1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|bm|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio-key|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Baiwen.com (100ask).
29 description: 70mai Co., Ltd.
31 description: 8devices, UAB
35 description: Abilis Systems
37 description: Abracon Corporation
39 description: ShenZhen Asia Better Technology Ltd.
41 description: Acer Inc.
43 description: Acme Systems srl
45 description: Actions Semiconductor Co., Ltd.
47 description: Active-Semi International Inc
49 description: Avionic Design GmbH
51 description: Adafruit Industries, LLC
53 description: Adapteva, Inc.
55 description: Adaptrum, Inc.
57 description: AD Holdings Plc.
59 description: Analog Devices, Inc.
61 description: Advantech Corporation
62 "^aeroflexgaisler,.*":
63 description: Aeroflex Gaisler AB
65 description: AESOP Embedded Forum
69 description: Annapurna Labs
73 description: Allegro DVT
77 description: Allwinner Technology Co., Ltd.
79 description: AlphaScale Integrated Circuits Systems, Inc.
81 description: Alps Electric Co., Ltd.
83 description: Altus-Escon-Company BV
85 description: Altera Corp.
87 description: Amarula Solutions
89 description: Amazon.com, Inc.
91 description: Applied Micro Circuits Corporation (APM, formally AMCC)
93 description: Advanced Micro Devices (AMD), Inc.
95 description: Shenzhen Amediatech Technology Co., Ltd
97 description: Amlogic, Inc.
99 description: Ampere Computing LLC
101 description: Ampire Co., Ltd.
105 description: AMS-Taos Inc.
107 description: Analogix Semiconductor, Inc.
109 description: Andes Technology Corporation
111 description: Anvo-Systems Dresden GmbH
113 description: Applied Micro Circuits Corporation (APM)
115 description: Apple Inc.
117 description: Aptina Imaging
119 description: Arasan Chip Systems
121 description: ArcherMind Technology (Nanjing) Co., Ltd.
123 description: Arctic Sand
125 description: arcx Inc. / Archronix Inc.
127 description: Aries Embedded GmbH
129 description: ARM Ltd.
131 description: ARMadeus Systems SARL
133 description: Arrow Electronics
135 description: Artesyn Embedded Technologies Inc.
137 description: Asahi Kasei Corp.
139 description: All Sensors Corporation
141 description: ASIX Electronics Corporation
143 description: ASPEED Technology Inc.
145 description: AsusTek Computer Inc.
147 description: Atlas Scientific LLC
149 description: Atmel Corporation
151 description: AU Optronics Corporation
153 description: Auvidea GmbH
155 description: Avago Technologies
157 description: avia semiconductor
159 description: Shanghai AVIC Optoelectronics Co., Ltd.
161 description: Avnet, Inc.
163 description: Shanghai Awinic Technology Co., Ltd.
165 description: Axentia Technologies AB
167 description: Axis Communications AB
169 description: Azoteq (Pty) Ltd
171 description: Shenzhen AZW Technology Co., Ltd.
173 description: BAIKAL ELECTRONICS, JSC
175 description: BIPAI KEJI LIMITED
177 description: Compass Electronics Group, LLC
179 description: BeagleBoard.org Foundation
181 description: Beckhoff Automation GmbH & Co. KG
183 description: Bitmain Technologies
185 description: BluTek Power
187 description: BOE Technology Group Co., Ltd.
189 description: Bosch Sensortec GmbH
191 description: Boundary Devices Inc.
193 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
195 description: Broadcom Corporation
197 description: BSH Hausgeraete GmbH
199 description: Buffalo, Inc.
201 description: B&R Industrial Automation GmbH
203 description: Bticino International
205 description: CalAmp Corp.
207 description: CALAO Systems SAS
211 description: Canaan, Inc.
213 description: Caninos Loucos Program
215 description: Capella Microsystems, Inc
217 description: Cascoda, Ltd.
219 description: Catalyst Semiconductor, Inc.
221 description: Cavium, Inc.
223 description: Cadence Design Systems Inc.
225 description: CDTech(H.K.) Electronics Limited
227 description: CellWise Microelectronics Co., Ltd
229 description: Ceva, Inc.
231 description: Check Point Software Technologies Ltd.
233 description: Chefree Technology Corp.
235 description: Chipidea, Inc
239 description: ChipSPARK
241 description: Chrontel, Inc.
