1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: 70mai Co., Ltd.
31 description: Abilis Systems
33 description: Abracon Corporation
35 description: Acer Inc.
37 description: Acme Systems srl
39 description: Actions Semiconductor Co., Ltd.
41 description: Active-Semi International Inc
43 description: Avionic Design GmbH
45 description: Adafruit Industries, LLC
47 description: Adapteva, Inc.
49 description: Adaptrum, Inc.
51 description: AD Holdings Plc.
53 description: Analog Devices, Inc.
55 description: Advantech Corporation
56 "^aeroflexgaisler,.*":
57 description: Aeroflex Gaisler AB
59 description: Annapurna Labs
61 description: Allegro DVT
65 description: Allwinner Technology Co., Ltd.
67 description: AlphaScale Integrated Circuits Systems, Inc.
69 description: Alps Electric Co., Ltd.
71 description: Altus-Escon-Company BV
73 description: Altera Corp.
75 description: Amarula Solutions
77 description: Amazon.com, Inc.
79 description: Applied Micro Circuits Corporation (APM, formally AMCC)
81 description: Advanced Micro Devices (AMD), Inc.
83 description: Shenzhen Amediatech Technology Co., Ltd
85 description: Amlogic, Inc.
87 description: Ampire Co., Ltd.
91 description: AMS-Taos Inc.
93 description: Analogix Semiconductor, Inc.
95 description: Andes Technology Corporation
97 description: Anvo-Systems Dresden GmbH
99 description: Applied Micro Circuits Corporation (APM)
101 description: Aptina Imaging
103 description: Arasan Chip Systems
105 description: ArcherMind Technology (Nanjing) Co., Ltd.
107 description: Arctic Sand
109 description: arcx Inc. / Archronix Inc.
111 description: Aries Embedded GmbH
113 description: ARM Ltd.
115 description: ARMadeus Systems SARL
117 description: Arrow Electronics
119 description: Artesyn Embedded Technologies Inc.
121 description: Asahi Kasei Corp.
123 description: All Sensors Corporation
125 description: ASPEED Technology Inc.
127 description: AsusTek Computer Inc.
129 description: Atlas Scientific LLC
131 description: Atmel Corporation
133 description: AU Optronics Corporation
135 description: Auvidea GmbH
137 description: Avago Technologies
139 description: avia semiconductor
141 description: Shanghai AVIC Optoelectronics Co., Ltd.
143 description: Avnet, Inc.
145 description: Shanghai Awinic Technology Co., Ltd.
147 description: Axentia Technologies AB
149 description: Axis Communications AB
151 description: Azoteq (Pty) Ltd
153 description: Shenzhen AZW Technology Co., Ltd.
155 description: BAIKAL ELECTRONICS, JSC
157 description: BIPAI KEJI LIMITED
159 description: Compass Electronics Group, LLC
161 description: BeagleBoard.org Foundation
163 description: Beckhoff Automation GmbH & Co. KG
165 description: Bitmain Technologies
167 description: BOE Technology Group Co., Ltd.
169 description: Bosch Sensortec GmbH
171 description: Boundary Devices Inc.
173 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
175 description: Broadcom Corporation
177 description: Buffalo, Inc.
179 description: B&R Industrial Automation GmbH
181 description: Bticino International
183 description: CALAO Systems SAS
187 description: Caninos Loucos Program
189 description: Capella Microsystems, Inc
191 description: Cascoda, Ltd.
193 description: Catalyst Semiconductor, Inc.
195 description: Cavium, Inc.
197 description: Cadence Design Systems Inc.
199 description: CDTech(H.K.) Electronics Limited
201 description: CellWise Microelectronics Co., Ltd
203 description: Ceva, Inc.
205 description: Check Point Software Technologies Ltd.
207 description: Chefree Technology Corp.
209 description: Chipidea, Inc
213 description: ChipSPARK
215 description: Chrontel, Inc.
217 description: Common Hardware Reference Platform
219 description: Chunghwa Picture Tubes Ltd.
221 description: Chuwi Innovation Ltd.
223 description: Computadora Industrial Abierta Argentina
225 description: Cirrus Logic, Inc.
227 description: Cloud Engines, Inc.
229 description: Chips&Media, Inc.
231 description: Conexant Systems, Inc.
