1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: 70mai Co., Ltd.
29 description: Abilis Systems
31 description: Abracon Corporation
33 description: Acer Inc.
35 description: Acme Systems srl
37 description: Actions Semiconductor Co., Ltd.
39 description: Active-Semi International Inc
41 description: Avionic Design GmbH
43 description: Adafruit Industries, LLC
45 description: Adapteva, Inc.
47 description: Adaptrum, Inc.
49 description: AD Holdings Plc.
51 description: Analog Devices, Inc.
53 description: Advantech Corporation
54 "^aeroflexgaisler,.*":
55 description: Aeroflex Gaisler AB
57 description: Annapurna Labs
59 description: Allegro DVT
63 description: Allwinner Technology Co., Ltd.
65 description: AlphaScale Integrated Circuits Systems, Inc.
67 description: Alps Electric Co., Ltd.
69 description: Altera Corp.
71 description: Amarula Solutions
73 description: Amazon.com, Inc.
75 description: Applied Micro Circuits Corporation (APM, formally AMCC)
77 description: Advanced Micro Devices (AMD), Inc.
79 description: Shenzhen Amediatech Technology Co., Ltd
81 description: Amlogic, Inc.
83 description: Ampire Co., Ltd.
87 description: AMS-Taos Inc.
89 description: Analogix Semiconductor, Inc.
91 description: Andes Technology Corporation
93 description: Anvo-Systems Dresden GmbH
95 description: Applied Micro Circuits Corporation (APM)
97 description: Aptina Imaging
99 description: Arasan Chip Systems
101 description: ArcherMind Technology (Nanjing) Co., Ltd.
103 description: Arctic Sand
105 description: arcx Inc. / Archronix Inc.
107 description: Aries Embedded GmbH
109 description: ARM Ltd.
111 description: ARMadeus Systems SARL
113 description: Arrow Electronics
115 description: Artesyn Embedded Technologies Inc.
117 description: Asahi Kasei Corp.
119 description: All Sensors Corporation
121 description: ASPEED Technology Inc.
123 description: AsusTek Computer Inc.
125 description: Atlas Scientific LLC
127 description: Atmel Corporation
129 description: AU Optronics Corporation
131 description: Auvidea GmbH
133 description: Avago Technologies
135 description: avia semiconductor
137 description: Shanghai AVIC Optoelectronics Co., Ltd.
139 description: Avnet, Inc.
141 description: Shanghai Awinic Technology Co., Ltd.
143 description: Axentia Technologies AB
145 description: Axis Communications AB
147 description: Azoteq (Pty) Ltd
149 description: Shenzhen AZW Technology Co., Ltd.
151 description: BAIKAL ELECTRONICS, JSC
153 description: BIPAI KEJI LIMITED
155 description: Compass Electronics Group, LLC
157 description: BeagleBoard.org Foundation
159 description: Beckhoff Automation GmbH & Co. KG
161 description: Bitmain Technologies
163 description: BOE Technology Group Co., Ltd.
165 description: Bosch Sensortec GmbH
167 description: Boundary Devices Inc.
169 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
171 description: Broadcom Corporation
173 description: Buffalo, Inc.
175 description: B&R Industrial Automation GmbH
177 description: Bticino International
179 description: CALAO Systems SAS
183 description: Capella Microsystems, Inc
185 description: Cascoda, Ltd.
187 description: Catalyst Semiconductor, Inc.
189 description: Cavium, Inc.
191 description: Cadence Design Systems Inc.
193 description: CDTech(H.K.) Electronics Limited
195 description: CellWise Microelectronics Co., Ltd
197 description: Ceva, Inc.
199 description: Check Point Software Technologies Ltd.
201 description: Chefree Technology Corp.
203 description: Chipidea, Inc
207 description: ChipSPARK
209 description: Chrontel, Inc.
211 description: Common Hardware Reference Platform
213 description: Chunghwa Picture Tubes Ltd.
215 description: Chuwi Innovation Ltd.
217 description: Computadora Industrial Abierta Argentina
219 description: Cirrus Logic, Inc.
221 description: Cloud Engines, Inc.
223 description: Chips&Media, Inc.