243 description: Common Hardware Reference Platform
245 description: Chunghwa Picture Tubes Ltd.
247 description: Chuwi Innovation Ltd.
249 description: Computadora Industrial Abierta Argentina
251 description: Cirrus Logic, Inc.
253 description: Cisco Systems, Inc.
255 description: Cloud Engines, Inc.
257 description: Chips&Media, Inc.
259 description: Conexant Systems, Inc.
261 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
263 description: CompuLab Ltd.
265 description: congatec GmbH
267 description: CORERIVER Semiconductor Co.,Ltd.
269 description: Chengdu Corpro Technology Co., Ltd.
271 description: Cortina Systems, Inc.
273 description: Cosmic Circuits
275 description: Crane Connectivity Solutions
277 description: Creative Technology Ltd
279 description: Crystalfontz America, Inc.
281 description: Hangzhou C-SKY Microsystems Co., Ltd
283 description: Shenzen Chuangsiqi Technology Co.,Ltd.
285 description: CTERA Networks Intl.
287 description: Cubietech, Ltd.
289 description: CUI Devices
291 description: Cypress Semiconductor Corporation
293 description: Shenzhen CYX Industrial Co., Ltd
295 description: CZ.NIC, z.s.p.o.
297 description: Maxim Integrated Products (formerly Dallas Semiconductor)
299 description: DataImage, Inc.
301 description: DAVICOM Semiconductor, Inc.
303 description: Dell Inc.
305 description: Delta Electronics, Inc.
307 description: Denx Software Engineering
309 description: Devantech, Ltd.
311 description: DFI Inc.
313 description: DH electronics GmbH
315 description: Shenzhen Yagu Electronic Technology Co., Ltd.
317 description: Digi International Inc.
319 description: Diglent, Inc.
321 description: Dioo Microcircuit Co., Ltd
323 description: DLC Display Co., Ltd.
325 description: Dialog Semiconductor
327 description: D-Link Corporation
329 description: Data Modul AG
331 description: Domintech Co., Ltd.
333 description: Dongwoon Anatech
335 description: DPTechnics
337 description: Dragino Technology Co., Limited
339 description: DaSheng, Inc.
341 description: dServe Technology B.V.
343 description: Dyna-Image
345 description: Embedded Artists AB
347 description: Zhejiang Ebang Communication Co., Ltd
349 description: EBS-SYSTART GmbH
351 description: EBV Elektronik
353 description: Eckelmann AG
355 description: EDIMAX Technology Co., Ltd
357 description: Emerging Display Technologies
359 description: eGalax_eMPIA Technology Inc
361 description: Einfochips
363 description: E Ink Corporation
365 description: Elan Microelectronic Corp.
367 description: Element14 (A Premier Farnell Company)
369 description: Elgin S/A.
371 description: Shenzhen Elida Technology Co., Ltd.
373 description: Elimo Engineering Ltd.
375 description: Elpida Memory, Inc.
377 description: Shenzhen Embest Technology Co., Ltd.
379 description: Emlid, Ltd.
381 description: EM Microelectronic
382 "^empire-electronix,.*":
383 description: Empire Electronix
385 description: emtrion GmbH
387 description: Endless Mobile, Inc.
389 description: ENE Technology, Inc.
391 description: Silicon Laboratories (formerly Energy Micro AS)
393 description: Engicam S.r.l.
395 description: Engleder
397 description: EPCOS AG
399 description: Ecole Polytechnique Fédérale de Lausanne
401 description: Seiko Epson Corp.
403 description: Espressif Systems Co. Ltd.
405 description: ESTeem Wireless Modems
407 description: NI Ettus Research
409 description: Eukréa Electromatique
411 description: Everest Semiconductor Co. Ltd.
413 description: Everspin Technologies, Inc.
415 description: Evervision Electronics Co. Ltd.
417 description: Exar Corporation
421 description: Exegin Technologies Limited
423 description: EZchip Semiconductor
425 description: Facebook
427 description: Fairphone B.V.
429 description: Faraday Technology Corporation
431 description: Fastrax Oy
433 description: Fairchild Semiconductor
435 description: Shenzhen Feixin Photoelectic Co., Ltd
437 description: Shenzhen Fly Young Technology Co.,LTD.
