description: D-Link Corporation
235 description: Data Modul AG
237 description: Domintech Co., Ltd.
239 description: Dongwoon Anatech
241 description: DPTechnics
243 description: Dragino Technology Co., Limited
245 description: Embedded Artists AB
247 description: EBS-SYSTART GmbH
249 description: EBV Elektronik
251 description: Eckelmann AG
253 description: Emerging Display Technologies
255 description: eGalax_eMPIA Technology Inc
257 description: Elan Microelectronic Corp.
259 description: Elgin S/A.
261 description: Shenzhen Embest Technology Co., Ltd.
263 description: Emlid, Ltd.
265 description: EM Microelectronic
267 description: emtrion GmbH
269 description: Endless Mobile, Inc.
271 description: Silicon Laboratories (formerly Energy Micro AS)
273 description: Engicam S.r.l.
275 description: EPCOS AG
277 description: Ecole Polytechnique Fédérale de Lausanne
279 description: Seiko Epson Corp.
281 description: ESTeem Wireless Modems
283 description: NI Ettus Research
285 description: Eukréa Electromatique
287 description: Everest Semiconductor Co. Ltd.
289 description: Everspin Technologies, Inc.
291 description: Exar Corporation
295 description: EZchip Semiconductor
297 description: Facebook
299 description: Fairphone B.V.
301 description: Faraday Technology Corporation
303 description: Fastrax Oy
305 description: Fairchild Semiconductor
307 description: Shenzhen Fly Young Technology Co.,LTD.
311 description: FocalTech Systems Co.,Ltd
313 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
315 description: Freescale Semiconductor
317 description: Fujitsu Ltd.
319 description: Gateworks Corporation
321 description: Game Consoles Worldwide
323 description: General Electric Company
325 description: GeekBuying
327 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
329 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
331 description: Geniatech, Inc.
333 description: Giantec Semiconductor, Inc.
335 description: Giantplus Technology Co., Ltd.
337 description: Globalscale Technologies, Inc.
339 description: GlobalTop Technology, Inc.
341 description: Global Mixed-mode Technology, Inc.
343 description: Shenzhen Huiding Technology Co., Ltd.
345 description: Google, Inc.
349 description: Garmin Limited
351 description: Gumstix, Inc.
353 description: Gateworks Corporation
355 description: HannStar Display Corporation
357 description: Haoyu Microelectronic Co. Ltd.
359 description: Hardkernel Co., Ltd
361 description: HiDeep Inc.
363 description: Himax Technologies, Inc.
365 description: Hisilicon Limited.
367 description: Hitachi Ltd.
369 description: Hitex Development Tools
371 description: Holt Integrated Circuits, Inc.
373 description: Honeywell
375 description: Hewlett Packard
377 description: Holtek Semiconductor, Inc.
379 description: HwaCom Systems Inc.
381 description: I2SE GmbH
383 description: International Business Machines (IBM)
385 description: IC Plus Corp.
387 description: Integrated Device Technologies, Inc.
389 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
391 description: ILI Technology Corporation (ILITEK)
393 description: Imagination Technologies Ltd.
395 description: Infineon Technologies
397 description: Inforce Computing
399 description: Ingenic Semiconductor
401 description: Innolux Corporation
403 description: INSIDE Secure
405 description: Intel Corporation
407 description: Inter Control Group
409 description: InvenSense Inc.
411 description: Inverse Path
413 description: Iomega Corporation
415 description: ISEE 2007 S.L.
417 description: Intersil
419 description: Integrated Silicon Solutions Inc.
421 description: ITEAD Intelligent Systems Co.Ltd
423 description: iWave Systems Technologies Pvt. Ltd.
425 description: Japan Display Inc.
427 description: JEDEC Solid State Technology Association
429 description: Jiandangjing Technology Co., Ltd.
431 description: Ka-Ro electronics GmbH
433 description: Keith & Koep GmbH
435 description: Keymile GmbH
439 description: Kieback & Peter GmbH
441 description: Kinetic Technologies
443 description: King & Display Technology Co., Ltd.
445 description: Kingnovel Technology Co., Ltd.
447 description: Kionix, Inc.
449 description: Rakuten Kobo Inc.
451 description: Kaohsiung Opto-Electronics Inc.
453 description: Sutajio Ko-Usagi PTE Ltd.
455 description: Kyocera Corporation
459 description: Laird PLC
461 description: Lantiq Semiconductor
463 description: Lattice Semiconductor
465 description: LEGO Systems A/S
467 description: Shenzhen LeMaker Technology Co., Ltd.
469 description: Lenovo Group Ltd.
471 description: LG Corporation
473 description: Shenzhen Libre Technology Co., Ltd
475 description: Lichee Pi
477 description: Linaro Limited
479 description: Belkin International, Inc. (Linksys)
481 description: Linux-specific binding
483 description: Linx Technologies
485 description: Linear Technology Corporation
487 description: Logic PD, Inc.