225 description: Conexant Systems, Inc.
227 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
229 description: CompuLab Ltd.
231 description: CORERIVER Semiconductor Co.,Ltd.
233 description: Chengdu Corpro Technology Co., Ltd.
235 description: Cortina Systems, Inc.
237 description: Cosmic Circuits
239 description: Crane Connectivity Solutions
241 description: Creative Technology Ltd
243 description: Crystalfontz America, Inc.
245 description: Hangzhou C-SKY Microsystems Co., Ltd
247 description: Shenzen Chuangsiqi Technology Co.,Ltd.
249 description: Cubietech, Ltd.
251 description: Cypress Semiconductor Corporation
253 description: CZ.NIC, z.s.p.o.
255 description: Maxim Integrated Products (formerly Dallas Semiconductor)
257 description: DataImage, Inc.
259 description: DAVICOM Semiconductor, Inc.
261 description: Dell Inc.
263 description: Delta Electronics, Inc.
265 description: Denx Software Engineering
267 description: Devantech, Ltd.
269 description: DFI Inc.
271 description: DH electronics GmbH
273 description: Shenzhen Yagu Electronic Technology Co., Ltd.
275 description: Digi International Inc.
277 description: Diglent, Inc.
279 description: Dioo Microcircuit Co., Ltd
281 description: DLC Display Co., Ltd.
283 description: Dialog Semiconductor
285 description: D-Link Corporation
287 description: Data Modul AG
289 description: Domintech Co., Ltd.
291 description: Dongwoon Anatech
293 description: DPTechnics
295 description: Dragino Technology Co., Limited
297 description: dServe Technology B.V.
299 description: Dyna-Image
301 description: Embedded Artists AB
303 description: EBS-SYSTART GmbH
305 description: EBV Elektronik
307 description: Eckelmann AG
309 description: Emerging Display Technologies
311 description: eGalax_eMPIA Technology Inc
313 description: Einfochips
315 description: Elan Microelectronic Corp.
317 description: Elgin S/A.
319 description: Shenzhen Elida Technology Co., Ltd.
321 description: Shenzhen Embest Technology Co., Ltd.
323 description: Emlid, Ltd.
325 description: EM Microelectronic
326 "^empire-electronix,.*":
327 description: Empire Electronix
329 description: emtrion GmbH
331 description: Endless Mobile, Inc.
333 description: ENE Technology, Inc.
335 description: Silicon Laboratories (formerly Energy Micro AS)
337 description: Engicam S.r.l.
339 description: EPCOS AG
341 description: Ecole Polytechnique Fédérale de Lausanne
343 description: Seiko Epson Corp.
345 description: Espressif Systems Co. Ltd.
347 description: ESTeem Wireless Modems
349 description: NI Ettus Research
351 description: Eukréa Electromatique
353 description: Everest Semiconductor Co. Ltd.
355 description: Everspin Technologies, Inc.
357 description: Evervision Electronics Co. Ltd.
359 description: Exar Corporation
363 description: EZchip Semiconductor
365 description: Facebook
367 description: Fairphone B.V.
369 description: Faraday Technology Corporation
371 description: Fastrax Oy
373 description: Fairchild Semiconductor
375 description: Shenzhen Feixin Photoelectic Co., Ltd
377 description: Shenzhen Fly Young Technology Co.,LTD.
381 description: FocalTech Systems Co.,Ltd
383 description: Shenzhen Frida LCD Co., Ltd.
385 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
387 description: Freescale Semiconductor
389 description: Fujitsu Ltd.
391 description: GARDENA GmbH
393 description: Gateworks Corporation
395 description: Game Consoles Worldwide
397 description: General Electric Company
399 description: GeekBuying
401 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
403 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
405 description: Gemei Digital Technology Co., Ltd.
407 description: Geniatech, Inc.
409 description: Giantec Semiconductor, Inc.
411 description: Giantplus Technology Co., Ltd.
413 description: Globalscale Technologies, Inc.
415 description: GlobalTop Technology, Inc.
417 description: Global Mixed-mode Technology, Inc.
419 description: Shenzhen Huiding Technology Co., Ltd.
421 description: Google, Inc.