439 description: Foxconn Industrial Internet
443 description: FocalTech Systems Co.,Ltd
445 description: Baoding Forlinx Embedded Technology Co., Ltd.
447 description: Shenzhen Frida LCD Co., Ltd.
449 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
451 description: Freescale Semiconductor
453 description: Fujitsu Ltd.
455 description: FX Technology Ltd.
457 description: GARDENA GmbH
459 description: Gateworks Corporation
461 description: Game Consoles Worldwide
463 description: General Electric Company
465 description: GeekBuying
467 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
469 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
471 description: Gemei Digital Technology Co., Ltd.
473 description: Geniatech, Inc.
475 description: Giantec Semiconductor, Inc.
477 description: Giantplus Technology Co., Ltd.
479 description: Globalscale Technologies, Inc.
481 description: GlobalTop Technology, Inc.
483 description: Global Mixed-mode Technology, Inc.
485 description: Shenzhen Huiding Technology Co., Ltd.
487 description: Google, Inc.
491 description: Garmin Limited
493 description: Gumstix, Inc.
495 description: Gateworks Corporation
496 use "gateworks" vendor prefix
499 description: HannStar Display Corporation
501 description: Shenzhen Haochuangyi Technology Co.,Ltd
503 description: Haoyu Microelectronic Co. Ltd.
505 description: Hardkernel Co., Ltd
507 description: HiDeep Inc.
509 description: Himax Technologies, Inc.
511 description: Hirschmann Automation and Control GmbH
513 description: HiSilicon Limited (deprecated, use hisilicon)
516 description: HiSilicon Limited.
518 description: Hitachi Ltd.
520 description: Hitex Development Tools
522 description: Holt Integrated Circuits, Inc.
524 description: Honestar Technologies Co., Ltd.
526 description: Honeywell
528 description: Jiangsu HopeRun Software Co., Ltd.
530 description: Hewlett Packard Inc.
532 description: Hewlett Packard Enterprise
534 description: HannStar Display Co.
536 description: Holtek Semiconductor, Inc.
538 description: Huawei Technologies Co., Ltd.
540 description: Shenzhen Hugsun Technology Co. Ltd.
542 description: HwaCom Systems Inc.
544 description: Hycon Technology Corp.
546 description: Hydis Technologies
548 description: SK Hynix Inc.
550 description: Hyundai Technology
552 description: I2SE GmbH
554 description: International Business Machines (IBM)
556 description: IC Plus Corp.
558 description: Integrated Device Technologies, Inc.
560 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
562 description: ILI Technology Corporation (ILITEK)
564 description: Imagis Technologies Co., Ltd.
566 description: Imagination Technologies Ltd.
568 description: Integrated Micro-Electronics Inc.
570 description: In-Circuit GmbH
572 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
574 description: Infineon Technologies
576 description: Inforce Computing
578 description: InfoVision Optoelectronics Kunshan Co. Ltd.
580 description: Ingenic Semiconductor
582 description: Injoinic Technology Corp.
584 description: Innolux Corporation
586 description: INSIDE Secure
588 description: Insignal Ltd.
590 description: Inspur Corporation
592 description: Intel Corporation
594 description: Inter Control Group
596 description: InvenSense Inc.
598 description: Inverse Path
600 description: Iomega Corporation
602 description: ISEE 2007 S.L.
604 description: Intersil
606 description: Integrated Silicon Solutions Inc.
608 description: ITE Tech. Inc.
610 description: ITEAD Intelligent Systems Co.Ltd
612 description: ITian Corporation
614 description: iWave Systems Technologies Pvt. Ltd.
616 description: Japan Display Inc.
618 description: JEDEC Solid State Technology Association
620 description: Shenzhen Jesurun Electronics Business Dept.
622 description: JetHome (IP Sokolov P.A.)
624 description: Jiandangjing Technology Co., Ltd.
628 description: Kamstrup A/S
630 description: Ka-Ro electronics GmbH
632 description: Keith & Koep GmbH
634 description: Keymile GmbH
638 description: Kieback & Peter GmbH
640 description: Kinetic Technologies
642 description: King & Display Technology Co., Ltd.
644 description: Kingnovel Technology Co., Ltd.
646 description: Kionix, Inc.
648 description: Rakuten Kobo Inc.
650 description: Kobol Innovations Pte. Ltd.
652 description: Kaohsiung Opto-Electronics Inc.