233 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
235 description: CompuLab Ltd.
237 description: CORERIVER Semiconductor Co.,Ltd.
239 description: Chengdu Corpro Technology Co., Ltd.
241 description: Cortina Systems, Inc.
243 description: Cosmic Circuits
245 description: Crane Connectivity Solutions
247 description: Creative Technology Ltd
249 description: Crystalfontz America, Inc.
251 description: Hangzhou C-SKY Microsystems Co., Ltd
253 description: Shenzen Chuangsiqi Technology Co.,Ltd.
255 description: Cubietech, Ltd.
257 description: Cypress Semiconductor Corporation
259 description: CZ.NIC, z.s.p.o.
261 description: Maxim Integrated Products (formerly Dallas Semiconductor)
263 description: DataImage, Inc.
265 description: DAVICOM Semiconductor, Inc.
267 description: Dell Inc.
269 description: Delta Electronics, Inc.
271 description: Denx Software Engineering
273 description: Devantech, Ltd.
275 description: DFI Inc.
277 description: DH electronics GmbH
279 description: Shenzhen Yagu Electronic Technology Co., Ltd.
281 description: Digi International Inc.
283 description: Diglent, Inc.
285 description: Dioo Microcircuit Co., Ltd
287 description: DLC Display Co., Ltd.
289 description: Dialog Semiconductor
291 description: D-Link Corporation
293 description: Data Modul AG
295 description: Domintech Co., Ltd.
297 description: Dongwoon Anatech
299 description: DPTechnics
301 description: Dragino Technology Co., Limited
303 description: dServe Technology B.V.
305 description: Dyna-Image
307 description: Embedded Artists AB
309 description: EBS-SYSTART GmbH
311 description: EBV Elektronik
313 description: Eckelmann AG
315 description: Emerging Display Technologies
317 description: eGalax_eMPIA Technology Inc
319 description: Einfochips
321 description: Elan Microelectronic Corp.
323 description: Element14 (A Premier Farnell Company)
325 description: Elgin S/A.
327 description: Shenzhen Elida Technology Co., Ltd.
329 description: Elimo Engineering Ltd.
331 description: Shenzhen Embest Technology Co., Ltd.
333 description: Emlid, Ltd.
335 description: EM Microelectronic
336 "^empire-electronix,.*":
337 description: Empire Electronix
339 description: emtrion GmbH
341 description: Endless Mobile, Inc.
343 description: ENE Technology, Inc.
345 description: Silicon Laboratories (formerly Energy Micro AS)
347 description: Engicam S.r.l.
349 description: EPCOS AG
351 description: Ecole Polytechnique Fédérale de Lausanne
353 description: Seiko Epson Corp.
355 description: Espressif Systems Co. Ltd.
357 description: ESTeem Wireless Modems
359 description: NI Ettus Research
361 description: Eukréa Electromatique
363 description: Everest Semiconductor Co. Ltd.
365 description: Everspin Technologies, Inc.
367 description: Evervision Electronics Co. Ltd.
369 description: Exar Corporation
373 description: EZchip Semiconductor
375 description: Facebook
377 description: Fairphone B.V.
379 description: Faraday Technology Corporation
381 description: Fastrax Oy
383 description: Fairchild Semiconductor
385 description: Shenzhen Feixin Photoelectic Co., Ltd
387 description: Shenzhen Fly Young Technology Co.,LTD.
389 description: Foxconn Industrial Internet
393 description: FocalTech Systems Co.,Ltd
395 description: Shenzhen Frida LCD Co., Ltd.
397 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
399 description: Freescale Semiconductor
401 description: Fujitsu Ltd.
403 description: GARDENA GmbH
405 description: Gateworks Corporation
407 description: Game Consoles Worldwide
409 description: General Electric Company
411 description: GeekBuying
413 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
415 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
417 description: Gemei Digital Technology Co., Ltd.
419 description: Geniatech, Inc.
421 description: Giantec Semiconductor, Inc.
423 description: Giantplus Technology Co., Ltd.
425 description: Globalscale Technologies, Inc.
427 description: GlobalTop Technology, Inc.
429 description: Global Mixed-mode Technology, Inc.
431 description: Shenzhen Huiding Technology Co., Ltd.
433 description: Google, Inc.