425 description: Garmin Limited
427 description: Gumstix, Inc.
429 description: Gateworks Corporation
430 use "gateworks" vendor prefix
433 description: HannStar Display Corporation
435 description: Haoyu Microelectronic Co. Ltd.
437 description: Hardkernel Co., Ltd
439 description: HiDeep Inc.
441 description: Himax Technologies, Inc.
443 description: Hisilicon Limited.
445 description: Hitachi Ltd.
447 description: Hitex Development Tools
449 description: Holt Integrated Circuits, Inc.
451 description: Honeywell
453 description: Jiangsu HopeRun Software Co., Ltd.
455 description: Hewlett Packard
457 description: HannStar Display Co.
459 description: Holtek Semiconductor, Inc.
461 description: Shenzhen Hugsun Technology Co. Ltd.
463 description: HwaCom Systems Inc.
465 description: Hydis Technologies
467 description: Hyundai Technology
469 description: I2SE GmbH
471 description: International Business Machines (IBM)
473 description: IC Plus Corp.
475 description: Integrated Device Technologies, Inc.
477 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
479 description: ILI Technology Corporation (ILITEK)
481 description: Imagination Technologies Ltd.
483 description: Integrated Micro-Electronics Inc.
485 description: In-Circuit GmbH
487 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
489 description: Infineon Technologies
491 description: Inforce Computing
493 description: InfoVision Optoelectronics Kunshan Co. Ltd.
495 description: Ingenic Semiconductor
497 description: Innolux Corporation
499 description: INSIDE Secure
501 description: Inspur Corporation
503 description: Intel Corporation
505 description: Inter Control Group
507 description: InvenSense Inc.
509 description: Inverse Path
511 description: Iomega Corporation
513 description: ISEE 2007 S.L.
515 description: Intersil
517 description: Integrated Silicon Solutions Inc.
519 description: ITE Tech. Inc.
521 description: ITEAD Intelligent Systems Co.Ltd
523 description: iWave Systems Technologies Pvt. Ltd.
525 description: Japan Display Inc.
527 description: JEDEC Solid State Technology Association
529 description: Shenzhen Jesurun Electronics Business Dept.
531 description: Jiandangjing Technology Co., Ltd.
533 description: Kamstrup A/S
535 description: Ka-Ro electronics GmbH
537 description: Keith & Koep GmbH
539 description: Keymile GmbH
543 description: Kieback & Peter GmbH
545 description: Kinetic Technologies
547 description: King & Display Technology Co., Ltd.
549 description: Kingnovel Technology Co., Ltd.
551 description: Kionix, Inc.
553 description: Rakuten Kobo Inc.
555 description: Kaohsiung Opto-Electronics Inc.
557 description: Kontron S&T AG
559 description: Sutajio Ko-Usagi PTE Ltd.
561 description: Kyocera Corporation
565 description: Laird PLC
567 description: Ketai Huajie Technology Co., Ltd.
569 description: Lantiq Semiconductor
571 description: Lattice Semiconductor
573 description: Shenzhen Leadtek Technology Co., Ltd.
577 description: LEGO Systems A/S
579 description: Shenzhen LeMaker Technology Co., Ltd.
581 description: Lenovo Group Ltd.
583 description: LG Corporation
585 description: LG Display
587 description: Shenzhen Libre Technology Co., Ltd
589 description: Lichee Pi
591 description: Linaro Limited
593 description: LinkSprite Technologies, Inc.
595 description: Belkin International, Inc. (Linksys)
597 description: Linutronix GmbH
599 description: Linux-specific binding
601 description: Linx Technologies
603 description: Linear Technology Corporation
605 description: Logic PD, Inc.
607 description: Logic Technologies Limited
609 description: Longcheer Technology (Shanghai) Co., Ltd.
611 description: Lontium Semiconductor Corporation
613 description: Loongson Technology Corporation Limited
615 description: LSI Corp. (LSI Logic)
617 description: Liebherr-Werk Nenzing GmbH
619 description: Linux Automation GmbH
621 description: Macnica Americas
623 description: Mantix Display Technology Co.,Ltd.