654 description: Kontron S&T AG
656 description: Sutajio Ko-Usagi PTE Ltd.
658 description: Kverneland Group
660 description: Kyocera Corporation
664 description: Laird PLC
666 description: Ketai Huajie Technology Co., Ltd.
668 description: Lantiq Semiconductor
670 description: Lattice Semiconductor
672 description: Shenzhen Leadtek Technology Co., Ltd.
676 description: LEGO Systems A/S
678 description: Shenzhen LeMaker Technology Co., Ltd.
680 description: Lenovo Group Ltd.
682 description: LG Corporation
684 description: LG Display
686 description: Shenzhen Libre Technology Co., Ltd
688 description: Lichee Pi
690 description: Linaro Limited
692 description: LinkSprite Technologies, Inc.
694 description: Belkin International, Inc. (Linksys)
696 description: Linutronix GmbH
698 description: Linux-specific binding
700 description: Linx Technologies
702 description: LITE-ON Technology Corp.
704 description: LiteX SoC builder
706 description: Linear Technology Corporation
708 description: Logic PD, Inc.
710 description: Logic Technologies Limited
712 description: Longcheer Technology (Shanghai) Co., Ltd.
714 description: Lontium Semiconductor Corporation
716 description: Loongson Technology Corporation Limited
718 description: LSI Corp. (LSI Logic)
720 description: Liebherr-Werk Nenzing GmbH
722 description: Linux Automation GmbH
726 description: Macnica Americas
728 description: Mantix Display Technology Co.,Ltd.
730 description: Mapleboard.org
732 description: Marvell Technology Group Ltd.
734 description: MaxBotix Inc.
736 description: Maxim Integrated Products
738 description: Mobiveil Inc.
742 description: Measurement Specialties
744 description: Mustek Limited
746 description: MediaTek Inc.
748 description: MegaChips
750 description: Shenzhen MeLE Digital Technology Ltd.
752 description: Melexis N.V.
754 description: MELFAS Inc.
756 description: Mellanox Technologies
758 description: MEMSIC Inc.
760 description: Menlo Systems GmbH
762 description: Mentor Graphics
764 description: Cisco Meraki, LLC
766 description: Merrii Technology Co., Ltd.
768 description: Micrel Inc.
770 description: Microchip Technology Inc.
772 description: Micro Crystal AG
774 description: Micron Technology Inc.
776 description: Microsoft Corporation
778 description: MicroSys Electronics GmbH
780 description: MikroElektronika d.o.o.
782 description: MikroTik
784 description: Miniand Tech
786 description: MINIX Technology Ltd.
788 description: MiraMEMS Sensing Technology Co., Ltd.
790 description: Mitsubishi Electric Corporation
794 description: MNT Research GmbH
796 description: Modtronix Engineering
798 description: Mosaix Technologies, Inc.
800 description: Motorola, Inc.
802 description: Moxa Inc.
806 description: Monolithic Power Systems Inc.
808 description: mqmaker Inc.
810 description: Marvell Technology Group Ltd.
813 description: Microsemi Corporation
815 description: Micro-Star International Co. Ltd.
817 description: MStar Semiconductor, Inc. (acquired by MediaTek Inc.)
819 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
821 description: Multi-Inno Technology Co.,Ltd
823 description: Mundo Reader S.L.
825 description: Murata Manufacturing Co., Ltd.
827 description: Macronix International Co., Ltd.
830 description: Macronix International Co., Ltd.
832 description: MYIR Tech Limited
834 description: National Semiconductor
836 description: NEC LCD Technologies, Ltd.
838 description: Neonode Inc.
842 description: Broadcom Corporation (formerly NetLogic Microsystems)
844 description: Netron DY
846 description: Netronix, Inc.
848 description: Shenzhen Netxeon Technology CO., LTD
850 description: Guangdong Neweast Optoelectronics CO., LTD
854 description: Next Thing Co.
856 description: Newhaven Display International
858 description: National Instruments
860 description: Nintendo
862 description: NLT Technologies, Ltd.
866 description: Nordic Semiconductor
868 description: NovTech, Inc.
870 description: NutsBoard
872 description: Nuvoton Technology Corporation
874 description: New Vision Display
878 description: NXP Semiconductors
880 description: Oceanic Systems (UK) Ltd.
882 description: Orient Chip Technology Co., Ltd.