489 description: LSI Corp. (LSI Logic)
491 description: Liebherr-Werk Nenzing GmbH
493 description: Macnica Americas
495 description: Marvell Technology Group Ltd.
497 description: MaxBotix Inc.
499 description: Maxim Integrated Products
501 description: Mobiveil Inc.
505 description: Measurement Specialties
507 description: MediaTek Inc.
509 description: MegaChips
511 description: Shenzhen MeLE Digital Technology Ltd.
513 description: Melexis N.V.
515 description: MELFAS Inc.
517 description: Mellanox Technologies
519 description: MEMSIC Inc.
521 description: Menlo Systems GmbH
523 description: Merrii Technology Co., Ltd.
525 description: Micrel Inc.
527 description: Microchip Technology Inc.
529 description: Micro Crystal AG
531 description: Micron Technology Inc.
533 description: MikroElektronika d.o.o.
535 description: MINIX Technology Ltd.
537 description: MiraMEMS Sensing Technology Co., Ltd.
539 description: Mitsubishi Electric Corporation
541 description: Mosaix Technologies, Inc.
543 description: Motorola, Inc.
545 description: Moxa Inc.
549 description: mqmaker Inc.
551 description: Microsemi Corporation
553 description: Micro-Star International Co. Ltd.
555 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
557 description: Multi-Inno Technology Co.,Ltd
559 description: Mundo Reader S.L.
561 description: Murata Manufacturing Co., Ltd.
563 description: Macronix International Co., Ltd.
565 description: MYIR Tech Limited
567 description: National Semiconductor
569 description: NEC LCD Technologies, Ltd.
571 description: Neonode Inc.
575 description: Broadcom Corporation (formerly NetLogic Microsystems)
577 description: Netron DY
579 description: Shenzhen Netxeon Technology CO., LTD
583 description: Next Thing Co.
585 description: Newhaven Display International
587 description: National Instruments
589 description: Nintendo
591 description: NLT Technologies, Ltd.
595 description: Nordic Semiconductor
597 description: NovTech, Inc.
599 description: NutsBoard
601 description: Nuvoton Technology Corporation
603 description: New Vision Display
607 description: NXP Semiconductors
609 description: Oceanic Systems (UK) Ltd.
611 description: Okaya Electric America, Inc.
613 description: Oki Electric Industry Co., Ltd.
615 description: OLIMEX Ltd.
617 description: One Laptop Per Child
619 description: Onion Corporation
621 description: ON Semiconductor Corp.
623 description: On Tat Industrial Company
625 description: Opal Kelly Incorporated
627 description: OpenCores.org
629 description: OpenRISC.io
631 description: Option NV
633 description: Shenzhen Oranth Technology Co., Ltd.
635 description: Oracle Corporation
637 description: Orise Technology
639 description: Ortus Technology Co., Ltd.
641 description: OSD Displays
643 description: OmniVision Technologies
645 description: Oxford Semiconductor, Ltd.
647 description: Panasonic Corporation
649 description: Parade Technologies Inc.
651 description: Precision Design Associates, Inc.
653 description: Pericom Technology Inc.
655 description: Pervasive Displays, Inc.
657 description: PHICOMM Co., Ltd.
659 description: PHYTEC Messtechnik GmbH
661 description: Picochip Ltd
665 description: PIXCIR MICROELECTRONICS Co., Ltd
667 description: Plantower Co., Ltd
669 description: Plat'Home Co., Ltd.
673 description: Broadcom Corporation (formerly PLX Technology)
675 description: PNI Sensor Corporation
677 description: Portwell Inc.
679 description: Poslab Technology Co., Ltd.
681 description: PowerVR (deprecated, use img)
683 description: PROBOX2 (by W2COMP Co., Ltd.)
685 description: PulsedLight, Inc
687 description: Qualcomm Atheros, Inc.
689 description: Qualcomm Technologies, Inc
691 description: QEMU, a generic and open source machine emulator and virtualizer
693 description: Qi Hardware
695 description: QiaoDian XianShi Corporation
697 description: QNAP Systems, Inc.
701 description: RaidSonic Technology GmbH
703 description: Mediatek/Ralink Technology Corp.
705 description: Ramtron International
707 description: Raspberry Pi Foundation
709 description: Raydium Semiconductor Corp.
711 description: Unisoc Communications, Inc.
713 description: Realtek Semiconductor Corp.
715 description: Renesas Electronics Corporation
717 description: Richtek Technology Corporation
719 description: Ricoh Co. Ltd.