437 description: Garmin Limited
439 description: Gumstix, Inc.
441 description: Gateworks Corporation
442 use "gateworks" vendor prefix
445 description: HannStar Display Corporation
447 description: Haoyu Microelectronic Co. Ltd.
449 description: Hardkernel Co., Ltd
451 description: HiDeep Inc.
453 description: Himax Technologies, Inc.
455 description: Hisilicon Limited.
457 description: Hitachi Ltd.
459 description: Hitex Development Tools
461 description: Holt Integrated Circuits, Inc.
463 description: Honeywell
465 description: Honestar Technologies Co., Ltd.
467 description: Jiangsu HopeRun Software Co., Ltd.
469 description: Hewlett Packard
471 description: HannStar Display Co.
473 description: Holtek Semiconductor, Inc.
475 description: Shenzhen Hugsun Technology Co. Ltd.
477 description: HwaCom Systems Inc.
479 description: Hydis Technologies
481 description: Hyundai Technology
483 description: I2SE GmbH
485 description: International Business Machines (IBM)
487 description: IC Plus Corp.
489 description: Integrated Device Technologies, Inc.
491 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
493 description: ILI Technology Corporation (ILITEK)
495 description: Imagination Technologies Ltd.
497 description: Integrated Micro-Electronics Inc.
499 description: In-Circuit GmbH
501 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
503 description: Infineon Technologies
505 description: Inforce Computing
507 description: InfoVision Optoelectronics Kunshan Co. Ltd.
509 description: Ingenic Semiconductor
511 description: Innolux Corporation
513 description: INSIDE Secure
515 description: Inspur Corporation
517 description: Intel Corporation
519 description: Inter Control Group
521 description: InvenSense Inc.
523 description: Inverse Path
525 description: Iomega Corporation
527 description: ISEE 2007 S.L.
529 description: Intersil
531 description: Integrated Silicon Solutions Inc.
533 description: ITE Tech. Inc.
535 description: ITEAD Intelligent Systems Co.Ltd
537 description: iWave Systems Technologies Pvt. Ltd.
539 description: Japan Display Inc.
541 description: JEDEC Solid State Technology Association
543 description: Shenzhen Jesurun Electronics Business Dept.
545 description: Jiandangjing Technology Co., Ltd.
547 description: Kamstrup A/S
549 description: Ka-Ro electronics GmbH
551 description: Keith & Koep GmbH
553 description: Keymile GmbH
557 description: Kieback & Peter GmbH
559 description: Kinetic Technologies
561 description: King & Display Technology Co., Ltd.
563 description: Kingnovel Technology Co., Ltd.
565 description: Kionix, Inc.
567 description: Rakuten Kobo Inc.
569 description: Kobol Innovations Pte. Ltd.
571 description: Kaohsiung Opto-Electronics Inc.
573 description: Kontron S&T AG
575 description: Sutajio Ko-Usagi PTE Ltd.
577 description: Kyocera Corporation
581 description: Laird PLC
583 description: Ketai Huajie Technology Co., Ltd.
585 description: Lantiq Semiconductor
587 description: Lattice Semiconductor
589 description: Shenzhen Leadtek Technology Co., Ltd.
593 description: LEGO Systems A/S
595 description: Shenzhen LeMaker Technology Co., Ltd.
597 description: Lenovo Group Ltd.
599 description: LG Corporation
601 description: LG Display
603 description: Shenzhen Libre Technology Co., Ltd
605 description: Lichee Pi
607 description: Linaro Limited
609 description: LinkSprite Technologies, Inc.
611 description: Belkin International, Inc. (Linksys)
613 description: Linutronix GmbH
615 description: Linux-specific binding
617 description: Linx Technologies
619 description: Linear Technology Corporation
621 description: Logic PD, Inc.
623 description: Logic Technologies Limited
625 description: Longcheer Technology (Shanghai) Co., Ltd.
627 description: Lontium Semiconductor Corporation
629 description: Loongson Technology Corporation Limited
631 description: LSI Corp. (LSI Logic)
633 description: Liebherr-Werk Nenzing GmbH
635 description: Linux Automation GmbH
637 description: Macnica Americas
639 description: Mantix Display Technology Co.,Ltd.
641 description: Mapleboard.org
643 description: Marvell Technology Group Ltd.
645 description: MaxBotix Inc.