884 description: Octavo Systems LLC
886 description: Okaya Electric America, Inc.
888 description: Oki Electric Industry Co., Ltd.
890 description: OLIMEX Ltd.
892 description: One Laptop Per Child
894 description: OnePlus Technology (Shenzhen) Co., Ltd.
896 description: Onion Corporation
898 description: ON Semiconductor Corp.
900 description: On Tat Industrial Company
902 description: Opal Kelly Incorporated
904 description: OpenCores.org
906 description: OpenEmbed
908 description: OpenRISC.io
910 description: Option NV
912 description: Shenzhen Oranth Technology Co., Ltd.
914 description: Oracle Corporation
916 description: Orise Technology
918 description: Ortus Technology Co., Ltd.
920 description: OSD Displays
922 description: Sam Nazarko Trading Ltd. (Open Source Media Centre)
924 description: Ouya Inc.
926 description: Overkiz SAS
928 description: OmniVision Technologies
930 description: Oxford Semiconductor, Ltd.
932 description: OzzMaker
934 description: Panasonic Corporation
936 description: Parade Technologies Inc.
938 description: Parallax Inc.
940 description: Precision Design Associates, Inc.
942 description: Pericom Technology Inc.
944 description: Pervasive Displays, Inc.
946 description: PHICOMM Co., Ltd.
948 description: PHYTEC Messtechnik GmbH
950 description: Picochip Ltd
954 description: Shenzhen PineRiver Designs Co., Ltd.
956 description: PIXCIR MICROELECTRONICS Co., Ltd
958 description: Plantower Co., Ltd
960 description: Plat\'Home Co., Ltd.
964 description: Broadcom Corporation (formerly PLX Technology)
966 description: Plymovent Group BV
968 description: PNI Sensor Corporation
970 description: PocketBook International SA
972 description: Polaroid Corporation
974 description: Portwell Inc.
976 description: Poslab Technology Co., Ltd.
978 description: Point of View International B.V.
980 description: Powertip Tech. Corp.
982 description: PowerVR (deprecated, use img)
984 description: Primux Trading, S.L.
986 description: PROBOX2 (by W2COMP Co., Ltd.)
988 description: Protonic Holland
990 description: PulsedLight, Inc
992 description: Purism, SPC
994 description: Qualcomm Atheros, Inc.
996 description: Qualcomm Technologies, Inc
998 description: QEMU, a generic and open source machine emulator and virtualizer
1000 description: Qi Hardware
1002 description: Chengdu Kaixuan Information Technology Co., Ltd.
1004 description: QiaoDian XianShi Corporation
1006 description: Shenzhen QiShenglong Industrialist Co., Ltd.
1008 description: QNAP Systems, Inc.
1012 description: RaidSonic Technology GmbH
1014 description: Mediatek/Ralink Technology Corp.
1016 description: Ramtron International
1018 description: Raspberry Pi Foundation
1020 description: Raydium Semiconductor Corp.
1022 description: Unisoc Communications, Inc.
1024 description: Realtek Semiconductor Corp.
1026 description: reMarkable AS
1028 description: Renesas Electronics Corporation
1030 description: iMX6 Rex Project
1032 description: Shenzhen Rervision Technology Co., Ltd.
1034 description: Revolution Robotics, Inc. (Revotics)
1036 description: Richtek Technology Corporation
1038 description: Ricoh Co. Ltd.
1040 description: Rikomagic Tech Corp. Ltd
1042 description: RISC-V Foundation
1044 description: Embest RIoT
1046 description: Fuzhou Rockchip Electronics Co., Ltd
1048 description: ROCKTECH DISPLAYS LIMITED
1050 description: ROHM Semiconductor Co., Ltd
1052 description: Ronbo Electronics
1054 description: Shenzhen Roofull Technology Co, Ltd
1056 description: RoseapplePi.org
1058 description: Samsung Semiconductor
1060 description: Samtec/Softing company
1062 description: Sancloud Ltd
1064 description: Sandisk Corporation
1066 description: Satoz International Co., Ltd
1068 description: Smart Battery System
1070 description: Schindler
1072 description: Seagate Technology PLC
1074 description: Seeed Technology Co., Ltd
1076 description: Shenzhen SEI Robotics Co., Ltd
1078 description: Semtech Corporation
1080 description: Senseair AB
1082 description: Sensirion AG
1084 description: Sensortek Technology Corporation
1086 description: Small Form Factor Committee
1088 description: Solomon Goldentek Display Corporation
1090 description: SG Micro Corp
1092 description: SGX Sensortech
1094 description: Sharp Corporation
1096 description: Shimafuji Electric, Inc.