625 description: Mapleboard.org
627 description: Marvell Technology Group Ltd.
629 description: MaxBotix Inc.
631 description: Maxim Integrated Products
633 description: Mobiveil Inc.
637 description: Measurement Specialties
639 description: Mustek Limited
641 description: MediaTek Inc.
643 description: MegaChips
645 description: Shenzhen MeLE Digital Technology Ltd.
647 description: Melexis N.V.
649 description: MELFAS Inc.
651 description: Mellanox Technologies
653 description: MEMSIC Inc.
655 description: Menlo Systems GmbH
657 description: Cisco Meraki, LLC
659 description: Merrii Technology Co., Ltd.
661 description: Micrel Inc.
663 description: Microchip Technology Inc.
665 description: Micro Crystal AG
667 description: Micron Technology Inc.
669 description: Microsoft Corporation
671 description: MikroElektronika d.o.o.
673 description: MikroTik
675 description: Miniand Tech
677 description: MINIX Technology Ltd.
679 description: MiraMEMS Sensing Technology Co., Ltd.
681 description: Mitsubishi Electric Corporation
683 description: Mosaix Technologies, Inc.
685 description: Motorola, Inc.
687 description: Moxa Inc.
691 description: Monolithic Power Systems Inc.
693 description: mqmaker Inc.
695 description: Marvell Technology Group Ltd.
698 description: Microsemi Corporation
700 description: Micro-Star International Co. Ltd.
702 description: MStar Semiconductor, Inc. (acquired by MediaTek Inc.)
704 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
706 description: Multi-Inno Technology Co.,Ltd
708 description: Mundo Reader S.L.
710 description: Murata Manufacturing Co., Ltd.
712 description: Macronix International Co., Ltd.
714 description: MYIR Tech Limited
716 description: National Semiconductor
718 description: NEC LCD Technologies, Ltd.
720 description: Neonode Inc.
724 description: Broadcom Corporation (formerly NetLogic Microsystems)
726 description: Netron DY
728 description: Shenzhen Netxeon Technology CO., LTD
730 description: Guangdong Neweast Optoelectronics CO., LTD
734 description: Next Thing Co.
736 description: Newhaven Display International
738 description: National Instruments
740 description: Nintendo
742 description: NLT Technologies, Ltd.
746 description: Nordic Semiconductor
748 description: NovTech, Inc.
750 description: NutsBoard
752 description: Nuvoton Technology Corporation
754 description: New Vision Display
758 description: NXP Semiconductors
760 description: Oceanic Systems (UK) Ltd.
762 description: Okaya Electric America, Inc.
764 description: Oki Electric Industry Co., Ltd.
766 description: OLIMEX Ltd.
768 description: One Laptop Per Child
770 description: Onion Corporation
772 description: ON Semiconductor Corp.
774 description: On Tat Industrial Company
776 description: Opal Kelly Incorporated
778 description: OpenCores.org
780 description: OpenRISC.io
782 description: Option NV
784 description: Shenzhen Oranth Technology Co., Ltd.
786 description: Oracle Corporation
788 description: Orise Technology
790 description: Ortus Technology Co., Ltd.
792 description: OSD Displays
794 description: Overkiz SAS
796 description: OmniVision Technologies
798 description: Oxford Semiconductor, Ltd.
800 description: OzzMaker
802 description: Panasonic Corporation
804 description: Parade Technologies Inc.
806 description: Parallax Inc.
808 description: Precision Design Associates, Inc.
810 description: Pericom Technology Inc.
812 description: Pervasive Displays, Inc.
814 description: PHICOMM Co., Ltd.
816 description: PHYTEC Messtechnik GmbH
818 description: Picochip Ltd
822 description: Shenzhen PineRiver Designs Co., Ltd.
824 description: PIXCIR MICROELECTRONICS Co., Ltd
826 description: Plantower Co., Ltd
828 description: Plat\'Home Co., Ltd.
832 description: Broadcom Corporation (formerly PLX Technology)
834 description: PNI Sensor Corporation
836 description: PocketBook International SA
838 description: Polaroid Corporation
840 description: Portwell Inc.
842 description: Poslab Technology Co., Ltd.
844 description: Point of View International B.V.