647 description: Maxim Integrated Products
649 description: Mobiveil Inc.
653 description: Measurement Specialties
655 description: Mustek Limited
657 description: MediaTek Inc.
659 description: MegaChips
661 description: Shenzhen MeLE Digital Technology Ltd.
663 description: Melexis N.V.
665 description: MELFAS Inc.
667 description: Mellanox Technologies
669 description: MEMSIC Inc.
671 description: Menlo Systems GmbH
673 description: Cisco Meraki, LLC
675 description: Merrii Technology Co., Ltd.
677 description: Micrel Inc.
679 description: Microchip Technology Inc.
681 description: Micro Crystal AG
683 description: Micron Technology Inc.
685 description: Microsoft Corporation
687 description: MicroSys Electronics GmbH
689 description: MikroElektronika d.o.o.
691 description: MikroTik
693 description: Miniand Tech
695 description: MINIX Technology Ltd.
697 description: MiraMEMS Sensing Technology Co., Ltd.
699 description: Mitsubishi Electric Corporation
701 description: Mosaix Technologies, Inc.
703 description: Motorola, Inc.
705 description: Moxa Inc.
709 description: Monolithic Power Systems Inc.
711 description: mqmaker Inc.
713 description: Marvell Technology Group Ltd.
716 description: Microsemi Corporation
718 description: Micro-Star International Co. Ltd.
720 description: MStar Semiconductor, Inc. (acquired by MediaTek Inc.)
722 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
724 description: Multi-Inno Technology Co.,Ltd
726 description: Mundo Reader S.L.
728 description: Murata Manufacturing Co., Ltd.
730 description: Macronix International Co., Ltd.
732 description: MYIR Tech Limited
734 description: National Semiconductor
736 description: NEC LCD Technologies, Ltd.
738 description: Neonode Inc.
742 description: Broadcom Corporation (formerly NetLogic Microsystems)
744 description: Netron DY
746 description: Shenzhen Netxeon Technology CO., LTD
748 description: Guangdong Neweast Optoelectronics CO., LTD
752 description: Next Thing Co.
754 description: Newhaven Display International
756 description: National Instruments
758 description: Nintendo
760 description: NLT Technologies, Ltd.
764 description: Nordic Semiconductor
766 description: NovTech, Inc.
768 description: NutsBoard
770 description: Nuvoton Technology Corporation
772 description: New Vision Display
776 description: NXP Semiconductors
778 description: Oceanic Systems (UK) Ltd.
780 description: Octavo Systems LLC
782 description: Okaya Electric America, Inc.
784 description: Oki Electric Industry Co., Ltd.
786 description: OLIMEX Ltd.
788 description: One Laptop Per Child
790 description: Onion Corporation
792 description: ON Semiconductor Corp.
794 description: On Tat Industrial Company
796 description: Opal Kelly Incorporated
798 description: OpenCores.org
800 description: OpenRISC.io
802 description: Option NV
804 description: Shenzhen Oranth Technology Co., Ltd.
806 description: Oracle Corporation
808 description: Orise Technology
810 description: Ortus Technology Co., Ltd.
812 description: OSD Displays
814 description: Ouya Inc.
816 description: Overkiz SAS
818 description: OmniVision Technologies
820 description: Oxford Semiconductor, Ltd.
822 description: OzzMaker
824 description: Panasonic Corporation
826 description: Parade Technologies Inc.
828 description: Parallax Inc.
830 description: Precision Design Associates, Inc.
832 description: Pericom Technology Inc.
834 description: Pervasive Displays, Inc.
836 description: PHICOMM Co., Ltd.
838 description: PHYTEC Messtechnik GmbH
840 description: Picochip Ltd
844 description: Shenzhen PineRiver Designs Co., Ltd.
846 description: PIXCIR MICROELECTRONICS Co., Ltd
848 description: Plantower Co., Ltd
850 description: Plat\'Home Co., Ltd.
854 description: Broadcom Corporation (formerly PLX Technology)
856 description: PNI Sensor Corporation
858 description: PocketBook International SA
860 description: Polaroid Corporation
862 description: Portwell Inc.
864 description: Poslab Technology Co., Ltd.
866 description: Point of View International B.V.
868 description: Powertip Tech. Corp.