1098 description: Shiratech Solutions
1100 description: Si-En Technology Ltd.
1102 description: Silicon Linux Corporation
1104 description: SiFive, Inc.
1106 description: Sigma Designs, Inc.
1108 description: Seiko Instruments, Inc.
1110 description: Silicon Image
1112 description: Silicon Laboratories
1114 description: Hangzhou Silan Microelectronics Co., Ltd.
1116 description: Silead Inc.
1118 description: Silergy Corp.
1119 "^silex-insight,.*":
1120 description: Silex Insight
1122 description: Siliconfile Technologies lnc.
1124 description: Silicon Mitus, Inc.
1126 description: Siemens AG
1128 description: Cypress Semiconductor Corporation (Simtek Corporation)
1130 description: Sinlinx Electronics Technology Co., LTD
1132 description: SinoVoip Co., Ltd
1134 description: Shenzhen Sipeed Technology Co., Ltd.
1136 description: SiRF Technology, Inc.
1138 description: Silicon Integrated Systems Corp.
1140 description: Sitronix Technology Corporation
1142 description: SKOV A/S
1144 description: Skyworks Solutions, Inc.
1146 description: SmartLabs LLC
1148 description: Standard Microsystems Corporation
1150 description: Synopsys, Inc.
1152 description: Shenzhen SoChip Technology Co., Ltd.
1154 description: Socionext Inc.
1156 description: SolidRun
1158 description: Solomon Systech Limited
1160 description: Sony Corporation
1162 description: Spansion Inc.
1164 description: SparkFun Electronics
1166 description: SpinalHDL
1168 description: Spreadtrum Communications Inc.
1170 description: SSI Computer Corp
1172 description: Silicon Storage Technology, Inc.
1174 description: Xiamen Xingchen(SigmaStar) Technology Co., Ltd.
1175 (formerly part of MStar Semiconductor, Inc.)
1177 description: STMicroelectronics
1179 description: StarFive Technology Co. Ltd.
1181 description: Starry Electronic Technology (ShenZhen) Co., LTD
1183 description: Startek
1185 description: ST-Ericsson
1188 description: ST-Ericsson
1190 description: ST-Ericsson
1193 description: StorLink Semiconductors, Inc.
1195 description: Storm Semiconductor, Inc.
1197 description: Summit microelectronics
1199 description: Shenzhen Sunchip Technology Co., Ltd
1201 description: Sunplus Technology Co., Ltd.
1203 description: Sun Microsystems, Inc
1205 description: Super Micro Computer, Inc.
1207 description: Silvaco, Inc.
1209 description: Sierra Wireless
1211 description: Synaptics Inc.
1213 description: Synology, Inc.
1215 description: Synopsys, Inc. (deprecated, use snps)
1218 description: TBS Technologies
1219 "^tbs-biometrics,.*":
1220 description: Touchless Biometric Systems AG
1222 description: Trusted Computing Group
1224 description: Toby Churchill Ltd.
1226 description: Shenzhen City Tang Cheng Technology Co., Ltd.
1228 description: Shangai Top Display Optoelectronics Co., Ltd
1230 description: TechNexion
1232 description: Technologic Systems
1234 description: Teltonika Networks
1236 description: Tempo Semiconductor
1238 description: Shenzhen Techstar Electronics Co., Ltd.
1240 description: Terasic Inc.
1242 description: Tesla, Inc.
1244 description: Three Five Corp
1246 description: T-Head Semiconductor Co., Ltd.
1248 description: THine Electronics, Inc.
1250 description: thingy.jp
1252 description: Thundercomm Technology Co., Ltd.
1254 description: Texas Instruments
1256 description: Tianma Micro-electronics Co., Ltd.
1258 description: Trusted Logic Mobility
1260 description: Tecon Microprocessor Technologies, LLC.
1264 description: Topic Embedded Systems
1266 description: TPO (deprecated, use tpo)
1269 description: Topwise Communication Co., Ltd.