721 description: Rikomagic Tech Corp. Ltd
723 description: RISC-V Foundation
725 description: Fuzhou Rockchip Electronics Co., Ltd
727 description: ROCKTECH DISPLAYS LIMITED
729 description: ROHM Semiconductor Co., Ltd
731 description: Ronbo Electronics
733 description: Shenzhen Roofull Technology Co, Ltd
735 description: Samsung Semiconductor
737 description: Samtec/Softing company
739 description: Sancloud Ltd
741 description: Sandisk Corporation
743 description: Smart Battery System
745 description: Schindler
747 description: Seagate Technology PLC
749 description: Shenzhen SEI Robotics Co., Ltd
751 description: Semtech Corporation
753 description: Sensirion AG
755 description: Small Form Factor Committee
757 description: Solomon Goldentek Display Corporation
759 description: SGX Sensortech
761 description: Sharp Corporation
763 description: Shimafuji Electric, Inc.
765 description: Si-En Technology Ltd.
767 description: Silicon Linux Corporation
769 description: SiFive, Inc.
771 description: Sigma Designs, Inc.
773 description: Seiko Instruments, Inc.
775 description: Silicon Image
777 description: Silicon Laboratories
779 description: Silead Inc.
781 description: Silergy Corp.
783 description: Silicon Mitus, Inc.
787 description: SiRF Technology, Inc.
789 description: Silicon Integrated Systems Corp.
791 description: Sitronix Technology Corporation
793 description: Skyworks Solutions, Inc.
795 description: Standard Microsystems Corporation
797 description: Synopsys, Inc.
799 description: Socionext Inc.
801 description: SolidRun
803 description: Solomon Systech Limited
805 description: Sony Corporation
807 description: Spansion Inc.
809 description: Spreadtrum Communications Inc.
811 description: Silicon Storage Technology, Inc.
813 description: STMicroelectronics
815 description: Starry Electronic Technology (ShenZhen) Co., LTD
819 description: ST-Ericsson
821 description: ST-Ericsson
823 description: Summit microelectronics
825 description: Shenzhen Sunchip Technology Co., Ltd
827 description: Sun Microsystems, Inc
829 description: Sierra Wireless
831 description: Synaptics Inc.
833 description: Synology, Inc.
835 description: TBS Technologies
836 "^tbs-biometrics,.*":
837 description: Touchless Biometric Systems AG
839 description: Trusted Computing Group
841 description: Toby Churchill Ltd.
843 description: TechNexion
845 description: Technologic Systems
847 description: Tempo Semiconductor
849 description: Shenzhen Techstar Electronics Co., Ltd.
851 description: Terasic Inc.
853 description: THine Electronics, Inc.
855 description: Texas Instruments
857 description: Tianma Micro-electronics Co., Ltd.
859 description: Trusted Logic Mobility
861 description: Tecon Microprocessor Technologies, LLC.
865 description: Toradex AG
867 description: Toshiba Corporation
871 description: TPK U.S.A. LLC
873 description: TP-LINK Technologies Co., Ltd.
877 description: TQ Systems GmbH
881 description: Tronsmart
883 description: Truly Semiconductors Limited
885 description: Theobroma Systems Design und Consulting GmbH
887 description: Tyan Computer Corporation
891 description: uCRobotics
893 description: Ubiquiti Networks
897 description: United Western Technologies Corp (UniWest)
899 description: uPI Semiconductor Corp.
901 description: United Radiant Technology Corporation
903 description: Universal Scientific Industrial Co., Ltd.
905 description: V3 Semiconductor
907 description: Vamrs Ltd.
909 description: Variscite Ltd.
911 description: VIA Technologies, Inc.
913 description: Virtual I/O Device Specification, developed by the OASIS consortium
915 description: Vishay Intertechnology, Inc
917 description: Vitesse Semiconductor Corporation
919 description: Vivante Corporation
921 description: VoCore Studio
923 description: Voipac Technologies s.r.o.
925 description: Vision Optical Technology Co., Ltd.
927 description: Western Digital Corp.
929 description: WeTek Electronics, limited.
933 description: Shenzhen whwave Electronics, Inc.
935 description: Wi2Wi, Inc.
937 description: Winbond Electronics corp.
939 description: Winstar Display Corp.
941 description: Wolfson Microelectronics
943 description: Wondermedia Technologies, Inc.
945 description: X-Powers
947 description: Extreme Engineering Solutions (X-ES)
949 description: Xillybus Ltd.
953 description: Shenzhen Xunlong Software CO.,Limited
955 description: Y Soft Corporation a.s.
957 description: Zarlink Semiconductor
959 description: ZEITEC Semiconductor Co., LTD.
961 description: Shenzhen Zidoo Technology Co., Ltd.
963 description: Zodiac Inflight Innovations
965 description: ZTE Corp.
967 description: ZyXEL Communications Corp.
969 # Normal property name match without a comma
970 # These should catch all node/property names without a prefix
971 "^[a-zA-Z0-9#][a-zA-Z0-9+\\-._@]{0,63}$": true
972 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
975 additionalProperties: false