846 description: Powertip Tech. Corp.
848 description: PowerVR (deprecated, use img)
850 description: Primux Trading, S.L.
852 description: PROBOX2 (by W2COMP Co., Ltd.)
854 description: Protonic Holland
856 description: PulsedLight, Inc
858 description: Purism, SPC
860 description: Qualcomm Atheros, Inc.
862 description: Qualcomm Technologies, Inc
864 description: QEMU, a generic and open source machine emulator and virtualizer
866 description: Qi Hardware
868 description: Chengdu Kaixuan Information Technology Co., Ltd.
870 description: QiaoDian XianShi Corporation
872 description: QNAP Systems, Inc.
876 description: RaidSonic Technology GmbH
878 description: Mediatek/Ralink Technology Corp.
880 description: Ramtron International
882 description: Raspberry Pi Foundation
884 description: Raydium Semiconductor Corp.
886 description: Unisoc Communications, Inc.
888 description: Realtek Semiconductor Corp.
890 description: Renesas Electronics Corporation
892 description: iMX6 Rex Project
894 description: Shenzhen Rervision Technology Co., Ltd.
896 description: Richtek Technology Corporation
898 description: Ricoh Co. Ltd.
900 description: Rikomagic Tech Corp. Ltd
902 description: RISC-V Foundation
904 description: Embest RIoT
906 description: Fuzhou Rockchip Electronics Co., Ltd
908 description: ROCKTECH DISPLAYS LIMITED
910 description: ROHM Semiconductor Co., Ltd
912 description: Ronbo Electronics
914 description: Shenzhen Roofull Technology Co, Ltd
916 description: Samsung Semiconductor
918 description: Samtec/Softing company
920 description: Sancloud Ltd
922 description: Sandisk Corporation
924 description: Satoz International Co., Ltd
926 description: Smart Battery System
928 description: Schindler
930 description: Seagate Technology PLC
932 description: Shenzhen SEI Robotics Co., Ltd
934 description: Semtech Corporation
936 description: Sensirion AG
938 description: Sensortek Technology Corporation
940 description: Small Form Factor Committee
942 description: Solomon Goldentek Display Corporation
944 description: SG Micro Corp
946 description: SGX Sensortech
948 description: Sharp Corporation
950 description: Shimafuji Electric, Inc.
952 description: Shiratech Solutions
954 description: Si-En Technology Ltd.
956 description: Silicon Linux Corporation
958 description: SiFive, Inc.
960 description: Sigma Designs, Inc.
962 description: Seiko Instruments, Inc.
964 description: Silicon Image
966 description: Silicon Laboratories
968 description: Silead Inc.
970 description: Silergy Corp.
972 description: Silex Insight
974 description: Silicon Mitus, Inc.
976 description: Cypress Semiconductor Corporation (Simtek Corporation)
978 description: Sinlinx Electronics Technology Co., LTD
980 description: SinoVoip Co., Ltd
982 description: Shenzhen Sipeed Technology Co., Ltd.
984 description: SiRF Technology, Inc.
986 description: Silicon Integrated Systems Corp.
988 description: Sitronix Technology Corporation
990 description: Skyworks Solutions, Inc.
992 description: SmartLabs LLC
994 description: Standard Microsystems Corporation
996 description: Synopsys, Inc.
998 description: Shenzhen SoChip Technology Co., Ltd.
1000 description: Socionext Inc.
1002 description: SolidRun
1004 description: Solomon Systech Limited
1006 description: Sony Corporation
1008 description: Spansion Inc.
1010 description: Spreadtrum Communications Inc.
1012 description: Silicon Storage Technology, Inc.
1014 description: Xiamen Xingchen(SigmaStar) Technology Co., Ltd.
1015 (formerly part of MStar Semiconductor, Inc.)
1017 description: STMicroelectronics
1019 description: Starry Electronic Technology (ShenZhen) Co., LTD
1021 description: Startek
1023 description: ST-Ericsson
1026 description: ST-Ericsson
1028 description: ST-Ericsson
1031 description: Summit microelectronics
1033 description: Shenzhen Sunchip Technology Co., Ltd
1035 description: Sun Microsystems, Inc
1037 description: Sierra Wireless
1039 description: Synaptics Inc.