1271 description: Toradex AG
1273 description: Toshiba Corporation
1277 description: TPK U.S.A. LLC
1279 description: TP-LINK Technologies Co., Ltd.
1283 description: TQ-Systems GmbH
1285 description: Traverse Technologies Australia Pty Ltd
1289 description: Tronsmart
1291 description: Truly Semiconductors Limited
1293 description: Visionox
1294 "^team-source-display,.*":
1295 description: Shenzhen Team Source Display Technology Co., Ltd. (TSD)
1297 description: Theobroma Systems Design und Consulting GmbH
1299 description: Tyan Computer Corporation
1303 description: U-Boot bootloader
1305 description: uCRobotics
1307 description: Ubiquiti Networks
1311 description: Ugoos Industrial Co., Ltd.
1313 description: United Western Technologies Corp (UniWest)
1315 description: uPI Semiconductor Corp.
1317 description: United Radiant Technology Corporation
1319 description: Universal Scientific Industrial Co., Ltd.
1321 description: Aigo Digital Technology Co., Ltd.
1323 description: V3 Semiconductor
1325 description: Vaisala
1327 description: Vamrs Ltd.
1329 description: Variscite Ltd.
1331 description: Van der Laan b.v.
1333 description: Vertexcom Technologies, Inc.
1335 description: VIA Technologies, Inc.
1337 description: Vicor Corporation
1339 description: Videostrong Technology Co., Ltd.
1341 description: Virtual I/O Device Specification, developed by the OASIS consortium
1343 description: Used for virtual device without specific vendor.
1345 description: Vishay Intertechnology, Inc
1347 description: Vitesse Semiconductor Corporation
1349 description: Vivante Corporation
1351 description: Vivax brand by M SAN Grupa d.o.o.
1353 description: VoCore Studio
1355 description: Voipac Technologies s.r.o.
1357 description: Vision Optical Technology Co., Ltd.
1359 description: VXT Ltd
1361 description: Wandbord (Technexion)
1363 description: Waveshare Electronics
1365 description: Western Digital Corp.
1367 description: Würth Elektronik GmbH.
1369 description: Welltech Computer Co., Limited.
1371 description: WeTek Electronics, limited.
1375 description: Shenzhen whwave Electronics, Inc.
1377 description: Wi2Wi, Inc.
1379 description: Wiligear, Ltd.
1381 description: Will Semiconductor Ltd.
1383 description: Winbond Electronics corp.
1385 description: Wingtech Technology Co., Ltd.
1387 description: WinLink Co., Ltd
1389 description: Winstar Display Corp.
1391 description: Wireless Tag (qiming yunduan)
1393 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1395 description: Wolfson Microelectronics
1397 description: Wondermedia Technologies, Inc.
1401 description: Wanchanglong Electronics Technology(SHENZHEN)Co.,Ltd.
1403 description: X-Powers
1405 description: Xen Hypervisor
1407 description: Extreme Engineering Solutions (X-ES)
1409 description: Xiaomi Technology Co., Ltd.
1411 description: Xillybus Ltd.
1413 description: Shenzhen Xingbangda Display Technology Co., Ltd
1415 description: Shenzhen Xinpeng Technology Co., Ltd
1417 description: Xiphera Ltd.
1423 description: Shenzhen Xunlong Software CO.,Limited
1429 description: Yamaha Corporation
1430 "^yes-optoelectronics,.*":
1431 description: Yes Optoelectronics Co.,Ltd.
1433 description: YIC System Co., Ltd.
1435 description: Shenzhen Yangliming Electronic Technology Co., Ltd.
1437 description: YSH & ATIL
1438 "^yones-toptech,.*":
1439 description: Yones Toptech Co., Ltd.
1441 description: Shenzhen Yashi Changhua Intelligent Technology Co., Ltd.
1443 description: Y Soft Corporation a.s.
1447 description: Zarlink Semiconductor
1449 description: ZEITEC Semiconductor Co., LTD.
1451 description: Shenzhen Zidoo Technology Co., Ltd.
1453 description: Zodiac Inflight Innovations
1455 description: Zinitix Co., Ltd
1457 description: Shenzhen Zkmagic Technology Co., Ltd.
1459 description: ZTE Corp.
1461 description: ZyXEL Communications Corp.
1463 # Normal property name match without a comma
1464 # These should catch all node/property names without a prefix
1465 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1466 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1469 additionalProperties: false