870 description: PowerVR (deprecated, use img)
872 description: Primux Trading, S.L.
874 description: PROBOX2 (by W2COMP Co., Ltd.)
876 description: Protonic Holland
878 description: PulsedLight, Inc
880 description: Purism, SPC
882 description: Qualcomm Atheros, Inc.
884 description: Qualcomm Technologies, Inc
886 description: QEMU, a generic and open source machine emulator and virtualizer
888 description: Qi Hardware
890 description: Chengdu Kaixuan Information Technology Co., Ltd.
892 description: QiaoDian XianShi Corporation
894 description: QNAP Systems, Inc.
898 description: RaidSonic Technology GmbH
900 description: Mediatek/Ralink Technology Corp.
902 description: Ramtron International
904 description: Raspberry Pi Foundation
906 description: Raydium Semiconductor Corp.
908 description: Unisoc Communications, Inc.
910 description: Realtek Semiconductor Corp.
912 description: Renesas Electronics Corporation
914 description: iMX6 Rex Project
916 description: Shenzhen Rervision Technology Co., Ltd.
918 description: Revolution Robotics, Inc. (Revotics)
920 description: Richtek Technology Corporation
922 description: Ricoh Co. Ltd.
924 description: Rikomagic Tech Corp. Ltd
926 description: RISC-V Foundation
928 description: Embest RIoT
930 description: Fuzhou Rockchip Electronics Co., Ltd
932 description: ROCKTECH DISPLAYS LIMITED
934 description: ROHM Semiconductor Co., Ltd
936 description: Ronbo Electronics
938 description: Shenzhen Roofull Technology Co, Ltd
940 description: RoseapplePi.org
942 description: Samsung Semiconductor
944 description: Samtec/Softing company
946 description: Sancloud Ltd
948 description: Sandisk Corporation
950 description: Satoz International Co., Ltd
952 description: Smart Battery System
954 description: Schindler
956 description: Seagate Technology PLC
958 description: Seeed Technology Co., Ltd
960 description: Shenzhen SEI Robotics Co., Ltd
962 description: Semtech Corporation
964 description: Sensirion AG
966 description: Sensortek Technology Corporation
968 description: Small Form Factor Committee
970 description: Solomon Goldentek Display Corporation
972 description: SG Micro Corp
974 description: SGX Sensortech
976 description: Sharp Corporation
978 description: Shimafuji Electric, Inc.
980 description: Shiratech Solutions
982 description: Si-En Technology Ltd.
984 description: Silicon Linux Corporation
986 description: SiFive, Inc.
988 description: Sigma Designs, Inc.
990 description: Seiko Instruments, Inc.
992 description: Silicon Image
994 description: Silicon Laboratories
996 description: Silead Inc.
998 description: Silergy Corp.
1000 description: Silex Insight
1002 description: Silicon Mitus, Inc.
1004 description: Cypress Semiconductor Corporation (Simtek Corporation)
1006 description: Sinlinx Electronics Technology Co., LTD
1008 description: SinoVoip Co., Ltd
1010 description: Shenzhen Sipeed Technology Co., Ltd.
1012 description: SiRF Technology, Inc.
1014 description: Silicon Integrated Systems Corp.
1016 description: Sitronix Technology Corporation
1018 description: Skyworks Solutions, Inc.
1020 description: SmartLabs LLC
1022 description: Standard Microsystems Corporation
1024 description: Synopsys, Inc.
1026 description: Shenzhen SoChip Technology Co., Ltd.
1028 description: Socionext Inc.
1030 description: SolidRun
1032 description: Solomon Systech Limited
1034 description: Sony Corporation
1036 description: Spansion Inc.
1038 description: Spreadtrum Communications Inc.
1040 description: Silicon Storage Technology, Inc.
1042 description: Xiamen Xingchen(SigmaStar) Technology Co., Ltd.
1043 (formerly part of MStar Semiconductor, Inc.)
1045 description: STMicroelectronics
1047 description: Starry Electronic Technology (ShenZhen) Co., LTD
1049 description: Startek
1051 description: ST-Ericsson
1054 description: ST-Ericsson
1056 description: ST-Ericsson
1059 description: Summit microelectronics
1061 description: Shenzhen Sunchip Technology Co., Ltd
1063 description: Sun Microsystems, Inc
1065 description: Sierra Wireless
1067 description: Synaptics Inc.