1041 description: Synology, Inc.
1043 description: TBS Technologies
1044 "^tbs-biometrics,.*":
1045 description: Touchless Biometric Systems AG
1047 description: Trusted Computing Group
1049 description: Toby Churchill Ltd.
1051 description: TechNexion
1053 description: Technologic Systems
1055 description: Tempo Semiconductor
1057 description: Shenzhen Techstar Electronics Co., Ltd.
1059 description: Terasic Inc.
1061 description: Three Five Corp
1063 description: THine Electronics, Inc.
1065 description: thingy.jp
1067 description: Texas Instruments
1069 description: Tianma Micro-electronics Co., Ltd.
1071 description: Trusted Logic Mobility
1073 description: Tecon Microprocessor Technologies, LLC.
1077 description: TPO (deprecated, use tpo)
1080 description: Topwise Communication Co., Ltd.
1082 description: Toradex AG
1084 description: Toshiba Corporation
1088 description: TPK U.S.A. LLC
1090 description: TP-LINK Technologies Co., Ltd.
1094 description: TQ Systems GmbH
1098 description: Tronsmart
1100 description: Truly Semiconductors Limited
1102 description: Visionox
1104 description: Theobroma Systems Design und Consulting GmbH
1106 description: Tyan Computer Corporation
1110 description: U-Boot bootloader
1112 description: uCRobotics
1114 description: Ubiquiti Networks
1118 description: Ugoos Industrial Co., Ltd.
1120 description: United Western Technologies Corp (UniWest)
1122 description: uPI Semiconductor Corp.
1124 description: United Radiant Technology Corporation
1126 description: Universal Scientific Industrial Co., Ltd.
1128 description: Aigo Digital Technology Co., Ltd.
1130 description: V3 Semiconductor
1132 description: Vaisala
1134 description: Vamrs Ltd.
1136 description: Variscite Ltd.
1138 description: VIA Technologies, Inc.
1140 description: Videostrong Technology Co., Ltd.
1142 description: Virtual I/O Device Specification, developed by the OASIS consortium
1144 description: Vishay Intertechnology, Inc
1146 description: Vitesse Semiconductor Corporation
1148 description: Vivante Corporation
1150 description: VoCore Studio
1152 description: Voipac Technologies s.r.o.
1154 description: Vision Optical Technology Co., Ltd.
1156 description: VXT Ltd
1158 description: Wandbord (Technexion)
1160 description: Waveshare Electronics
1162 description: Western Digital Corp.
1164 description: Würth Elektronik GmbH.
1166 description: WeTek Electronics, limited.
1170 description: Shenzhen whwave Electronics, Inc.
1172 description: Wi2Wi, Inc.
1174 description: Winbond Electronics corp.
1176 description: Winstar Display Corp.
1178 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1180 description: Wolfson Microelectronics
1182 description: Wondermedia Technologies, Inc.
1186 description: X-Powers
1188 description: Extreme Engineering Solutions (X-ES)
1190 description: Xiaomi Technology Co., Ltd.
1192 description: Xillybus Ltd.
1194 description: Shenzhen Xingbangda Display Technology Co., Ltd
1196 description: Shenzhen Xinpeng Technology Co., Ltd
1198 description: Xiphera Ltd.
1204 description: Shenzhen Xunlong Software CO.,Limited
1208 description: Shenzhen Yangliming Electronic Technology Co., Ltd.
1210 description: YSH & ATIL
1211 "^yones-toptech,.*":
1212 description: Yones Toptech Co., Ltd.
1214 description: Y Soft Corporation a.s.
1218 description: Zarlink Semiconductor
1220 description: ZEITEC Semiconductor Co., LTD.
1222 description: Shenzhen Zidoo Technology Co., Ltd.
1224 description: Zodiac Inflight Innovations
1226 description: Zinitix Co., Ltd
1228 description: ZTE Corp.
1230 description: ZyXEL Communications Corp.
1232 # Normal property name match without a comma
1233 # These should catch all node/property names without a prefix
1234 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1235 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1238 additionalProperties: false