1069 description: Synology, Inc.
1071 description: TBS Technologies
1072 "^tbs-biometrics,.*":
1073 description: Touchless Biometric Systems AG
1075 description: Trusted Computing Group
1077 description: Toby Churchill Ltd.
1079 description: TechNexion
1081 description: Technologic Systems
1083 description: Tempo Semiconductor
1085 description: Shenzhen Techstar Electronics Co., Ltd.
1087 description: Terasic Inc.
1089 description: Three Five Corp
1091 description: THine Electronics, Inc.
1093 description: thingy.jp
1095 description: Texas Instruments
1097 description: Tianma Micro-electronics Co., Ltd.
1099 description: Trusted Logic Mobility
1101 description: Tecon Microprocessor Technologies, LLC.
1105 description: TPO (deprecated, use tpo)
1108 description: Topwise Communication Co., Ltd.
1110 description: Toradex AG
1112 description: Toshiba Corporation
1116 description: TPK U.S.A. LLC
1118 description: TP-LINK Technologies Co., Ltd.
1122 description: TQ Systems GmbH
1126 description: Tronsmart
1128 description: Truly Semiconductors Limited
1130 description: Visionox
1132 description: Theobroma Systems Design und Consulting GmbH
1134 description: Tyan Computer Corporation
1138 description: U-Boot bootloader
1140 description: uCRobotics
1142 description: Ubiquiti Networks
1146 description: Ugoos Industrial Co., Ltd.
1148 description: United Western Technologies Corp (UniWest)
1150 description: uPI Semiconductor Corp.
1152 description: United Radiant Technology Corporation
1154 description: Universal Scientific Industrial Co., Ltd.
1156 description: Aigo Digital Technology Co., Ltd.
1158 description: V3 Semiconductor
1160 description: Vaisala
1162 description: Vamrs Ltd.
1164 description: Variscite Ltd.
1166 description: Van der Laan b.v.
1168 description: VIA Technologies, Inc.
1170 description: Videostrong Technology Co., Ltd.
1172 description: Virtual I/O Device Specification, developed by the OASIS consortium
1174 description: Used for virtual device without specific vendor.
1176 description: Vishay Intertechnology, Inc
1178 description: Vitesse Semiconductor Corporation
1180 description: Vivante Corporation
1182 description: VoCore Studio
1184 description: Voipac Technologies s.r.o.
1186 description: Vision Optical Technology Co., Ltd.
1188 description: VXT Ltd
1190 description: Wandbord (Technexion)
1192 description: Waveshare Electronics
1194 description: Western Digital Corp.
1196 description: Würth Elektronik GmbH.
1198 description: WeTek Electronics, limited.
1202 description: Shenzhen whwave Electronics, Inc.
1204 description: Wi2Wi, Inc.
1206 description: Winbond Electronics corp.
1208 description: Winstar Display Corp.
1210 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1212 description: Wolfson Microelectronics
1214 description: Wondermedia Technologies, Inc.
1218 description: X-Powers
1220 description: Extreme Engineering Solutions (X-ES)
1222 description: Xiaomi Technology Co., Ltd.
1224 description: Xillybus Ltd.
1226 description: Shenzhen Xingbangda Display Technology Co., Ltd
1228 description: Shenzhen Xinpeng Technology Co., Ltd
1230 description: Xiphera Ltd.
1236 description: Shenzhen Xunlong Software CO.,Limited
1240 description: Shenzhen Yangliming Electronic Technology Co., Ltd.
1242 description: YSH & ATIL
1243 "^yones-toptech,.*":
1244 description: Yones Toptech Co., Ltd.
1246 description: Y Soft Corporation a.s.
1250 description: Zarlink Semiconductor
1252 description: ZEITEC Semiconductor Co., LTD.
1254 description: Shenzhen Zidoo Technology Co., Ltd.
1256 description: Zodiac Inflight Innovations
1258 description: Zinitix Co., Ltd
1260 description: Shenzhen Zkmagic Technology Co., Ltd.
1262 description: ZTE Corp.
1264 description: ZyXEL Communications Corp.
1266 # Normal property name match without a comma
1267 # These should catch all node/property names without a prefix
1268 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1269 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1272 additionalProperties: false